4245-02

Product Specification PE4245 Product Description The PE4245 RF Switch is designed to cover a broad range of applications from near DC to 4000 MHz. This switch integrates on-board CMOS control logic with a low voltage CMOS compatible control input. Using a +3-volt nominal power supply voltage, a 1 dB compression point of +27 dBm can be achieved. The PE4245 also exhibits excellent isolation of better than 42 dB at 1000 MHz and is offered in a small 3x3 mm DFN package. The PE4245 is manufactured on Peregrine’s UltraCMOS™ process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS. Figure 1. Functional Diagram RFC SPDT UltraCMOS™ RF Switch DC - 4000 MHz Features • Single 3.0 V Power Supply • Low insertion loss: 0.6 dB at 1000 MHz, 0.7 dB at 2000 MHz • High isolation of 42 dB at 1000 MHz, 32 dB at 2000 MHz • Typical 1 dB compression of +27 dBm • Single-pin CMOS logic control • Available in a 6-lead DFN package Figure 2. Package Type 6-lead DFN RF1 RF2 CMOS Control Driver CTRL Table 1. Electrical Specifications @ +25 °C, VDD = 3 V (ZS = ZL = 50 Ω) Parameter Operation Frequency1 Insertion Loss Isolation – RFC to RF1/RF2 Isolation – RF1 to RF2 Return Loss ‘ON’ Switching Time ‘OFF’ Switching Time Video Feedthrough2 Input 1 dB Compression Input IP3 2000 MHz 2000 MHz, 14 dBm 26 43 1000 MHz 2000 MHz 1000 MHz 2000 MHz 1000 MHz 2000 MHz 1000 MHz 2000 MHz CTRL to 0.1 dB final value, 2 GHz CTRL to 25 dB isolation, 2 GHz Conditions Minimum DC Typical Maximum 4000 Units MHz dB dB dB dB dB dB dB dB ns ns mVpp dBm dBm 39 30 34 27 21 20 0.6 0.7 42 32 36 29 23 22 200 90 15 27 45 0.75 0.85 Notes: 1. Device linearity will begin to degrade below 10 MHz. 2. The DC transient at the output of any port of the switch when the control voltage is switched from Low to High or High to Low in a 50 Ω test set-up, measured with 1ns risetime pulses and 500 MHz bandwidth. Document No. 70-0104-05 │ www.psemi.com ©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 8 PE4245 Product Specification Figure 3. Pin Configuration RF2 GND RF1 1 2 3 Exposed Solder Pad - Shorted to Pin 2 (bottom side) Table 4. Absolute Maximum Ratings Symbol Parameter/Conditions Power supply voltage Voltage on any input Storage temperature range Operating temperature range Min -0.3 -0.3 -65 -40 Max 4.0 VDD+ 0.3 150 85 Units V V °C °C 6 5 4 RFC CTRL VDD VI TST TOP VDD PIN VESD Input power (50Ω) ESD voltage (Human Body Model) 30 1500 dBm V Table 2. Pin Descriptions Pin No. 1 Pin Name RF2 Description RF2 port (Note 1) Ground Connection. Traces should be physically short and connected to the ground plane. This pin is connected to the exposed solder pad that also must be soldered to the ground plane for best performance. RF1 port (Note 1) Nominal 3 V supply connection. CMOS logic level: High = RFC to RF1 signal path Low = RFC to RF2 signal path Common RF port for switch (Note 1) 2 GND Absolute Maximum Ratings are those values listed in the above table. Exceeding these values may cause permanent device damage. Functional operation should be restricted to the limits in the DC Electrical Specifications table. Exposure to absolute maximum ratings for extended periods may affect device reliability. Table 5. Control Logic Truth Table Control Voltage CTRL = CMOS High CTRL = CMOS Low 3 4 RF1 VDD Signal Path RFC to RF1 RFC to RF2 5 CTRL Electrostatic Discharge (ESD) Precautions When handling this UltraCMOS™ device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rating specified in Table 