Product Specification
PE83511
Product Description
The PE83511 is a high-performance static UltraCMOS™ prescaler with a fixed divide ratio of 2. Its operating frequency range is DC to 1500 MHz. The PE83511 operates on a nominal 3V supply and draws only 14 mA. It is packaged in a small 8lead plastic MSOP and is ideal for frequency scaling and clock generation solutions. The PE83511 is manufactured on Peregrine’s UltraCMOS™ process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS. Figure 1. Functional Schematic Diagram DC - 1500 MHz Low Power UltraCMOS™ Divide-by-2 Prescaler Military Operating Temperature Range Features
• DC to 1500 MHz operation • Fixed divide ratio of 2 • Low-power operation:
14 mA typical @ 3.0 V
• Ultra small package: 8-lead MSOP
Figure 2. Package Type
8-lead MSOP
D
Q QB
DRIVER OUTPUT BUFFER
OUT ____ OUT Enable ____ OUT
OUTPUT BUFFER
IN
PREAMP
CL K
Table 1. Electrical Specifications (ZS = ZL = 50 Ω)
2.85 V ≤ VDD ≤ 3.15 V; -55° C ≤ TA ≤ 125° C, unless otherwise specified
Parameter
Supply Voltage
Conditions
Minimum
2.85
Typical
3.0 7 14
Maximum
3.15 12 25 1500 +10 +10 +10
Units
V mA mA MHz dBm dBm dBm dBm
OUTB Disabled Supply Current OUTB Enabled Input Frequency (FIN) 100 MHz ≤ Fin ≤ 1200 MHz -55°C ≤ TA ≤ 85°C Input Power (PIN) 100 MHz ≤ Fin ≤ 1200 MHz 85°C ≥ TA ≥ 125°C 1200 MHz < Fin ≤ 1500 MHz -55°C ≤ TA ≤ 85°C Output Power DC < Fin ≤ 1500 MHz DC -5 0 +5 +2
Document No. 70-0113-03 │ www.psemi.com
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PE83511
Product Specification
Figure 3. Pin Configuration (Top View)
Electrostatic Discharge (ESD) Precautions When handling this UltraCMOS™ device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rating specified in Table 3. Latch-Up Avoidance
VDD
1
8 8 7
GND
IN
2
OUT
PE83511
N/C 3 4 6 5 CTL
GND
OUT
Unlike conventional CMOS devices, UltraCMOS™ devices are immune to latch-up. Table 2. Pin Descriptions
Pin No.
1 2 3 4
Pin Name
VDD IN N/C GND
Device Functional Considerations
Description
Power supply pin. Bypassing is required (eg 1000 pF & 100 pF). Input signal pin. Should be coupled with a capacitor (eg 1000 pF). No connection. This pin should be left open. Ground pin. Ground pattern on the board should be as wide as possible to reduce ground impedance. Inverted divided frequency output. This pin should be coupled with a capacitor (eg 1000 pF). Control pin. When grounded OUTB is enabled. Divided frequency output. This pin should be coupled with a capacitor (eg 1000 pF). Ground Pin.
The PE83511 divides an input signal, up to a frequency of 1500 MHz, by a factor of two thereby producing an output frequency at half the input frequency. To work properly at higher frequency, the input and output signals (pins 2, 7 & optional 5) must be AC coupled via an external capacitor. The input may be DC coupled for low frequency operation with care taken to remain within the specified DC input range for the device. The ground pattern on the board should be made as wide as possible to minimize ground impedance. See Figure 8 for a layout example. OUTB Control Pin 6 controls whether OUTB is enabled or disabled. Pin 6 has an internal pull-up resistor. With no connection (floating), OUTB is disabled. By grounding pin 6, OUTB is enabled. By enabling OUTB, this part will consume roughly 5 mA more current.
5
OUTB
6 7 8
CTL OUT GND
Table 3. Absolute Maximum Ratings
Symbol
VDD Pin VIN TST TOP VESD
Parameter/Conditions
Supply voltage Input Power Voltage on input Storage temperature range Operating temperature range ESD voltage (Human Body Model, MIL-STD 883)
Min
Max
4.0 15 VDD +0.3 150 125 2000
Units
V dBm V °C °C V
-0.3 -65 -55
Absolute Maximum Ratings are those values listed in the above table. Exceeding these values may cause permanent device damage. Exposure to absolute maximum ratings for extended periods may affect device reliability.
