RS1001FL~RS1008FL
SMALL SURFACE MOUNT FAST DIODES VOLTAGE FEATURES
• • • • • • For surface mounted applications Low profile package Ideal for automated placement Glass Passivated Chip Junction High temperature soldering : 260 O C / 10 seconds at terminals Pb free product : 99% Sn above can meet RoHS environment substance directive request
100 to 800 Volts
CURRENT
1.0 Amperes
MECHANICAL DATA
• Case: JEDEC DO-219AB,Molded plastic over passivated junction • Terminals: Solderable per MIL-STD-750, Method 2026 • Standard Packaging : 8mm tape (EIA-481) • Approx. Weight: 0.0168 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%
Rating Maximum repetitve peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current
Test condition
Symbol VR R M VR M S VD C
RS1001FL 100 70 100
RS1002FL 200 140 200
RS1004FL 400 280 400 1.4 0.5 1.15 10 50 180
RS1006FL 600 420 600
RS1008FL 800 560 800
Units V V V A
Ttp =65O C TA =45O C 0.7A TA =25O C TA =125O C
IF (A V )
Maximum instantaneous forward voltage Maximum DC reverse current at rated DC blocking voltage Thermal resistance junction to ambient air
VF
V
IR
µA
R ϑJA
K/W
Operating junction and storage temperature range IF =0.5A IR =1A trr=0.25A 4V,1MHz
TJ ,TS T G
-50 TO + 150
O
C
Reverse recovery time
trr CJ
150
250
500
nS
Typical capacitance
9
pF
STAD-NOV.24.2005
PAGE . 1
RS1001FL~RS1008FL
10
35 30
RS1001FL~RS1002FL RS1004FL RS1006FL~RS1008FL
1
I F[A]
Typical@25 C RS1002FL O Typical@150 C RS1002FL O Typical@25 C RS1004FL O Typical@ 150 C RS1004FL Typical@25 OC RS1008FL O Typical@ 150 C RS1008FL
O
25
C D[ PF]
20 15 10 5
0.1
0.01
0.001 0 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 V F[V]
0 0.1
1 V R[V]
10
100
Fig.1-Typical forward characteristics
Fig.3-Typ. diode capacitance vs. Reverse voltage
1.6 1.4
Average forward current [A]
1.2 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100
O
Ambient temperature tie point temperature
125
150
Temperature (Ambient or Tie)[ C]
Fig.2-Forward current derating curve
STAD-NOV.24.2005
PAGE . 2
R S1001FL~RS1008FL
MOUNTING PAD LAYOUT
ORDER INFORMATION
• Packing information T/R - 10K per 13" plastic Reel T/R - 3K per 7" plastic Reel
LEGAL STATEMENT
Copyright PanJit International, Inc 2005
The information presented in this document is believed to be accurate and reliable. The specifications and information herein are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit does not convey any license under its patent rights or rights of others.
STAD-NOV.24.2005
PAGE . 3
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