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MN101C49H

MN101C49H

  • 厂商:

    PANASONIC

  • 封装:

  • 描述:

    MN101C49H - MN101C49H - Panasonic Semiconductor

  • 数据手册
  • 价格&库存
MN101C49H 数据手册
MN101C49G, MN101C49H, MN101C49K Type Internal ROM type ROM (byte) RAM (byte) Package (Lead-free) 128K 4K MN101C49G MN101C49H Mask ROM 160K 6K MN101C49K MN101CF49K FLASH 224K 10K MN101CP49K EPROM Minimum Instruction Execution Time LQFP100-P-1414, QFP100-P-1818B [Standard] 0.10 µs (at 4.5 V to 5.5 V, 20 MHz) 0.238 µs (at 2.7 V to 5.5 V, 8.39 MHz) 125 µs (at 2.0 V to 5.5 V, 32 kHz)* [Double speed] 0.12 µs (at 4.5 V to 5.5 V, 8.39 MHz) 0.25 µs (at 3.0 V to 5.5 V, 4 MHz) 62.5 µs (at 2.0 V to 5.5 V, 32 kHz)* * The lower limit for operation guarantee for EPROM built-in type is 2.7 V. * The lower limit for operation guarantee for flash memory built-in type is 4.5 V.  Interrupts RESET, Watchdog, External 0 to 5, Timer 0 to 4, Timer 6, Timer 7 (2 systems), Time base, Serial 0 to 3, Automatic transfer finish, A/D conversion finish, Key interrupts (8 lines) Timer counter 0 : 8-bit × 1 (square-wave/8-bit PWM output, event count, generation of remote control carrier, pulse width measurement) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 0 Timer counter 1 : 8-bit × 1 (square-wave output, event count, synchronous output event) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 1 Timer counter 0, 1 can be cascade-connected.  Timer Counter Timer counter 2 : 8-bit × 1 (square-wave/8-bit PWM output, event count, synchronous output event, pulse width measurement) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 2 Timer counter 3 : 8-bit × 1 (square-wave output, event count, generation of remote control carrier) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 3 Timer counter 2, 3 can be cascade-connected. Timer counter 4 : 8-bit × 1 (square-wave/8-bit PWM output, event count, pulse width measurement, serial 1 baud rate timer) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; 1/1 of external clock input frequency Interrupt source ........... coincidence with compare register 4 Timer counter 6 : 8-bit freerun timer Clock source................ 1/1 of system clock frequency; 1/1, 1/4096, 1/8192 of OSC oscillation clock frequency; 1/1, 1/4096, 1/8192 of XI oscillation clock frequency Interrupt source ........... coincidence with compare register 6 MAD00011HEM MN101C49G, MN101C49H, MN101C49K Timer counter 7 : 16-bit × 1 (square-wave/16-bit PWM output, cycle / duty continuous variable, event count, synchronous output evevt, pulse width measurement, input capture) Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ........... coincidence with compare register 7 (2 lines) Time base timer (one-minute count setting) Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768 of clock source frequency Watchdog timer Interrupt source ........... 1/65536, 1/262144, 1/1048576 of system clock frequency  Serial interface Serial 0 : synchronous type/UART (full-duplex) × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2, 4; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency Serial 1 : synchronous type/simple UART (half-duplex) × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 4; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency Serial 2 : synchronous type × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency Serial 3 : synchronous type/single-master I²C × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency  DMA controller Max. Transfer cycles : 255 Starting factor : external request, various types of interrupt, software Transfer mode : 1-byte transfer, word transfer, burst transfer  I/O Pins I/O Input 73 (72) 15 (14) Common use , Specified pull-up resistor available, Input/output selectable (bit unit) ( ) : Flash memory built-in type. Common use , Specified pull-up resistor available ( ) : Flash memory built-in type.  A/D converter  D/A converter 8-bit × 4-ch. 10-bit × 8-ch. (with S/H)  Special Ports Buzzer output, remote control carrier signal output, high-current drive port Correcting address designation : up to 3 addresses possible  ROM Correction MAD00011HEM  Electrical Charactreistics (Supply current) Parameter Symbol IDD1 Operating supply current IDD2 IDD3 Supply current at HALT Supply current at STOP Supply current at STOP IDD4 IDD5 IDD6 IDD7 Condition fosc = 20 MHz , VDD = 5 V fosc = 8.39 MHz , VDD = 5 V fx = 32.768 kHz , VDD = 3 V fx = 32 kHz , VDD = 3 V (5 V), Ta = 25°C fx = 32.768 kHz , VDD = 3 V (5 V) , Ta = 85°C VDD = 5 V , Ta = 25°C VDD = 5 V , Ta = 85°C ( Limit min typ 30 15 40 max 70 30 120 30 (90) 3 60 Unit mA mA µA µA µA µA µA 5 (13) 11 (30) ) : Flash memory built-in type  Development tools In-circuit Emulator PX-ICE101C/D+PX-PRB101C49-QFP100-P-1818B PX-ICE101C/D+PX-PRB101C49-LQFP100-P-1414  Pin Assignment P74, A12 P73, A11 P72, A10 P71, A9 P70, A8 P67, A7 P66, A6 P65, A5 P64, A4 P63, A3 P62, A2 P61, A1 P60, A0 P54, A17 P53, A16 P52, NCS P51, NRE P50, NWE P47, KEY7 P46, KEY6 P45, KEY5 P44, KEY4 P43, KEY3 P42, KEY2 P41, KEY1 A13, P75 A14, P76 A15, P77 D0, LED0, P80 D1, LED1, P81 D2, LED2, P82 D3, LED3, P83 D4, LED4, P84 D5, LED5, P85 D6, LED6, P86 D7, LED7, P87 SDO0, PD0 SDO1, PD1 SDO2, PD2 SDO3, PD3 SDO4, PD4 SDO5, PD5 SDO6, PD6 SDO7, PD7 DAVSS DA0, PC0 DA1, PC1 DA2, PC2 DA3, PC3 DAVDD 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 MN101C49G MN101C49H MN101C49K 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P40, KEY0 P37, NDKDMA P36, NSTDMA P35, NLDDMA, SCL, SBT3 P34, NBT, SBI3 P33, NBR, SDA, SBO3 P32, SBT1 P31, RXD1, SBI1 P30, TXD1, SBO1 P17(VPP) P16, TM4IO P15 P14, TM7IO P13, TM3IO P12, TM2IO P11, TM1IO P10, TM0IO, RMOUT P27, NRST P26(VDD2) P25, IRQ5 P24, IRQ4 P23, IRQ3 P22, IRQ2 P21, IRQ1, SENS P20, IRQ0 VREFAN0, PA0 AN1, PA1 AN2, PA2 AN3, PA3 AN4, PA4 AN5, PA5 AN6, PA6 AN7, PA7 VREF+ VDD OSC2 OSC1 VSS XI XO MMOD SBO0, P00 SBI0, P01 SBT0, P02 SBO2, P03 SBI2, P04 SBT2, P05 NDK, BUZZER, P06 SYSCLK, P07 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 QFP100-P-1818B LQFP100-P-1414 Note) ( ): Flash memory built-in type. MAD00011HEM Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Industrial Co., Ltd.
MN101C49H 价格&库存

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