©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 7 Document No. 70-0113-03 │ U ltraCMOS™ RFIC Solutions
PE83511
Product Specification
Typical Performance Data: VDD = 3.0 V Figure 4. Input Sensitivity Figure 5. Device Current (OUTB Enabled)
Figure 6. Output Power (OUT or OUTB)
Document No. 70-0113-03 │ www.psemi.com
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PE83511
Product Specification
Evaluation Kit
Evaluation Kit Operation
The PE83511 EK board was designed to ease customer evaluation of Peregrine’s high performance divide-by-2 Military Grade Prescaler. On this board, the device input (pin 2) is connected via connector J1 and a 50 Ω transmission line. A series capacitor (C3) provides the necessary DC block for the device input. It is important to note that the value of this capacitance will impact the performance of the device. A value of 1000 pF was found to be optimal for this board layout; other applications may require a different value. The device output (pin 7) is connected to connector J3 through a 50 Ω transmission line. A series capacitor (C1) provides the necessary DC block for the device output. Note that this capacitor must be chosen to have low impedance at the desired output frequency the device. The value of 1000 pF was chosen to provide a wide operating range for the evaluation board. The board is constructed of a two-layer FR4 material with a total thickness of 0.031”. The bottom layer provides ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide above ground plane model with trace width of 0.030”, trace gaps of 0.007”, dielectric thickness of 0.028”, metal thickness of 0.0014” and εr of 4.4. Note that the predominate mode for these transmission lines is coplanar waveguide.
J2 provides DC power to the device. Starting from the lower left pin, the second pin to the right (J2-3) is connected to the device VDD pin (1). Two decoupling capacitors (10 pF, 1000 pF) are included on this trace. It is the responsibility of the customer to determine proper supply decoupling for their design application.
Applications Support
If you have a problem with your evaluation kit or if you have applications questions call (858) 731-9400 and ask for applications support. You may also contact us by fax or e-mail: Fax: (858) 731-9499 E-Mail: help@psemi.com
Figure 7. Evaluation Board Layouts
Peregrine Specification 101/0190
Figure 8. Evaluation Board Schematic
Peregrine Specification 102/0201
©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 7
Document No. 70-0113-03 │ U ltraCMOS™ RFIC Solutions
PE83511
Product Specification
Figure 9. Package Drawing
8-lead MSOP
TOP VIEW 0.65BSC 8 7 6 5 .525BSC
2.45±0.10 2X 3.00±0.10
0.51±0.13 -B1 2 3 4 .25 A B C
0.51±0.13
2.95±0.10
-C0.86±0.08 2.95±0.10
1.10 MAX -A0.10 A 0.33+0.07 -0.08 0.08 ABC 3.00±0.10 FRONT VIEW SIDE VIEW 0.10±0.05 3.00±0.10 4.90±0.15
Document No. 70-0113-03 │ www.psemi.com
©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 7
PE83511
Product Specification
Figure 10. Tape and Reel Specifications
8-lead MSOP
Pin1
Table 4. Ordering Information
Order Code
83511-01 83511-02 83511-00
Part Marking
PE83511 PE83511 PE83511-EK
Description
PE83511-08MSOP-50A PE83511-08MSOP-2000C PE83511-08MSOP-EK
Package
8-lead MSOP 8-lead MSOP Evaluation Kit
Shipping Method
50 units / Tube 2000 units / T&R 1 / Box
©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 7
Document No. 70-0113-03 │ U ltraCMOS™ RFIC Solutions
PE83511
Product Specification
Sales Offices
The Americas Peregrine Semiconductor Corporation
9450 Carroll Park Drive San Diego, CA 92121 Tel: 858-731-9400 Fax: 858-731-9499
North Asia Pacific Peregrine Semiconductor K.K.
Teikoku Hotel Tower 10B-6 1-1-1 Uchisaiwai-cho, Chiyoda-ku Tokyo 100-0011 Japan Tel: +81-3-3502-5211 Fax: +81-3-3502-5213
Europe Peregrine Semiconductor Europe
Bâtiment Maine 13-15 rue des Quatre Vents F-92380 Garches, France Tel: +33-1-4741-9173 Fax : +33-1-4741-9173
Peregrine Semiconductor, Korea
#B-2402, Kolon Tripolis, #210 Geumgok-dong, Bundang-gu, Seongnam-si Gyeonggi-do, 463-480 S. Korea Tel: +82-31-728-4300 Fax: +82-31-728-4305
South Asia Pacific Peregrine Semiconductor, China
Shanghai, 200040, P.R. China Tel: +86-21-5836-8276 Fax: +86-21-5836-7652
Space and Defense Products
Americas: Tel: 858-731-9453 Europe, Asia Pacific: 180 Rue Jean de Guiramand 13852 Aix-En-Provence Cedex 3, France Tel: +33-4-4239-3361 Fax: +33-4-4239-7227
For a list of representatives in your area, please refer to our Web site at: www.psemi.com
Data Sheet Identification
Advance Information
The product is in a formative or design stage. The data sheet contains design target specifications for product development. Specifications and features may change in any manner without notice. The information in this data sheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this data sheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS and HaRP are trademarks of Peregrine Semiconductor Corp.
Preliminary Specification
The data sheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product.
Product Specification
The data sheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a DCN (Document Change Notice).
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