4. Latch-Up Avoidance Unlike conventional CMOS devices, UltraCMOS™ devices are immune to latch-up. 6 RFC Notes: 1. All RF pins must be DC blocked with an external series capacitor or held at 0 VDC. Table 3. DC Electrical Specifications Parameter VDD Power Supply Voltage IDD Power Supply Current VDD = 3V, VCNTL = 3V Control Voltage High Control Voltage Low 0.7x VDD 0.3x VDD Min 2.7 Typ 3.0 250 Max 3.3 500 Units V nA V V ©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 8 Document No. 70-0104-05 │ U ltraCMOS™ RFIC Solutions PE4245 Product Specification Typical Performance Data @ 25 °C (Unless Otherwise Noted) Figure 4. Insertion Loss - RFC to RF1 T = -40 °C to 85 °C 0 Figure 5. Input 1dB Compression Point and IIP3 60 60 -0.3 -40°C 50 Insertion Loss (dB) -0.6 50 1dB Compression Point (dBm) IIP3 (dBm) 40 40 -0.9 85°C 25°C -1.2 30 30 -1.5 0 800 1600 2400 3200 4000 20 0 800 1600 2400 3200 20 4000 Frequency (MHz) Frequency (MHz) Figure 6. Insertion Loss - RFC to RF2 T = -40 °C to 85 °C 0 Figure 7. Isolation - RFC to RF1 0 -0.3 -40°C -20 Insertion Loss (dB) -0.9 85°C 25°C Isolation (dB) 1600 2400 3200 4000 -0.6 -40 -60 -1.2 -80 -1.5 0 800 -100 0 800 1600 2400 3200 4000 Frequency (MHz) Frequency (MHz) Document No. 70-0104-05 │ www.psemi.com ©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 8 PE4245 Product Specification Typical Performance Data @ 25 °C Figure 8. Isolation – RFC to RF2 Figure 9. Isolation – RF1 to RF2, RF2 to RF1 0 0 -20 -25 Isolation (dB) Isolation (dB) -40 -50 -60 -75 -80 -100 0 800 1600 2400 3200 4000 -100 0 800 1600 2400 3200 4000 Frequency (MHz) Frequency (MHz) Figure 10. Return Loss – RFC to RF1, RF2 Figure 11. Return Loss – RF1, RF2 0 0 -10 Return Loss (dB) Return Loss (dB) -10 RF1 -20 -20 RF1 -30 RF2 -30 RF2 -40 0 800 1600 2400 3200 4000 -40 0 800 1600 2400 3200 4000 Frequency (MHz) Frequency (MHz) ©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 8 Document No. 70-0104-05 │ U ltraCMOS™ RFIC Solutions PE4245 Product Specification Evaluation Kit The SPDT Switch Evaluation Kit board was designed to ease customer evaluation of the PE4245 SPDT switch. The RF common port is connected through a 50 Ω transmission line to the top left SMA connector, J1. Port 1 and Port 2 are connected through 50 Ω transmission lines to the top two SMA connectors on the right side of the board, J2 and J3. A through transmission line connects SMA connectors J4 and J5. This transmission line can be used to estimate the loss of the PCB over the environmental conditions being evaluated. The board is constructed of a two metal layer FR4 material with a total thickness of 0.031”. The bottom layer provides ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.0476”, trace gaps of 0.030”, dielectric thickness of 0.028”, metal thickness of 0.0021” and εr of 4.4. J6 provides a means for controlling DC and digital inputs to the device. Starting from the lower left pin, the second pin to the right (J6-3) is connected to the device CNTL input. The fourth pin to the right (J6-7) is connected to the device VDD input. Figure 12. Evaluation Board Layouts Peregrine Specification 101/0085 Figure 13. Evaluation Board Schematic Peregrine Specification 102/0110 Document No. 70-0104-05 │ www.psemi.com ©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 8 PE4245 Product Specification Figure 14. Package Drawing 6-lead DFN 3.00 C L -A-B1 PIN 1 MARK 3 0.125 2 C L 3.00 4 4 0.10 C 4 0.10 C 5 6 0.125 +2° 10°-10° 0.100 C 0.90 ±0.10 0.080 C 3 TOP VIEW