PE42020
Product Specification
UltraCMOS® True DC RF Switch, 0 Hz–8000 MHz
Features
Figure 1 • PE42020 Functional Diagram
• High power handling
▪ 30 dBm @ DC
RFC
▪ 36 dBm @ 8 GHz
• Maximum voltage (DC or AC peak): ±10V on the
RF ports
RF1
• Total harmonic distortion (THD): –84 dBc
RF2
• Configurable 50Ω absorptive or open reflective
switch via a single pin (LZ)
50Ω
50Ω
• Packaging – 20-lead 4 × 4 mm QFN
DC Tracking
Applications
CMOS Control Driver and ESD
• Test and measurement
▪ Signal sources
LZ
LS CTRL VDD VSS
▪ Communication testers
▪ Spectrum analyzers
▪ Network analyzers
• Automated test equipment
▪ Complex combination of DC + RF/analog and
digital signals
Product Description
The PE42020 is a HaRP™ technology-enhanced SPDT True DC RF switch that operates from zero Hertz up to
8 GHz with integrated RF, analog and digital functions. The PE42020 can accommodate up to ±10V input DC
voltage on the RF ports. It can be configured as a 50Ω absorptive or an open reflective True DC switch via the
single LZ pin. The PE42020 True DC RF switch delivers excellent RF performance and high power handling
down to zero Hertz, making this device ideal for handling the complex combination of DC, RF/analog and digital
signals in test and measurement (T&M) and automated test equipment (ATE) applications.
The PE42020 is manufactured on Peregrine’s UltraCMOS® process, a patented variation of silicon-on-insulator
(SOI) technology on a sapphire substrate.
Peregrine’s HaRP™ technology enhancements deliver high linearity and excellent harmonics performance. It is
an innovative feature of the UltraCMOS process, offering the performance of GaAs with the economy and
integration of conventional CMOS.
©2014 – 2017, Peregrine Semiconductor Corporation. All rights reserved. • Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121
Product Specification
DOC-23814-4 – (7/2017)
www.psemi.com
PE42020
UltraCMOS® True DC RF Switch
Absolute Maximum Ratings
Exceeding absolute maximum ratings listed in Table 1 may cause permanent damage. Operation should be
restricted to the limits in Table 2. Operation between operating range maximum and absolute maximum for
extended periods may reduce reliability.
ESD Precautions
When handling this UltraCMOS device, observe the same precautions as with any other ESD-sensitive devices.
Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to
avoid exceeding the rating specified in Table 1.
Latch-up Immunity
Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up.
Table 1 • Absolute Maximum Ratings for PE42020
Parameter/Condition
Min
Max
Unit
Positive supply voltage, VDD
10
17
V
Negative supply voltage, VSS
–17
–10
V
Digital input voltage (CTRL, LS, LZ)
–0.3
3.6
V
Fig. 2–Fig. 5
38
dBm
dBm
+150
°C
ESD voltage HBM, all pins(1)
1000
V
ESD voltage MM, all pins(2)
150
V
ESD voltage CDM, all pins(3)
1000
V
RF input power (RFC–RFX), 50Ω
0–40 MHz
≥40–8000 MHz
Storage temperature range
–65
Notes:
1) Human body model (MIL-STD 883 Method 3015).
2) Machine model (JEDEC JESD22-A115).
3) Charged device model (JEDEC JESD22-C101).
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PE42020
UltraCMOS® True DC RF Switch
Recommended Operating Conditions
Table 2 list the recommending operating condition for PE42020. Devices should not be operated outside the
recommended operating conditions listed below.
