L-H339005B-HTS

PARA LIGHT ELECTRONICS CO., LTD. T 11F., No. 8, Jiankang Rd., Zhonghe Dist., New Taipei City 235, Taiwan, Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 E-mail: para@para.com.tw www.paralighttaiwan.com L-H339005B-HTS PA RA PART NO. : LI GH DATA SHEET REV : A/1 CUSTOMER’S APPROVAL : _______________ DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 DCC : ____________ Page : 1 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 RA LI GH T PACKAGE DIMENSIONS Note: PA 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice 6. A=B=C= LGR3G128 DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page : 2 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 FEATURES ABSOLUTE MAXIMUM RATING : ( Ta = 25C ) PARAMETER Green UNIT 78 mW 5 V 30 mA GH SYMBOL T * 3.0mm DIA LED LAMP * LOW POWER CONSUMPTION. * I.C. COMPATIBLE. * LONG LIFE SOLID STATE RELIABILITY. * PB FREE PRODUCTS(Compliant with EU’s RoHS.) CHIP MATERIALS * Dice Material :GaP/GaP * Light Color :Green * Lens Color :Green Diffused Power Dissipation VR Reverse Voltage IF Average Forward Current IPF Peak Forward Current Per Chip (Duty=0.1,1KHz) 120 mA － Derating Linear From 25C 0.3 mA/C LI PAD Operating Temperature Range -25C to 85C Tstg Storage Temperature Range -40C to 85C RA Topr SYMBOL PA ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25C ) DESCRIPTION TEST MIN. TYP. MAX. UNIT 1.8 2.1 2.6 V 100 μA 574 nm Vf Forward Voltage IF=20mA IR Reverse Current VR=5 V D Dominant Wavelength IF=20mA △ Spectral Line Half-Width IF=20mA 30 nm 2θ1/2 Half Intensity Angle IF=20mA 60 deg Iv Luminous Intensity IF= 20mA DRAWING NO. : DS-60-09-0055 566 15.1 DATE :2021-09-14 568 30 80.9 mcd Page : 3 3.0 mm LED LAMP WITH LA73B-1A/B REV:A / 1 PA RA LI GH T L-H339005B-HTS HOLDER DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page : 4 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 Label Explanation PARA NO. : Refer to p13 NO. : E L 4 7 A B C D A---E: For series number B---L: Local F: Foreign C---L: LAMP D---Year E---Month F---SPEC. E 0009 F PA RA L LI LOT GH T 光鼎电子股份有限公司 N’W : Net Weight DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page : 5 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 SOLDERING METHOD SOLDERING CONDITIONS REMARK  Solder no closer than 3mm from the base of the package  Using soldering flux,” RESIN FLUX” is recommended. Attached data of temperatuare cure for your reference  During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 300℃ or lower (To prevent heat from being IRON transferred directly to the lead, hold Soldering time: within 3 sec. the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip.  Bath temperature: 260℃ Immersion time: with 5 sec, 1 time LI GH T DIP SOLDERING RA s e i r w d a e L l e n a P (Fig.1) s e i r w d a e L PA 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.  te hc gn ia lr sa e al c e v a e L (Fig.2) Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin & copper and sliver is proposed with the temperature of Celsius 260. The proportion of the alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3 seconds. DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page : 6 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). d r a o b C P  （Fig.3 ） jig GH T 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. LI  STORAGE PA RA 1) The LEDs should be stored at 30℃ or less and 70% RH or less after being shipped from PARA and the storage life limits are 3 months . 2) PARA LED lead frames are comprised of a stannum plated iron alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page : 7 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 LED MOUNTING METHOD 3) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) case LI GH T pc board Fig.4 PA RA 4) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. Tube Stand-off Fig.5 DRAWING NO. : DS-60-09-0055 Fig.6 DATE :2021-09-14 Page : 8 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 FORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) m m 2 7 . g i F LEAD STRENGTH RA LI GH T 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) PA 1) Bend strength Do not bend the lead more than twice. (Fig.9) Fig.9 DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page :9 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) OK！ 1Kg Fig.10  HEAT GENERATION CHEMICAL RESISTANCE LI GH T 1) Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. The operating current should be decided after considering the ambient maximum temperature of LEDs. PA RA 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY NOTE: Influences of ultrasonic cleaning of the LED Freon TE ⊙ Chlorothene ╳ resin body differ depending on such factors Isopropyl Alcohol ⊙ as the oscillator output, size of the PC board Thinner ╳ and the way in which the LED is mounted. Acetone ╳ Therefore, ultrasonic cleaning should only be Trichloroethylene ╳ performed after confirming there is no problem by ⊙--Usable ╳--Do not use. conducting a test under practical. DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page :10 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 OTHERS PA RA LI GH T 1) Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. 2) Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. 3) The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult PARA’s sales staff in advance for information on the applications in which exceptional quality and reliability are required , particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). 4) User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from PARA. When defective LEDs are found, the User shall inform PARA directly before disassembling or analysis. 5) The formal specifications must be exchanged and signed by both parties before large volume purchase begins. 6) The appearance and specifications of the product may be modified for improvement without notice. 7) Recommended Wave Soldering Profile DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page :11 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS L H 3 1 1 0 HOLDER REV:A / 1 5 0 B T LENGTH LI GH A: 2.75mm B: 3.00mm C: 3.20mm D: 3.30mm E: 3.50mm F: 4.00mm G: 5.00mm H: 18.05mm PA RA Series number HOLDERS Type 1: 1PCS 2: 2PCS 3: 3PCS 4: 4PCS 5: 5PCS 3: 3mmLAMPS 4: 4mmLAMPS 5: 5mmLAMPS DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page :12 3.0 mm LED LAMP WITH LA73B-1A/B L-H339005B-HTS HOLDER REV:A / 1 Bin Code List: Dominant Wavelength (D), Unit:nm@20mA Bin Code G16 Min 566 Max 568 G17 568 570 G18 570 572 G19 572 574 T Tolerance of each bin are±1nmt Bin Code J K L Min Max 15.1 21.1 21.1 29.5 29.5 41.3 41.3 57.8 57.8 80.9 LI I GH Luminous Intensity(IV), Unit:mcd@20mA RA M PA Tolerance of each bin are±15% DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page :13 3.0 mm LED LAMP WITH LA73B-1A/B HOLDER L-H339005B-HTS LI GH T REV:A / 1 PA RA 2 9 .5 x 2 2 x 1 4 re fe r 1 .2 ...5 to b e c o n tin u e d 4 5 x 3 0 .5 x 5 7 . L -H 3 3 9 0 0 5 B p a c k a g e ru le N o te : 1 、 2 9 .5 x 2 2 x 1 4 p re s e n ts little p a c k a g e b o x ,1 4 little b a g s in e v e ry 2 9 .5 x 2 2 x 1 4 ,0 .2 5 K in e v e ry b a g . 2 、 4 5 x 3 0 .5 x 5 7 p re s e n ts b ig p a c k a g e b o x , fiv e little 2 9 .5 x 2 2 x 1 4 b o x e s in e v e ry 4 5 x 3 0 .5 x 5 7 ,to ta l 1 7 .5 K in e v e ry 4 5 x 3 0 .5 x 5 7 . 3 、 S p e c ific p a c k a g e c o u rs e re fe rs to th e a tta c h e d g ra p h . DRAWING NO. : DS-60-09-0055 DATE :2021-09-14 Page :14