DETAIL C 0.025 ±0.025 0.70 ± 0.05 0.20 ±0.05 SEATING PLANE -CDETAIL B 0.025±0.025 SIDE VIEW SEE DETAIL B 0.95 EXPOSED PAD 4 C L 0.35 +0.08 -0.02 0.10 0.05 C 6 CAB 0.29 +0.16 -0.09 EXPOSED SLUG/ HEAT SINK 0.17 MIN. +0.16 0.29 -0.09 0.125 MAX. 0.17 0.30 5 SEE DETAIL A R 0.127 TYP R 0.15 TYP 0.20 MIN. 1.54 ±0.10 0.96 ±0.10 EXPOSED (2X) THIS FEATURE APPLIES TO BOTH ENDS OF THE PKG. DETAIL A EXPOSED METALIZED FEATURE EDGE OF PLASTIC BODY 3 2 1 0.46 ±0.10 0.92 ±0.10 3 BOTTOM VIEW 1. DIMENSIONS AND TOLERANCES ARE PER ANSi Y14.5 2. DIMENSIONS ARE IN MILLIMETERS, ANGLES ARE IN DEGREES. 3 4 COPLANARITY APPLIES TO EXPOSED HEAT SLUG AS WELL AS THE TERMINALS. PROFILE TOLERANCE APPLIES TO PLASTIC BODY ONLY. ©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 8 Document No. 70-0104-05 │ U ltraCMOS™ RFIC Solutions PE4245 Product Specification Figure 15. Tape and Reel Specifications 6-lead DFN Table 6. Dimensions Dimension Ao Bo Ko P W T R7 Quantity R13 Quantity DFN 3x3 mm 3.23 ± 0.1 3.17 ± 0.1 1.37 ± 0.1 4 ± 0.1 8 +0.3, -0.1 0.254 ± 0.02 3000 N.A. Note: R7 = 7 inch Lock Reel, R13 = 13 inch Lock Reel Table 7. Ordering Information Order Code 4245-01 4245-02 4245-00 4245-51 4245-52 Part Marking 4245 4245 PE4245-EK 4245 4245 Description PE4245-06DFN 3x3mm-12800F PE4245-06DFN 3x3mm-3000C PE4245-06DFN 3x3mm-EK PE4245G-06DFN 3x3mm-12800F PE4245G-06DFN 3x3mm-3000C Package 6-lead 3x3 mm DFN 6-lead 3x3 mm DFN Evaluation Kit Green 6-lead 3x3 mm DFN Green 6-lead 3x3 mm DFN Shipping Method 12800 units / Canister 3000 units / T&R 1 / Box 12800 units / Canister 3000 units / T&R Document No. 70-0104-05 │ www.psemi.com ©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 8 PE4245 Product Specification Sales Offices The Americas Peregrine Semiconductor Corporation 9450 Carroll Park Drive San Diego, CA 92121 Tel: 858-731-9400 Fax: 858-731-9499 North Asia Pacific Peregrine Semiconductor K.K. Teikoku Hotel Tower 10B-6 1-1-1 Uchisaiwai-cho, Chiyoda-ku Tokyo 100-0011 Japan Tel: +81-3-3502-5211 Fax: +81-3-3502-5213 Europe Peregrine Semiconductor Europe Bâtiment Maine 13-15 rue des Quatre Vents F-92380 Garches, France Tel: +33-1-47-41-91-73 Fax : +33-1-47-41-91-73 Peregrine Semiconductor, Korea #B-2402, Kolon Tripolis, #210 Geumgok-dong, Bundang-gu, Seongnam-si Gyeonggi-do, 463-480 S. Korea Tel: +82-31-728-4300 Fax: +82-31-728-4305 South Asia Pacific Peregrine Semiconductor, China Shanghai, 200040, P.R. China Tel: +86-21-5836-8276 Fax: +86-21-5836-7652 Space and Defense Products Americas: Tel: 858-731-9453 Europe, Asia Pacific: 180 Rue Jean de Guiramand 13852 Aix-En-Provence Cedex 3, France Tel: +33(0) 4 4239 3361 Fax: +33(0) 4 4239 7227 For a list of representatives in your area, please refer to our Web site at: www.psemi.com Data Sheet Identification Advance Information The product is in a formative or design stage. The data sheet contains design target specifications for product development. Specifications and features may change in any manner without notice. The information in this data sheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this data sheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS and HaRP are trademarks of Peregrine Semiconductor Corp. Preliminary Specification The data sheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The data sheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a DCN (Document Change Notice). ©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 8 of 8 Document No. 70-0104-05 │ U ltraCMOS™ RFIC Solutions