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UNHZ201

UNHZ201

  • 厂商:

    PANASONIC

  • 封装:

  • 描述:

    UNHZ201 - Circuit Protector Elements - Panasonic Semiconductor

  • 数据手册
  • 价格&库存
UNHZ201 数据手册
Circuit Protector Elements UNHZ201 Circuit Protector Elements Unit: mm For overcurrent protection ■ Features • Sharp cutoff characteristics and low voltage drop • Flame retardant package and low heat generation, high density mounting is possible. 1.25±0.1 0.35±0.1 0.7±0.1 1 0 to 0.1 1.7±0.1 2.5±0.2 0.16+0.1 –0.06 ■ Absolute Maximum Ratings Ta = 25°C Parameter Operating ambient temperature Storage temperature Symbol Topr Tstg Rating −55 to +125 −55 to +125 Unit °C °C 5˚ 0 to 0.1 ■ Electrical Characteristics Ta = 25°C ± 3°C Parameter Rated voltage Rated current Internal Resistance Cutoff current * 70 Min Typ 50 0.7 93 1.4 116 Max Unit V A mΩ A SMini2-F1 Package Marking Symbol: H1 Lead Connection 1 Note) *: Measurement condition of cutoff current shall be at Ta = 25°C, t = 1 s Tolerance of cutoff current shall be ± 20% 2 ■ Usage Notes • Package shall be overheated and dangerous for overcurrent. • This device should be used only to the secondary circuit. Package will be damaged for added overpower. • This device is not electrical fuse legally. Please draw a clear line between electrical fuse from this device. (0.15) 0.4±0.1 2 0.5±0.1 5˚ Publication date: March 2003 SQB00034AED 1 UNHZ201 Cutoff current ratio  Ta 1.1 104 I2t  t Ta = 25°C 1.0 103 Limit line of real ability by pulse Cutoff current ratio 0.9 I2t (A2 • ms) Cutoff line of real ability by pulse 102 Recommendable limit line by pulse 10 0.8 0.7 0.6 −25 0 25 50 75 100 125 150 1 1 10 102 103 Ambient temperature Ta (°C) t (ms) Cutoff current characteristics 1 Ta = 25°C Cutoff time t (s) 10−1 10−2 −20% +20% 10−3 0 2 4 6 Cutoff current (A) 2 SQB00034AED Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL
UNHZ201 价格&库存

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