PARA LIGHT ELECTRONICS CO., LTD.
11F., No. 8, Jiankang Rd., Zhonghe Dist., New Taipei City 235, Taiwan,
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
E-mail: para@para.com.tw
http://www.para.com.tw
DATA SHEET
PART NO.: LC191PJGCT
REV: A / 0
CUSTOMER’S APPROVAL : _______________
DCC : ____________
DRAWING NO. : DS-74-21-0007G
DATE : 2021-03-09 PAGE
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PARA-FOR-065
SURFACE MOUNT DEVICE LED
Part No. : LC191PJGCT
REV:A / 0
PACKAGE OUTLINE DIMENSIONS
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ± 0.1mm (.004") unless otherwise noted.
Features
Top view, wide view angle, single color Chip LED.
Package in 8mm tape on 7" diameter reels.
Compatible with automatic Pick & Place equipment.
Compatible with Infrared and Wave soldering reflow solder processes.
EIA STD package.
I.C. compatible.
Pb free product.
Meet RoHS Green Product.
Moisture sensitivity level: 3
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DATE : 2021-03-09
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Chip Materials
Dice Material : AlInGaP
Light Color : Super Green
Lens Color : Water Clear
Absolute Maximum Ratings(Ta=25℃)
Symbol
Parameter
Rating
Unit
PD
Power Dissipation
60
mW
IPF
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
60
mA
IF
Continuous Forward Current
25
mA
VR
Reverse Voltage
5
V
Topr
Operating Temperature Range
-40 ~ +85
℃
Tstg
Storage Temperature Range
-40 ~ +85
℃
Electro-Optical Characteristics(Ta=25℃)
Parameter
Unit
Test Condition
25
mcd
IF=20mA
2θ1/2
130
deg
Note 2
Dominant Wavelength
λd
570
nm
IF=20mA
Spectral Line
Half-Wid h
Δλ
15
nm
Forward Voltage
VF
2.1
Reverse Current
IR
Luminous Intensity
Viewing Angle
Symbol
Min.
Typ.
IV
11
DRAWING NO. : DS-74-21-0007G
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Max.
2.3
V
IF =20mA
10
μA
VR = 5V
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Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA
Bin Code
Min
Max
L
11.0
18.0
M
18.0
N
P
Forward Voltage(VF), Unit:V@20mA
Bin Code
Min
Max
4
1.90
2.00
28.0
5
2.00
2.10
28.0
45.0
6
2.10
2.20
45.0
71.0
7
2.20
2.30
Tolerance of each bin are±15%
Tolerance of each bin are±0.1Volt
Dominant Wavelength (Hue),Unit: nm@20mA
Bin Code
Min
Max
GA
567.0
570.0
GB
570.0
573.0
GC
573.0
576.0
Tolerance of each bin are±1nm
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. The dominant wavelength λd is derived from the CIE chromaticity diagram and
represents the single wavelength which defines the color of the device.
4. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
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Typical Electro-Optical Characteristics Curves
Luminous lntensity(mcd)
(25℃Ambient Temperature Unless Otherwise Noted)
Fig.2 Forward Current vs.Forward Voltage
Fig.3 Luminous Intensity vs.Forward Current
Relative luminous intensity(%)
Relative Luminous lntensity
Normalized of 20mA
1000
100
10
1
-60 -40 -20 -0 20 40 60 80 100
Ambient Temperature Ta( ℃)
Fig.4 Relative Luminous Intensity vs.Forward Current
Fig.5 Luminous Intensity vs.Ambient Temperature
0°
Forward Current IF(mA)
50
10° 20°
30°
40
30
25
20
1.0
40°
0.9
50°
0.8
60°
70°
80°
90°
10
0.7
0
0
20
40
60
80
100
0.5 0.3
0.1 0.2 0.4 0.6
Ambient Temperature Ta( ℃)
Fig.6 Forward Current Derating Curve
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Fig.7 Relative Intensity vs.Angle
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Label Explanation
ITEM CODE:PARRA LIGHT
PART NO: LC191PJGCT
IV --- Luminous Intensity Code
LOT NO:
EM
S
L
12
09
0110
A
B
C
D
E
F
A---EM: Emos Code
B---S:SMD
L---Local
D---Year
E---Month
F---SPEC.
PACKING QUANTITY OF BAG :
3000pcs for 150、170、110、155、115 series
4000pcs for 191 series
5000pcs for 192 series
DATE CODE:2012
G
09
H
10
I
G--- Year
H--- Month
I --- Day
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Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
Reel Dimensions
Notes:
1. Taping Quantity : 4000pcs
2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm.
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Package Dimensions Of Tape And Reel
Progressive direction
Cathode
Polarity
Notes:All dimensions are in millimeters.
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Cleaning
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
the oscillator output, size of PCB and LED mounting method. The use of ultrasonic
cleaning should be enforced at proper output after confirming there is no problem.
Suggest Soldering Pad Dimensions
Direction of PWB camber
and go to reflow furnace
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●
Suggest Sn/Pb IR Reflow Soldering Profile Condition:
●
Suggest Pb-Free IR Reflow Soldering Profile Condition:
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CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household application).Consult PARA’s sales in advance for information on
application in which exceptional quality and reliability are required, particularly when the failure or malfunction of
the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life
support system and safety devices).
2.Storage :
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking
treatment should be performed using the following conditions.
Baking treatment: 60±5℃ for 24 hours
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
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Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60
solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed
consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp:150-180℃,120sec.Max.
2、Soldering Temp:Temperature Of Soldering Pot Over 230℃,40sec.Max.
3、Peak Temperature:260℃,5sec.
4、Reflow Repetition:2 Times Max.
5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp:350℃ Max.
2、Soldering Iron:30w Max.
3、Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
1、Pre-Heat Temp:150℃ Max. 120 Sec. Max.
2、Bath Temp:265℃ Max.
3、Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
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