BZX784B5V6
SURFACE MOUNT SILICON ZENER DIODES
FEATURES
• Planar Die construction • 200mW Power Dissipation • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
• Case: SOD-723, Molded Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Polarity: See Diagram Below • Approx. Weight: 0.00077 gram • Mounting Position: Any
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter Maximum Power Dissipation (Notes A) at 25OC Operating Junction and StorageTemperature Range
Symbol
Value 200 -55 to +150
Units mW
O
PD TJ
C
ELECTRICAL CHARACTERISTICS
Nominal Zener Voltage Part Number Nom. V BZX784B5V6 5.6 VZ @ I ZT Min. V 5.49 Max. V 5.71 Ω 40
Max. Zener Impedance ZZT @ I ZT mA 5.0 Ω 400 ZZK @ I ZK mA 1.00
Max. Reverse Leakage Current I R @ VR µA 1.0 V 2.0
Marking C ode
WA
NOTES: A. Mounted on 5.0mm2(.013mm thick) land areas.
REV.0.1-OCT.30.2008
PAGE . 1
BZX784B5V6
TEMPERATURE COEFFICIENT,(mA/ OC)
100
0.6
POWER DISSIPATION, Watts
0.5 0.4 0.3
T A =25 OC
10
0.2 0.1 0
0
25
50
75
100
125
150
1 10
100
TEMPERATURE ( OC)
NOMINAL ZENER VOLTAGE,VOLTS
Fig.1 STEADY STATE POWER DERATING
Fig.2 TEMPERATURE COEFFICENTS
1000
1000
LEAKAGE CURRENT,uA
10 1 0.1 0.01 0.001 0.0001 0.00001 0 10 20 30 40 50 60 70
FORWARD CURRENT,mA
100
100
+150 C
O
+25 C -55 C
80 90
O
O
10
150OC
O
75 C
25OC
5OC
1 0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
NORMAL ZENER VOLTAGE, VOLTS
FORWARD VOLTAGE, VOLTS
Fig.3 TYPICAL LEAKAGE CURRENT
Fig.4 TYPICAL FORWARD VOLTAGE
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BZX784B5V6
MOUNTING PAD LAYOUT
ORDER INFORMATION
• Packing information T/R - 8K per 7" plastic Reel
LEGAL STATEMENT Copyright PanJit International, Inc 2009
The information presented in this document is believed to be accurate and reliable. The specifications and information herein are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit does not convey any license under its patent rights or rights of others.
REV.0.1-OCT.30.2008
PAGE . 3
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