MMBD6050_09

MMBD6050_09

  • 厂商:

    PANJIT(强茂)

  • 封装:

  • 描述:

    MMBD6050_09 - SURFACE MOUNT SWITCHING DIODES - Pan Jit International Inc.

  • 详情介绍
  • 数据手册
  • 价格&库存
MMBD6050_09 数据手册
MMBD6050 SURFACE MOUNT SWITCHING DIODES VOLTAGE FEATURES • • • • Very fast reverse recovery ( trr < 2.0 ns typical ) Low capacitance ( < 2.5pF @ 0V ) Surface mount package ideally suited for automatic insertion. In compliance with EU RoHS 2002/95/EC directives 80 Volts POWER 225 mWatts MECHANICAL DATA Case: SOT-23 plastic Terminals : Solderable per MIL-STD-750,Method 2026 Approx weight : 0.008 gram Marking : T2 ABSOLUTE RATINGS PARAMETER Maximum Reverse Voltage Peak Reverse Voltage Continuous Forward Current Non-repetitive Peak Forward Surge Current at t=1.0 µs SYMBOL VALUE 80 80 0.2 4.0 UNITS V V A A VR VRRM IF I FSM THERMAL CHARACTERISTICS PARAMETER Power Dissipation (1 ) SYMBOL VALUE 225 556 -50 to 150 -50 to 150 UNITS mW O PTOT (1 ) Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature RΘJA TJ TSTG C/W O C C O SINGLE NOTE: 1. FR-4 Board=70 x 60 x 1mm. REV.0.1-FEB.10.2009 PAGE . 1 MMBD6050 ELECTRICAL CHARACTERISTICS (T =25 C , unless otherwise noted) J O PARAMETER Reverse Breakdown Voltage Reverse Current Forward Voltage Total Capacitance Reverse Recovery Time (Figure 1) SYMBOL TEST CONDITIONS IR=100µA VR=50V IF=1mA IF=100mA VR=0V, f =1MHz IF=IR=10mA, RL=100 Ω MIN. 80 − 0.55 0.85 - TYP. - MAX. 100 0.7 1.1 2.5 4.0 UNITS V nA V pF ns VBR IR VF CT trr REV.0.1-FEB.10.2009 PAGE . 2 ELECTRICAL CHARACTERISTIC CURVES 10.000 TJ = 150 ° C Reverse Leakage Current, I R (uA) 100 TJ = 150 °C Forward Current, IF (mA) 1.000 10 TJ = 25 °C TJ = 75 °C 1 0.100 TJ = 75 ° C 0.010 TJ = 25 °C TJ = -25 °C 0.001 0 20 40 Reverse Voltage, VR ( V) 60 80 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Forward Voltage, VF (V) Fig. 2. Reverse Current vs. Reverse Voltage Fig. 3. Forward Current vs. Forward Voltage 2.5 2 Capacitance (pF) 1.5 1 0.5 0 0 10 20 30 40 50 60 70 80 Reverse Voltage, VR (V) Fig. 4. Capacitance vs. Reverse Voltage REV.0.1-FEB.10.2009 PAGE . 3 MMBD6050 MOUNTING PAD LAYOUT ORDER INFORMATION • Packing information T/R - 12K per 13" plastic Reel T/R - 3K per 7” plastic Reel LEGAL STATEMENT Copyright PanJit International, Inc 2009 The information presented in this document is believed to be accurate and reliable. The specifications and information herein are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit does not convey any license under its patent rights or rights of others. REV.0.1-FEB.10.2009 PAGE . 4
MMBD6050_09
文档中的物料型号是MSP430系列的微控制器,具体型号为MSP430F149。

器件简介包括它是一款16位超低功耗的混合信号处理器,适用于广泛的嵌入式应用。

引脚分配方面,该芯片有44个引脚,包括VCC、GND、XIN、XOUT、RST/NMI等。

参数特性包括工作电压范围1.8V至3.6V,最大工作频率16MHz,具有丰富的外设接口和低功耗模式。

功能详解中提到了其具备ADC、DAC、PWM、UART等外设功能,支持多种通信协议。

应用信息表明它适用于工业控制、医疗仪器、便携式设备等领域。

封装信息显示该芯片采用PWQFN44封装。
MMBD6050_09 价格&库存

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