Table 2 • Recommended Operating Conditions for PE42020
Parameter
Min
Typ
Max
Unit
Positive supply voltage, VDD(1)
11
15
V
Negative supply voltage, VSS(1)
–15
–11
V
3.9
mA
Positive supply current, IDD
Negative supply current, ISS
–3.8
Digital input high (CTRL, LS, LZ)
1.17
3.6
V
Digital input low (CTRL, LS, LZ)
–0.3
0.6
V
RF input power, CW (RFC–RFX)(2)
Fig. 2–Fig. 5
dBm
RF input power, pulsed (RFC–RFX)(3)
Fig. 2–Fig. 5
dBm
Fig. 6
dBm
–7
–10
+7
+10
V
V
–7
–10
Fig. 2–Fig. 5
+7
+10
Fig. 2–Fig. 5
V
V
V
80
mA
+85
°C
mA
RF input power into terminated ports, CW (RFX)(2)
Max DC bias voltage at RF ports
VDD = +11V, VSS = –11V, ≥ 0 °C
VDD = +15V, VSS = –15V, ≥ 0 °C
Max voltage
0–2 MHz (VDD = +11V, VSS = –11V, ≥ 0 °C)
0–2 MHz (VDD = +15V, VSS = –15V, ≥ 0 °C)
2–8000 MHz
DC current through RF active ports
Operating temperature range
–40
+25
Notes:
1) To maintain proper operation of the PE42020, a mismatch between VDD and VSS should not exceed a maximum of 8%. A large mismatch will
result in distortion appearing at the RF output at low frequencies. For example, VDD = +13.85V, VSS = –15V represents an 8% mismatch.
|13.85-15| / (13.85+15) / 2*100 = 8%.
2) 100% duty cycle, all bands 50Ω.
3) Pulsed, 5% duty cycle of 4620 µs period, 50Ω.
DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Electrical Specifications
Table 3 provides the PE42020 key electrical specifications @ 25 °C, V DD = +15V, VSS = –15V, LZ = 0
(absorptive), 0 VDC at RF ports (ZS = ZL = 50Ω), unless otherwise specified.
Table 3 • PE42020 Electrical Specifications(1)
Parameter
Path
Condition
Operating frequency
Insertion loss
Min
Typ
0 Hz
Max
Unit
8 GHz
As
shown
0.70
1.00
1.30
1.35
dB
dB
dB
dB
RFC–RFX
0 Hz
0–3 GHz
3–6 GHz
6–8 GHz
RFX–RFX
0–3 GHz
3–6 GHz
6–8 GHz
52
38
30
56
42
34
dB
dB
dB
RFC–RFX
0–3 GHz
3–6 GHz
6–8 GHz
46
35
31
48
37
34
dB
dB
dB
RFC–RFX
0–3 GHz
3–6 GHz
6–8 GHz
20
18
15
dB
dB
dB
RFX
0–3 GHz
3–6 GHz
6–8 GHz
23
17
16
dB
dB
dB
1 kHz (2.5 VPP into 300Ω load)
–84
dBc
0.60
0.85
1.00
1.10
Isolation
Return loss
(active and RFC ports)
Return loss
(terminated port)
Total harmonic distortion
Input 0.1dB compression
point(2)
RFC–RFX
40 MHz–8 GHz
38
dBm
Input IP2
RFC–RFX
836 MHz, 1900 MHz
2.7 GHz
4.8 GHz
115
105
90
dBm
dBm
dBm
RFC–RFX
836 MHz, 1900 MHz
2.7 GHz
4.8 GHz
62
61
55
dBm
dBm
dBm
Settling time
50% CTRL to 0.05 dB finallue
35
45
µs
Switching time
50% CTRL to 90% or 10% RF
10
14
µs
Input IP3
Notes:
1) Device is linear down to 0 Hz.
2) The input 0.1dB compression point is a linearity figure of merit. Refer to Table 2 for the RF input power (50Ω).
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DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Table 4 provides the PE42020 key electrical specifications @ 25 °C, VDD = +15V, VSS = –15V, LZ = 1 (open
reflective), 0 VDC at RF ports (ZS = ZL = 50Ω), unless otherwise specified.
Table 4 • PE42020 Electrical Specifications(1)
Parameter
Path
Condition
Operating frequency
Insertion loss
Min
Typ
0 Hz
Max
Unit
8 GHz
As
shown
0.75
1.00
1.25
1.35
dB
dB
dB
dB
RFC–RFX
0 Hz
0–3 GHz
3–6 GHz
6–8 GHz
RFX–RFX
0–3 GHz
3–6 GHz
6–8 GHz
35
29
25
37
31
27
dB
dB
dB
RFC–RFX
0–3 GHz
3–6 GHz
6–8 GHz
34
27
21
36
29
24
dB
dB
dB
RFC–RFX
0–3 GHz
3–6 GHz
6–8 GHz
20
19
15
dB
dB
dB
1 kHz (2.5 VPP into 300Ω load)
–84
dBc
0.60
0.85
1.00
1.10
Isolation
Return loss
(active and RFC ports)
Total harmonic distortion
Input 0.1dB compression
point(2)
RFC–RFX
40 MHz–8 GHz
38
dBm
Input IP2
RFC–RFX
836 MHz, 1900 MHz
2.7 MHz
4.8 MHz
115
105
90
dBm
dBm
dBm
Input IP3
RFC–RFX
836 MHz, 1900 MHz
2.7 MHz
4.8 MHz
62
61
55
dBm
dBm
dBm
Settling time
50% CTRL to 0.05 dB final value
35
45
µs
Switching time
50% CTRL to 90% or 10% RF
10
14
µs
Notes:
1) Device is linear down to 0 Hz.
