ES1002FL

ES1001FL~ES1002FL SMALL SURFACE MOUNT ULTRAFAST DIODES VOLTAGE FEATURES • For surface mounted applications • Low profile package • Ideal for automated placement • Glass Passivated • High temperature soldering : 26OC / 10 seconds at terminals • Pb free product : 99% Sn above can meet RoHS environment substance directive request 100 to 200 Volts CURRENT 1.0 Amperes MECHANICAL DATA • Case: JEDEC DO-219AB, Molded plastic over passivated junction. • Terminals: Solderable per MIL-STD-750, Method 2026 • Polarity : Color band denotes positive end (cathode) • Standard Packaging : 8mm tape (EIA-481) • Approx. Weight: 0.0168 gram MAXIMUM RATINGS Ratings at 25°C ambient temperature unless otherwise specified. PARAMETER Maxi mum repeti tve peak reverse voltage Maxi mum RMS voltage Maxi mum D C blocki ng voltage Maxi mum average forward recti fi ed current Peak forward surge current 8.3ms si ngle half si newave Operati ng juncti on and storage temperature range Ttp=105OC TA=65OC TL=25OC Test condi ti on Symbol VRRM VRMS VDC IF(AV) E S 1001F L 100 70 100 1.2 0.5 16.5 -50 to +150 E S 1002F L 200 140 200 UNITS V V V A IFSM TJ ,TSTG A OC ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. PARAMETER Maxi mum i nstantaneous forward voltage Maxi mum D C reverse current at rated D C blocki ng voltage Test condi ti on 1.0A TA=25OC TA=100OC IF=0.5A IR=1A trr=0.25A 4V,1MHz Symbol VF E S 1001F L 0.95 10 50 E S 1002F L UNITS V IR uA Reverse recovery ti me trr CJ 35 ns Typi cal capaci tance 4 pF STAD-NOV.30.2005 PAGE . 1 ES1001FL~ES1002FL THERMAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. PARAMETER Thermal resistance junction to ambient air Test condition Symbol R ϑJA E S 1001F L 180 E S 1002F L UNITS O C/W RATING AND CHARACTERISTIC CURVES 10 7 6 f=1MHz 1 I F[A] C D[ PF] Typical@25 C O Typical@150 C O Typical@100 C O 5 4 3 0.1 0.01 2 1 0.001 0 0.20 0.40 0.60 0.80 V F[V] 1.00 1.20 1.40 0 0.1 1 V R[V] 10 100 Fig.1-Typical forward characteristics Fig.3-Typ. diode capacitance vs. Reverse voltage 1000 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 T J = 2 5 OC T J = 5 0 OC T J = 7 5 OC T J = 1 0 0 OC T J = 1 2 5 OC T J = 1 5 0 OC T J = 0 OC T J = 5 0 OC Average forward current [A] 100 I R [ mA] 10 1 0.1 Ambient temperature tie point temperature 0.01 0 0 25 50 75 100 O 20 40 60 80 100 125 150 Temperature (Ambient or Tie)[ C] Percent of peak reverse voltage,% Fig.2-Forward current derating curve Fig.4-Typical reverse characteristics STAD-NOV.30.2005 PAGE . 2 E S1001FL~ES1002FL MOUNTING PAD LAYOUT ORDER INFORMATION • Packing information T/R - 1 0 K per 13" plastic Reel T/R - 3K per 7" plastic Reel LEGAL STATEMENT Copyright PanJit International, Inc 2005 The information presented in this document is believed to be accurate and reliable. The specifications and information herein are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit does not convey any license under its patent rights or rights of others. STAD-NOV.30.2005 PAGE . 3