MN101C97A, MN101C97D
Type Internal ROM type ROM (byte) RAM (byte) Package (Lead-free) Minimum Instruction Execution Time 32K 1K QFN044-P-0606A (Under planning), QFP044-P-1010F (Under planning), TQFP048-P-0707B 0.25 µs (at 2.2 V to 3.6 V, 8 MHz) 0.5 µs (at 1.8 V to 3.6 V, 4 MHz)* 62.5 µs (at 1.8 V to 3.6 V, 32 kHz)* * The lower limit for operation guarantee for flash memory built-in type is 2.0 V. MN101C97A Mask ROM 64K MN101C97D MN101CF97D FLASH
Interrupts
RESET, Watchdog, External 0 to 5, External 6 (key interrupt dedicated), Timer 0 to 3, Timer 6, Timer 7 (2 systems), Time base, Serial 0 (2 systems), Serial 3, A/D conversion finish Timer counter 0 : 8-bit × 1 (square-wave/8-bit PWM output, event count, generation of remote control carrier, simple pulse width measurement, added pluse (2-bit) system PWM output) (square-wave/PWM output to large current terminal P51 possible) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 0 Timer counter 1 : 8-bit × 1 (square-wave output, event count, synchronous output event, serial transfer clock output) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 1 Timer counter 0, 1 can be cascade-connected. Timer counter 2 : 8-bit × 1 (square-wave output, added pluse (2-bit) system PWM output, PWM output, serial transfer clock output, event count, synchronous output event, simple pulse width measurement) (square-wave/PWM output to large current terminal P52 possible) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 2 Timer counter 3 : 8-bit × 1 (square-wave output, event count, generation of remote control carrier, serial transfer clock output) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 3 Timer counter 2, 3 can be cascade-connected. Timer counter 6 : 8-bit freerun timer Clock source................ 1/1 of system clock frequency; 1/1, 1/128, 1/8192 of OSC oscillation clock frequency; 1/1, 1/128, 1/8192 of XI oscillation clock frequency Interrupt source ........... coincidence with compare register 6 Timer counter 7 : 16-bit × 1 (square-wave output, 16-bit PWM output (cycle / duty continuous variable), event count, synchronous output event, pulse width measurement, input capture, real time output control, high performance IGBT output) (square-wave/PWM output to large current terminal P53 possible) Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ........... coincidence with compare register 7 (2 lines), input capture register
Timer Counter
MAD00058BEM
MN101C97A, MN101C97D
Timer counters 7, 8 can be cascade-connected. (square-wave output, PWM input capture, pluse width measurement is possible as a 32-bit timer.) Time base timer (one-minute count setting) Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/4096, 1/8192, 1/16384, 1/32768, of clock source frequency Watchdog timer Interrupt source ........... 1/65536, 1/262144, 1/1048576 of system clock frequency
Serial interface
Serial 0 : synchronous type/UART (full-duplex) × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 1 or 2; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency, external clock Serial 3 : synchronous type/single-master I²C × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency, external clock
I/O Pins
I/O 38 Common use , Specified pull-up resistor available, Input/output selectable (bit unit)
A/D converter Special Ports
10-bit × 8-ch. (with S/H) Buzzer output, remote control carrier signal output, high-current drive port Correcting address designation : up to 3 addresses possible
ROM Correction
Electrical Charactreistics (Supply current)
Parameter Operating supply current Supply current at HALT Supply current at STOP Symbol IDD1 IDD2 IDD3 IDD4 IDD5 IDD6 Condition fosc = 4 MHz, VDD = 3 V fx = 32 kHz, VDD = 3 V fx = 32 kHz , VDD = 3 V, Ta = 25°C fx = 32 kHz , VDD = 3 V , Ta = –40°C to +85°C VDD = 3 V , Ta = 25°C VDD = 3 V , Ta = –40°C to +85°C Limit min typ 0.9 4 2.6 max 1.7 24 5 20 2 15 Unit mA µA µA µA µA µA
Development tools
In-circuit Emulator PX-ICE101C/D+PX-PRB101C97-TQFP048-P-0707B-M PX-ICE101C/D+PX-PRB101C97-QFP044-P-1010 (under planning)
MAD00058BEM
Pin Assignment
P11, TXD0A, SBO0A 26 P25, IRQ5, CLKOUT P10, RXD0A, SBI0A 25 24 23 22 21 20 19 18 17 16 15 14 13 10 12 11 1 2 3 4 5 6 7 8 9 P31, KEY1, TM1IO P30, KEY0, TM0IO P12, SBT0A 27
P24, IRQ4
P23, IRQ3
P22, IRQ2
P21, IRQ1 30
P20, IRQ0 29
36
35
34
33
32
31
P32, KEY2, TM2IO P33, KEY3, TM3IO P34, KEY4, TM7IO P35, KEY5, NBUZZER P36, KEY6, BUZZER P37, KEY7 P40, SBI3 P41, SBO3, SDA3 P42, SBT3, SCL3 P43, RXD0B, SBI0B P44, , TXD0B, SBO0B P45, SBT0B
37 38 39 40 41 42 43 44 45 46 47 48
28
P13
AN7, P07 AN6, P06 AN5, P05 AN4, P04 AN3, P03 AN2, P02 AN1, P01 AN0, P00 VREF+ LED4, P54 TM7O, LED3, P53 TM2O, LED2, P52
MN101C97A MN101C97D
LED5, P55
XI
TQFP048-P-0707B QFP044-P-1010F QFN044-P-0606A
RMOUT, LED0, P50
TM0O, LED1, P51
OSC1
OSC2
VDD
XO
NRST, P27
MMOD
DMOD
VSS
MAD00058BEM
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(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Industrial Co., Ltd.