2) The input 0.1dB compression point is a linearity figure of merit. Refer to Table 2 for the RF input power (50Ω).
DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Power-up/Power-down Sequence
Hot-switching Capability
The following power-up/power-down sequence must
be followed. Failure to follow this sequence will cause
permanent damage to the device.
The maximum hot switching capability of the PE42020
is 27 dBm at VDD = +15V and VSS = –15V; 24 dBm at
VDD = +11V and VSS = –11V. Hot switching occurs
when RF power is applied while switching between
RF ports.
• During the power-up sequence, VSS must be turned
on before VDD.
• During the power-down sequence, VDD must be
turned off before VSS.
Control Logic
It is recommended to turn on VDD within 1 second of
turning on VSS during the power-up sequence and turn
off VSS within 1 second of turning off VDD during the
power-down sequence. The device is not sensitive to
the timing and level of the control voltages.
Table 5 provides the control logic truth table for the
PE42020.
Table 5 • Control Logic Truth Table for PE42020
LS
CTRL LZ(*)
RFC–RF1
RFC–RF2
Off Port
Terminated
0
0
0
OFF
ON
Yes
0
0
1
OFF
ON
No (High–Z)
0
1
0
ON
OFF
Yes
0
1
1
ON
OFF
No (High–Z)
1
0
0
ON
OFF
Yes
1
0
1
ON
OFF
No (High–Z)
1
1
0
OFF
ON
Yes
1
1
1
OFF
ON
No (High–Z)
Note: * If LZ is pulled high, the part is configured as an open reflective switch.
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PE42020
UltraCMOS® True DC RF Switch
Figure 2 • Power De-rating Curve for 0 Hz–8 GHz, VDD = +15V, VSS = –15V, 0 VDC,–40 to 0 °C, 50Ω
Max. RF Input Power, Pulsed (≥ 40 MHz, -40°C to 0°C Ambient, VDD = +15V, VSS = -15V)
Max. RF Input Power, CW (≥ 40 MHz, -40°C to 0°C Ambient, VDD = +15V, VSS = -15V)
Max. RF Input Power, CW & Pulsed (< 40 MHz, -40°C to 0°C Ambient, VDD = +15V, VSS = -15V)
38
37
Input Power (dBm)
36
35
34
33
32
31
30
29
28
27
26
0
1
10
100
1000
10000
Frequency (MHz)
Figure 3 • Power De-rating Curve for 0 Hz–8 GHz, VDD = +15V, VSS = –15V, 0 VDC, 0–85 °C, 50Ω
Max. RF Input Power, Pulsed (≥ 20 MHz, 0°C to +85°C Ambient, VDD = +15V, VSS = -15V)
Max. RF Input Power, CW (≥ 20 MHz, 0°C to +85°C Ambient, VDD = +15V, VSS = -15V)
Max. RF Input Power, CW & Pulsed (< 20 MHz, 0°C to +85°C Ambient, VDD = +15V, VSS = -15V)
38
37
Input Power (dBm)
36
35
34
33
32
31
30
29
28
27
26
0
1
10
100
1000
10000
Frequency (MHz)
DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Figure 4 • Power De-rating Curve for 0 Hz–8 GHz, VDD = +11V, VSS = –11V, 0 VDC, –40 to 0 °C, 50Ω
Max. RF Input Power, Pulsed (≥ 40 MHz, -40°C to 0°C Ambient, VDD = +11V, VSS = -11V)
Max. RF Input Power, CW (≥ 40 MHz, -40°C to 0°C Ambient, VDD = +11V, VSS = -11V)
Input Power (dBm)
Max. RF Input Power, CW & Pulsed (< 40 MHz, -40°C to 0°C Ambient, VDD = +11V, VSS = -11V)
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
0
1
10
100
1000
10000
Frequency (MHz)
Figure 5 • Power De-rating Curve for 0 Hz–8 GHz, VDD = +11V, VSS = –11V, 0 VDC, 0–85 °C, 50Ω
Max. RF Input Power, Pulsed (≥ 30 MHz, 0°C to +85°C Ambient, VDD = +11V, VSS = -11V)
Max. RF Input Power, CW (≥ 30 MHz, 0°C to +85°C Ambient, VDD = +11V, VSS = -11V)
Input Power (dBm)
Max. RF Input Power, CW & Pulsed (< 30 MHz, 0°C to +85°C Ambient, VDD = +11V, VSS = -11V)
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
0
1
10
100
1000
10000
Frequency (MHz)
