0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
EK64906-12

EK64906-12

  • 厂商:

    PEREGRINE(游隼半导体)

  • 封装:

    -

  • 描述:

    EK64906-12

  • 数据手册
  • 价格&库存
EK64906-12 数据手册
Product Specification PE64906 UltraCMOS® Digitally Tunable Capacitor (DTC) 100 - 3000 MHz Product Description PE64906 is a DuNE™ technology-enhanced digitally tunable capacitor (DTC) based on Peregrine’s UltraCMOS® technology. This highly versatile product supports a wide variety of tuning circuit topologies with emphasis on impedance matching and aperture tuning applications. PE64906 offers high RF power handling and ruggedness while meeting challenging harmonic and linearity requirements enabled by Peregrine’s HaRP™ technology. The device is controlled through the widely supported 3-wire (SPI compatible) interface. All decoding and biasing is integrated on-chip and no external bypassing or filtering components are required. DuNE devices feature ease of use while delivering superior RF performance in the form of tuning accuracy, monotonicity, tuning ratio, power handling, size, and quality factor. With built-in bias voltage generation and ESD protection, DTC products provide a monolithically integrated tuning solution for demanding RF applications. Features  3-wire (SPI compatible) serial interface with built-in bias voltage generation and ESD protection  DuNE™ technology enhanced  5-bit 32-state digitally tunable capacitor  Shunt configuration C = 0.9 pF to 4.6 pF (5.1:1 tuning ratio) in discrete 119 fF steps  High RF power handling (30 Vpk RF) and linearity  Wide power supply range (2.3V to 4.8V) and low current consumption (typ. 140 μA at 2.75V)  High ESD tolerance of 2 kV HBM on all pins  Applications include:  Tunable antennas  Tunable matching networks  Tunable filter networks  Phase shifters Figure 1. Functional Diagram Figure 2. Package Type 10-lead 2 x 2 x 0.55 mm QFN RF- RF+ ESD Serial Interface ESD CMOS Control Driver and ESD DOC-02169 Document No. DOC-82123-3 │ www.psemi.com ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 11 PE64906 Product Specification Table 1. Electrical Specifications @ 25 °C, VDD = 2.75V (In shunt configuration, RF- connected to GND) Parameter Condition Min Typ Max Unit 3000 MHz Operating frequency 100 Minimum capacitance (Cmin) State = 00000, 100 MHz 0.81 0.9 0.99 pF Maximum capacitance (Cmax) State = 11111, 100 MHz 3.68 4.6 5.52 pF Tuning ratio Cmax/Cmin, 100 MHz 5.1:1 Step size 5 bits (32 states), 100 MHz 0.119 Quality factor at Cmin1 698–960 MHz, with LS removed 1710–2170 MHz, with LS removed 40 40 Quality factor at Cmax1 698–960 MHz, with LS removed 1710–2170 MHz, with LS removed 29 13 Self resonant frequency State 00000 State 11111 7.9 2.8 Harmonics2 2fo, 3fo: 698–915 MHz; PIN = +34 dBm, 50Ω 2fo, 3fo: 1710–1910 MHz; PIN = +32 dBm, 50Ω –36 –36 dBm dBm IMD3 Bands I,II,V/VIII, +20 dBm CW @ TX freq, –15 dBm CW @ 2TX-RX freq, 50Ω –105 dBm Third order intercept point (IP3) Shunt configuration derived from IMD3 spec IP3 = (2PTX + Pblock – IMD3) / 2 Switching time3,4 State change to 10/90% delta capacitance between any two states 12 μs Start-up time3 Time from VDD within specification to all performances within specification 70 μs Wake-up time3,4 State change from Standby mode to RF state to all performances within specification 70 μs pF GHz 65 dBm Notes: 1. Q for a shunt DTC based on a series RLC equivalent circuit Q = XC / R = (X - XL) / R, where X = XL + XC , XL = 2*pi*f*L, XC = -1 / (2*pi*f*C), which is equal to removing the effect of parasitic inductance LS 2. In shunt between 50Ω ports. Pulsed RF input with 4620 μS period, 50% duty cycle, measured per 