EPT7076_99

Token Ring Transceiver Module ELECTRONICS INC. EPT7076 • Optimized for voltage source driving into 150 ohms • • Enhanced Common Mode performance over UTP • • Robust construction allows for solder reflow processes • • Complies with or exceeds IEEE 802.5 Requirements • Electrical Parameters @ 25° C Impedance (Ω) [Xmit/Rcv] Chip Side 150 1-16 MHz Max. Insertion Loss (dB) 32 MHz 36 MHz 44 MHz 1-6 MHz Return Loss (dB Min.) 6-17 MHz 17-25 MHz 1-30 MHz Common Mode Rejection (dB Min.) 30-100 MHz 100-200 MHz 200-300 MHz Crosstalk (dB Min.) 1-30 MHz Min. Max. Min. Max. Min. Max. Cable Side Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv 100 -.8 -.6 -7 -1 -25 -3 -30 -3 -18 -23 -12 -20 -8 -10 -50 -40 -35 -35 -30 -30 -20 -20 -38 Schematic TX1+ 9 150Ω TXCT 11 FIN 1 150Ω FINL 2 FGND 3 LPF 5 FOUT 150Ω 4 FOUT 150Ω RX0+ 6 RXCT 8 RX0- 7 TX1- 10 12 TPHB 20 TXOUT 100 Ω 19 TXOUTL 13 TPHA 15 RPHB 18 RXIN 100 Ω 17 RXINL 14 RPHA Package A B Dim. Pin 1 I.D. A B C D E F G H I J K L Dimensions (Inches) Min. Max. Nom. 1.090 .260 .380 --.010 ----.016 .008 --.130 --1.110 .280 .400 --.030 ----.022 .012 --.150 --1.100 .270 .390 .950 .020 .050 .135 .020 .010 .075 .140 .100 (Millimeters) Min. Max. Nom. 27.69 6.60 9.65 --.254 ----.406 .203 --3.30 --28.19 7.11 10.16 --.762 ----.559 .305 --3.81 --27.94 6.85 9.91 24.13 .508 1.27 3.43 .508 .254 1.91 3.56 2.54 C PCA EPT7076 Date Code E J L H D F K I G PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 CST7076a Rev. B1 1/19/99 Product performance is limited to specified parameters. Data is subject to change without prior notice. TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com Token Ring Transceiver Module ELECTRONICS INC. EPT7076 The circuit below is a guideline for interconnecting PCA’s EPT7076 with a typical Token Ring PHY chip for 4 Mb/16Mb applications over UTP cable. Further details of system design should be obtained from the specific chip manufacturer. Note that this module is optimized for a “voltage source” driver such as TI380C60. Note that there is no need for the receiver side filtering. So consider this a cost effective solution for almost all Token Ring applications using this or similar chips. The pull down resistors to chassis via a cap shown around the RJ45 connector have been known to suppress unwanted radiation that unused wires pick up from the immediate environment. This is specially true if driving UTP cable. Their placement and use are to be considered carefully before a design is finalized. No specific recommendation is made here for phantom return circuitry: implementation varies. Please note that additional emission control has been observed if both nodes of the phantom bypass capacitor on the transmit channel are pulled to the chassis ground via suitable capacitors. It is recommended that there be a neat separation of ground planes in the layout. It is generally accepted practice to limit the plane off at least 0.05 inches away from the chip side of EPT7076. There need not be any ground plane beyond this point. For best results, PCB designer should design the outgoing traces preferably to be 50 ohms, balanced and well coupled to achieve minimum radiation from these traces. Typical Application Circuit Connection to TI380C60 (or Equivalent) For NIC. Rcv+ 150Ω 6 7 PH-B +5V 18 17 20 19 4 5 3 6 Rcv± Rcv+5V 15 14 PH-A Xmit± 1 2 RJ4 5 7 8 PHOUTA PHOUTB 50Ω/2W 13 50Ω/2W 10µF 10µF 8 12 4 3 TI380C60 9 5 Xmit+ 10 442Ω 100Ω 100Ω EPT7076 11 1 Xmit- 2 Notes : 1. Pins 15 & 14 are left unconnected. Applications vary. Your system may have a phantom drive return detection circuit needing pins 15 & 14 to be connected separately or together, can be taken to ground via an inductor. PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 CST7076b Rev. B1 1/19/99 TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com