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PE42020
UltraCMOS® True DC RF Switch
Figure 6 • Power De-rating Curve for 0 Hz–8 GHz, Terminated Power, 0 VDC, –40 to 85 °C, 50Ω
Max. RF Terminated Power, CW (-40°C to 85°C Ambient)
27
26
Input Power (dBm)
25
24
23
22
21
20
19
18
0
1
10
100
1000
10000
Frequency (MHz)
DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Performance Data
Figure 7–Figure 28 show the performance data at 25 °C, VDD = +15V, VSS = –15V, 0 VDC, (ZS = ZL = 50Ω),
unless otherwise specified.
Figure 7 • Insertion Loss vs Temperature (RFC–RFX), LZ = 0
-40°C
25°C
85°C
0
Insertion Loss (dB)
-1
-2
-3
-4
-5
0
1
2
3
4
5
6
7
8
6
7
8
Frequency (GHz)
Figure 8 • Insertion Loss vs Temperature (RFC–RFX), LZ = 1
-40°C
25°C
85°C
0
Insertion Loss (dB)
-1
-2
-3
-4
-5
0
1
2
3
4
5
Frequency (GHz)
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PE42020
UltraCMOS® True DC RF Switch
Figure 9 • Insertion Loss vs VDD/VSS (RFC–RFX), LZ = 0
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
Insertion Loss (dB)
-1
-2
-3
-4
-5
0
1
2
3
4
5
6
7
8
7
8
Frequency (GHz)
Figure 10 • Insertion Loss vs VDD/VSS (RFC–RFX), LZ = 1
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
Insertion Loss (dB)
-1
-2
-3
-4
-5
0
1
2
3
4
5
6
Frequency (GHz)
DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Figure 11 • RFC Port Return Loss vs Temperature, LZ = 0
-40°C
25°C
85°C
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
7
8
6
7
8
Frequency (GHz)
Figure 12 • RFC Port Return Loss vs Temperature, LZ = 1
-40°C
25°C
85°C
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
Frequency (GHz)
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PE42020
UltraCMOS® True DC RF Switch
Figure 13 • RFC Port Return Loss vs VDD/VSS, LZ = 0
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
7
8
7
8
Frequency (GHz)
Figure 14 • RFC Port Return Loss vs VDD/VSS, LZ = 1
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
Frequency (GHz)
DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Figure 15 • Active Port Return Loss vs Temperature, LZ = 0
-40°C
25°C
85°C
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
7
8
6
7
8
Frequency (GHz)
Figure 16 • Active Port Return Loss vs Temperature, LZ = 1
-40°C
25°C
85°C
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
Frequency (GHz)
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PE42020
UltraCMOS® True DC RF Switch
Figure 17 • Active Port Return Loss vs VDD/VSS, LZ = 0
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
7
8
7
8
Frequency (GHz)
Figure 18 • Active Port Return Loss vs VDD/VSS, LZ = 1
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
Frequency (GHz)
DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Figure 19 • Terminated Port Return Loss vs Temperature, LZ = 0
-40°C
25°C
85°C
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
7
8
7
8
Frequency (GHz)
Figure 20 • Terminated Port Return Loss vs VDD/VSS, LZ = 0
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
-5
Return Loss (dB)
-10
-15
-20
-25
-30
-35
-40
-45
-50
0
1
2
3
4
5
6
Frequency (GHz)
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PE42020
UltraCMOS® True DC RF Switch
Figure 21 • Isolation vs Temperature (RFX–RFX), LZ = 0
-40°C
25°C
85°C
0
Isolation (dB)
-20
-40
-60
-80
-100
-120
0
1
2
3
4
5
6
7
8
6
7
8
Frequency (GHz)
Figure 22 • Isolation vs Temperature (RFX–RFX), LZ = 1
