2N7002DW
60V N-Channel Enhancement Mode MOSFET
FEATURES
• RDS(ON), VGS@10V,IDS@500mA=5Ω • RDS(ON), VGS@4.5V,IDS@75mA=7.5Ω • Advanced Trench Process Technology • High Density Cell Design For Ultra Low On-Resistance • Specially Designed for Battery Operated Systems, Solid-State Relays Drivers : Relays, Displays, Lamps, Solenoids, Memories, etc. • In compliance with EU RoHS 2002/95/EC directives
MECHANICALDATA
• Case: SOT-363 Package • Terminals : Solderable per MIL-STD-750,Method 2026 • Marking : 702
Maximum RATINGS and Thermal Characteristics (TA=25OC unless otherwise noted )
PA RA M E TE R D r a i n- S o ur c e Vo l t a g e G a t e - S o ur c e Vo l t a g e C o nt i nuo us D r a i n C ur r e nt P ul s e d D r a i n C ur r e nt
1)
S ym b o l VD S VGS ID ID M TA = 2 5 C TA = 7 5 O C
O
Li mi t 60 +20 11 5 800 200 120 -5 5 to + 1 5 0 625
U ni t s V V mA mA mW
O
M a xi m um P o w e r D i s s i p a t i o n O p e r a t i n g J u n c t i o n a n d S t o r a g e Te m p e r a t u r e R a n g e Juncti on-to Ambi ent Thermal Resi stance(PC B mounted)2
PD TJ , TS T G RθJ A
C
O
C /W
Note: 1. Maximum DC current limited by the package 2. Surface mounted on FR4 board, t < 10 sec PAN JIT RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE
STAD-JUL.26.2007
PAGE . 1
2N7002DW
ELECTRICALCHARACTERISTICS
P a ra me te r S ta ti c D r a i n- S o ur c e B r e a k d o w n Vo l t a g e G a t e Thr e s ho l d Vo l t a g e D r a i n- S o ur c e O n- S t a t e R e s i s t a nc e D r a i n- S o ur c e O n- S t a t e R e s i s t a nc e Ze r o G a t e Vo l t a g e D r a i n C ur r e nt Gate Body Leakage Forward Transconductance Dynamic To t a l G a t e C h a r g e G a t e - S o ur c e C ha r g e G a t e - D r a i n C ha r g e Tu r n - O n D e l a y Ti m e Tu r n - O f f D e l a y Ti m e In p u t C a p a c i t a n c e O ut p ut C a p a c i t a nc e R e v e r s e Tr a n s f e r C a p a c i t a n c e S o ur c e - D r a i n D i o d e M a x. D i o d e F o r w a r d C ur r e nt D i o d e F o rwa rd Vo lta g e Is VSD IS = 2 5 0 m A , V G S = 0 V 0 .9 3 250 1 .2 mA V Qg Qg s Qg d to n to ff Ciss Coss C rs s V D S =2 5 V, V G S =0 V f=1 .0 MHZ VD D =10V , RL =20Ω ID =500mA , VG E N =10V RG =10Ω V D S = 1 5 V , ID = 5 0 0 m A VG S =4.5V 0 .6 0 .1 0 .0 8 9 21 0 .7 15 ns 26 50 25 5 pF nC BVD SS V G S (th) RD S (o n) RD S (o n) ID S S IG S S g fS V G S = 0 V , ID = 1 0 u A V D S = V G S , ID = 2 5 0 u A VG S =4.5V, I D =75mA VG S =10V, I D =500mA VD S =60V, VG S =0V V G S =+ 2 0 V , V D S = 0 V V D S = 1 5 V , ID = 2 5 0 m A 60 1 200 2 .5 7 .5 Ω 5 1 +100 uA nA mS V V S ym b o l Te s t C o n d i t i o n M i n. Ty p . M a x. U ni t s
Switching Test Circuit
V IN
V DD
RL
Gate Charge Test Circuit
V GS
V DD
RL
V OUT
RG
1mA
RG
STAD-JUL.26.2007
PAGE . 2
2N7002DW
Typical Characteristics Curves (TA=25 C,unless otherwise noted)
O
I D - Drain Source Current (A)
1.2
ID - Drain-to-Source Current (A)
1.2 1 0.8 0.6 0.4 0.2 0 0
V GS = 10V ~ 6.0V
5.0V
4.0V
V DS=10V
1
0.8 0.6 0.4 0.2 0 0 1 2 3
3.0V
T J=25 OC
4
5
1
2
3
4
5
6
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Fig. 1-TYPICAL FORWARD CHARACTERISTIC FIG.1- Output Characteristic
FIG.2- Transfer Characteristic
10
5
I D=500mA
R DS(ON) - On-Resistance ( W )
R DS(ON) - On-Resistance ( W )
4 3 2
8 6
V GS=4.5V
V GS=10V
4 2
T J=125 OC
1 0
T J=25 OC
2 3 4 5 6 7 8 9 10
0
0
0.2
0.4
0.6
0.8
1
1.2
ID - Drain Current (A)
V GS - Gate-to-Source Voltage (V)
FIG.3- On Resistance vs Drain Current
FIG.4- On Resistance vs Gate to Source Voltage
RDS(ON) - On-Resistance(Normalized)
2 1.8 1.6 1.4 1.2 1 0.8 0.6
V GS=10V I D=500mA
0.4 -50
-25
0
25
50
75
100
o
125
150
TJ - Junction Temperature ( C)
FIG.5- On Resistance vs Junction Temperature
STAD-JUL.26.2007 PAGE . 3
2N7002DW
10
Vgs
Qg
V GS - Gate-to-Source Voltage (V)
8 6 4 2 0
V DS=15V I D=500mA
Vgs(th)
Qsw
Qg(th)
Qgs Qgd
0
0.2
0.4
0.6
0.8
1
Qg
Qg - Gate Charge (nC)
Fig.6 - Gate Charge Waveform
Vth - G-S Threshold Voltage (NORMALIZED)
Fig.7 - Gate Charge
BVDSS - Breakdown Voltage (V)
1.2 1.1 1 0.9 0.8 0.7 0.6 -50
I D=250uA
73 72 71 70 69 68 67 66 65
I D=250uA
-25
0
25
50
75
100 125
150
64 -50
-25
0
25
50
75
100
125
150
TJ - Junction Temperature (o C)
TJ - Junction Temperature (o C)
Fig.8 - Threshold Voltage vs Temperature
10
IS - Source Current (A)
Fig.9 - Breakdown Voltage vs Junction Temperature
V GS=0V
1
T J=25 OC
T J=125 OC
0.1
T J=-55 OC
0.01 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
VSD - Source-to-Drain Voltage (V)
Fig.10 - Source-Drain Diode Forward Voltage
STAD-JUL.26.2007 PAGE . 4
2N7002DW
MOUNTING PAD LAYOUT
ORDER INFORMATION
• Packing information T/R - 10K per 13" plastic Reel T/R - 3K per 7” plastic Reel
LEGAL STATEMENT Copyright PanJit International, Inc 2007
The information presented in this document is believed to be accurate and reliable. The specifications and information herein are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit does not convey any license under its patent rights or rights of others.
STAD-JUL.26.2007
PAGE . 5
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