3GPP TS 45.005 3. DC path to ground at RF– must be provided to achieve specified performance 4. State change activated on falling edge of SEN following data word ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 11 Document No. DOC-82123-3 │ UltraCMOS® RFIC Solutions PE64906 Product Specification Figure 3. Pin Configuration (Top View) Table 3. Operating Ranges Symbol Min Typ Max Unit Supply voltage VDD 2.30 2.75 4.80 V Supply current (VDD = 2.75V) IDD 140 200 μA Parameter Standby current (VDD = 2.75V) IDD Digital input high VIH 1.2 1.8 3.1 V VIL 0 0 0.57 V RF input power (50Ω) 698–915 MHz 1710–1910 MHz +34 +32 dBm dBm Peak operating RF voltage2 VP to VM VP to RFGND 30 30 Vpk Vpk Digital input low 25 μA 1 Table 2. Pin Descriptions Pin # Pin Name 1 RF- Negative RF port1 2 RF- Negative RF port1 3 GND Ground2 4 VDD Power supply pin 5 SCL Serial interface clock input 6 SEN Serial interface latch enable input 7 SDA Serial interface data input 8 RF+ Positive RF port1 9 RF+ Description Positive RF port1 Operating temperature range TOP –40 +25 +85 °C Storage temperature range TST –65 +25 +150 °C Notes: 1. Maximum power available from 50Ω source. Pulsed RF input with 4620 μS period, 50% duty cycle, measured per 3GPP TS 45.005 measured in shunt between 50Ω ports, RF- connected to GND 2. Node voltages defined per Equivalent Circuit Model Schematic (Figure 13). When DTC is used as a part of reactive network, impedance transformation may cause the internal RF voltages (VP, VM) to exceed peak operating RF voltage even with specified RF input power levels. For operation above about +20 dBm (100 mW), the complete RF circuit must be simulated using actual input power and load conditions, and internal node voltages (VP, VM in Figure 13) monitored to not exceed 30 Vpk Table 4. Absolute Maximum Ratings Parameter/Condition ESD Voltage HBM * Symbol Min VESD Max Unit 2000 V 10 GND Ground Note: * Human Body Model (MIL-STD-883 Method 3015.7) Pad GND Exposed pad: ground for proper operation2 Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. Notes: 2 1. For optimal performance, recommend tying Pins 1-2 and Pins 8-9 together on PCB 2. For optimal performance, recommend tying Pins 3, 10 and exposed ground pad together on PCB Moisture Sensitivity Level The Moisture Sensitivity Level rating for the PE64906 in the 10-lead 2 x 2 x 0.55 mm QFN package is MSL1. Electrostatic Discharge (ESD) Precautions When handling this UltraCMOS device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the specified rating. Latch-Up Avoidance Unlike conventional CMOS devices, UltraCMOS® devices are immune to latch-up. Document No. DOC-82123-3 │ www.psemi.com ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 11 PE64906 Product Specification Performance Plots @ 25 °C and 2.75V, unless otherwise specified Figure 4. Measured Shunt C (@ 100 MHz) vs State Figure 5. Measured Shunt S11 (major states) 5 Capacitance(pF) 4 C0 C1 C2 C4 C8 C15 C31 3 2 1 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 State Figure 6. Measured Step Size vs State (frequency) Frequency(800 - 900 MHz) Figure 7. Measured Shunt C vs Frequency (major states) 1000 Capacitance(fF) 800 20 100 MHz 1000 MHz 2000 MHz 700 600 500 400 300 200 100 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 State ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 11 C0 C1 C2 C4 C8 C15 C31 17.5 15 Capacitance(pF) 900 12.5 10 7.5 5 2.5 0 0 0.5 1 1.5 Frequency(GHz) Document No. DOC-82123-3 2 2.5 │ UltraCMOS® RFIC Solutions PE64906 Product Specification Figure 9. Measured Shunt Q vs State Figure 8. Measured Shunt Q vs Frequency (major states) 100 60 C0 C1 C2 C4 