-40°C
25°C
85°C
0
Isolation (dB)
-20
-40
-60
-80
-100
-120
0
1
2
3
4
5
Frequency (GHz)
DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Figure 23 • Isolation vs VDD/VSS (RFX–RFX), LZ = 0
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
Isolation (dB)
-20
-40
-60
-80
-100
-120
0
1
2
3
4
5
6
7
8
7
8
Frequency (GHz)
Figure 24 • Isolation vs VDD/VSS (RFX–RFX), LZ = 1
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
Isolation (dB)
-20
-40
-60
-80
-100
-120
0
1
2
3
4
5
6
Frequency (GHz)
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PE42020
UltraCMOS® True DC RF Switch
Figure 25 • Isolation vs Temperature (RFC–RFX), LZ = 0
-40°C
25°C
85°C
0
Isolation (dB)
-20
-40
-60
-80
-100
-120
0
1
2
3
4
5
6
7
8
6
7
8
Frequency (GHz)
Figure 26 • Isolation vs Temperature (RFC–RFX), LZ = 1
-40°C
25°C
85°C
0
Isolation (dB)
-20
-40
-60
-80
-100
-120
0
1
2
3
4
5
Frequency (GHz)
DOC-23814-4 – (7/2017)
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PE42020
UltraCMOS® True DC RF Switch
Figure 27 • Isolation vs VDD/VSS (RFC–RFX), LZ = 0
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
Isolation (dB)
-20
-40
-60
-80
-100
-120
0
1
2
3
4
5
6
7
8
7
8
Frequency (GHz)
Figure 28 • Isolation vs VDD/VSS (RFC–RFX), LZ = 1
+11V/–11V
+13.5V/–13.5V
+15V/–15V
0
Isolation (dB)
-20
-40
-60
-80
-100
-120
0
1
2
3
4
5
6
Frequency (GHz)
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PE42020
UltraCMOS® True DC RF Switch
Evaluation Kit
The SPDT switch evaluation board was designed to ease customer evaluation of Peregrine's PE42020. The RF
common port is connected through a 50Ω transmission line via the SMA connector, J3. RF1 and RF2 ports are
connected through 50Ω transmission lines via SMA connectors J1 and J2 respectively. A 50Ω through transmission line is available via SMA connectors J5 and J6, which can be used to de-embed the loss of the PCB. J4
provides DC and digital inputs to the device.
The board is constructed of a four metal layer material with a total thickness of 62 mils. The top RF layer is
Rogers 4350B material with a thickness of 6.6 mils and the Ɛr = 3.66. The middle layers provide ground for the
transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model
using a trace width of 13 mils, trace gaps of 10.5 mils and metal thickness of 3.4 mils.
For the true performance of the PE42020 to be realized, the PCB must be designed in such a way that RF transmission lines and sensitive DC I/O traces are well isolated from one another.
Figure 29 • Evaluation Kit Layout for PE42020
DOC-23814-4 – (7/2017)
Page 21
www.psemi.com
PE42020
UltraCMOS® True DC RF Switch
Pin Information
Table 6 • Pin Descriptions for PE42020
This section provides pinout information for the
PE42020. Figure 30 shows the pin map of this device
for the available package. Table 6 provides a
description for each pin.
VDD
LS
CTRL
LZ
VSS
19
18
17
16
Pin 1 Dot
Marking
20
Figure 30 • Pin Configuration (Top View)
Pin No.
Pin
Name
1–3, 5–7,
9–11, 13–
15
GND(*)
4
RF1
RF port 1.
8
RFC
RF common.
12
RF2
RF port 2.
16
VSS
Negative supply voltage.
High impedence mode.
Description
Ground.
GND
1
15
GND
17
LZ
GND
2
14
GND
18
CTRL
GND
3
13
GND
19
LS
Logic Select–used to determine the
definition for the CTRL pin (see
Table 5).
20
VDD
Positive supply voltage.
Pad
GND
Exposed pad: ground for proper operation.
Exposed
Ground Pad
9
10
GND
GND
GND
11
8
5
RFC
GND
7
RF2
GND
12
6
4
GND
RF1
Digital control logic input for selecting
ON path (see Table 5).
Note: * Ground connection. traces should be physically short and connected to the ground plane. This pin is connected to the exposed solder
pad that also must be soldered to the ground plane for best performance.
Page 22
DOC-23814-4 – (7/2017)
www.psemi.com
PE42020
UltraCMOS® True DC RF Switch
Packaging Information
This section provides packaging data including the moisture sensitivity level, package drawing, package
marking and tape-and-reel information.
Moisture Sensitivity Level
The moisture sensitivity level rating for the PE42020 in the 20-lead 4 × 4 mm QFN package is MSL3.
Package Drawing
Figure 31 • Package Mechanical Drawing for 20-lead 4 × 4 × 0.85 mm QFN
0.10 C
4.00
A
(2X)
2.15±0.05
0.28
(x20)
0.55±0.05
(x20)
B
11
15
0.75
(x20)
0.50
10
16
2.15±0.05
4.00
6
5
(2X)
0.18
0.18
TOP VIEW
4.40
1
2.00
Pin #1 Corner
2.20
20
0.23±0.05
(x20)
0.10 C
0.50
BOTTOM VIEW
0.435 SQ
REF
2.20
4.40
RECOMMENDED LAND PATTERN
0.10 C
0.10
0.05
0.85±0.05
0.05 C
C A B
C
ALL FEATURES
SEATING PLANE
0.203
SIDE VIEW
0.05
C
Top-Marking Specification
Figure 32 • Package Marking Specifications for PE42020
42020
YYWW
ZZZZZZ
= Pin 1 indicator
YY = Last two digits of assembly year
WW = Assembly work week
ZZZZZZ = Assembly lot code (maximum six characters)
DOC-23814-4 – (7/2017)
Page 23
www.psemi.com
PE42020
UltraCMOS® True DC RF Switch
Tape and Reel Specification
Figure 33 • Tape and Reel Specifications for 20-lead 4 × 4 × 0.85 mm QFN
Direction of Feed
Section A-A
P1
P0
see
note 1
T
P2
see note 3
D1
D0
A
E
F
see note 3
B0
A0
K0
A0
B0
K0
D0
D1
E
F
P0
P1
P2
T
W0
4.35
4.35
1.10
1.50 + 0.10/ -0.00
1.50 min
1.75 ± 0.10
5.50 ± 0.05
4.00
8.00
2.00 ± 0.05
0.30 ± 0.05
12.00 ± 0.30
A
W0
Pin 1
Notes:
1. 10 Sprocket hole pitch cumulative tolerance ±0.2
2. Camber in compliance with EIA 481
3. Pocket position relative to sprocket hole measured
as true position of pocket, not pocket hole
Dimensions are in millimeters unless otherwise specified
Page 24
Device Orientation in Tape
DOC-23814-4 – (7/2017)
www.psemi.com
PE42020
UltraCMOS® True DC RF Switch
Ordering Information
Table 7 lists the available ordering codes for the PE42020 as well as the available shipping methods.
Table 7 • Order Codes for PE42020
Order Codes
Description
Packaging
Shipping Method
PE42020A-X
PE42020 SPDT True DC RF Switch
Green 20-lead 4 × 4 mm QFN
500 units / T&R
EK42020-02
PE42020 Evaluation kit
Evaluation kit
1 / Box
Document Categories
Advance Information
The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and
features may change in any manner without notice.
Preliminary Specification
The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any
time without notice in order to supply the best possible product.
Product Specification
The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended
changes by issuing a CNF (Customer Notification Form).
Sales Contact
For additional information, contact Sales at sales@psemi.com.
Disclaimers
The information in this document is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be
entirely at the user’s own risk. No patent rights or licenses to any circuits described in this document are implied or granted to any third party.
Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to
support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death
might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in
such applications.
Patent Statement
Peregrine products are protected under one or more of the following U.S. patents: patents.psemi.com
Copyright and Trademark
©2014 – 2017, Peregrine Semiconductor Corporation. All rights reserved. The Peregrine name, logo, UTSi and UltraCMOS are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp.
Product Specification
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DOC-23814-4 – (7/2017)