C8 C15 C31 80 70 Q 60 50 50 40 Q 90 698 MHz 960 MHz 1710 MHz 2170 MHz 30 40 20 30 20 10 10 0 0 0.5 1 1.5 2 Frequency(GHz) 2.5 3 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 State Figure 10. Measured Self Resonance Frequency vs State q y Self Resonance Frequency (GHz) 8 7 6 5 4 3 2 1 0 0 5 10 15 20 State [0..31] Document No. DOC-82123-3 │ www.psemi.com 25 30 ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 11 PE64906 Product Specification Serial Interface Operation and Sharing The PE64906 is controlled by a three wire SPI-compatible interface. As shown in Figure 11, the serial master initiates the start of a telegram by driving the SEN (Serial Enable) line high. Each bit of the 8-bit telegram is clocked in on the rising edge of the SCL (Serial Clock) line. SDA bits are clocked by most significant bit (MSB) first, as shown in Table 5 and Figure 11. Transactions on SDA (Serial Data) are allowed on the falling edge of SCL. The DTC activates the data on the falling edge of SEN. The DTC does not count how many bits are clocked and only maintains the last 8 bits it received. More than 1 DTC can be controlled by one interface by utilizing a dedicated enable (SEN) line for each DTC. SDA, SCL, and VDD lines may be shared as shown in Figure 12. Dedicated SEN lines act as a chip select such that each DTC will only respond to serial transactions intended for them. This makes each DTC change states sequentially as they are programmed. Alternatively, a dedicated SDA line with common SEN can be used. This allows all DTCs to change states simultaneously, but requires all DTCs to be programmed even if the state is not changed. Figure 11. Serial Interface Timing Diagram (oscilloscope view) tEOW tESU tDSU tDHD tR tF tSCL tEHD tSCLH tSCLL SEN SCL SDA DTC Data b0 b6 b7 b5 Dm-2 0 b6 1 0 1 b5 STB 2 b2 b1 b0 Dm Figure 12. Recommended Bus sharing b4 b3 b2 b1 b0 d4 d3 d2 d1 d0 MSB (first in) Notes: b3 Dm-1 Table 5. Register Map b7 b4 LSB (last in) 1. These bits are reserved and must be written to 0 for proper operation 2. The DTC is active when low (set to 0) and in low-current stand-by mode when high (set to 1) DTC 1 RF+ VDD VDD SDA SCL SEN1 SEN2 SDA SCL SEN GND DGND Table 6. Serial Interface Timing Characteristics RF- VDD = 2.75V, –40 °C < TA < +85 °C, unless otherwise specified Symbol Parameter Min Max tSCL Serial clock period 38.4 ns tSCLL SCL low time 13.2 ns tSCLH SCL high time 13.2 ns tR SCL, SDA, SEN rise time 6.5 ns tF SCL, SDA, SEN fall time 6.5 ns tESU SEN rising edge to SCL rising edge 19.2 ns tEHD SCL rising edge to SEN falling edge 19.2 ns tDSU SDA valid to SCL rising edge 13.2 ns tDHD SDA valid after SCL rising edge 13.2 ns tEOW SEN falling edge to SEN rising edge 38.4 ns ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 11 DTC 2 RF+ Unit VDD SDA SCL SEN GND DGND RF- Document No. DOC-82123-3 │ UltraCMOS® RFIC Solutions PE64906 Product Specification Table 8. Equivalent Circuit Data Equivalent Circuit Model Description The DTC Equivalent Circuit Model includes all parasitic elements and is accurate in both series and shunt configurations, reflecting physical circuit behavior accurately and providing very close correlation to measured data. It can easily be used in circuit simulation programs. For VP and VM max operating limits, refer to Table 3. Figure 13. Equivalent Circuit Model Schematic LS VP RS CS VM LS RF+ RFCP1 CP2 RP2 RP2 RP1 RP1 RFGND Table 7. Equivalent Circuit Model Parameters State Parasitic Elements DTC Core RP1 [Ω] RP2 [kΩ] 0.61 8.0 25.0 0.62 11.0 25.0 0.51 0.63 14.0 25.0 3.08 0.50 0.64 17.0 25.1 0.89 3.12 0.49 0.65 20.0 25.2 5 1.02 3.05 0.48 0.66 23.0 25.4 6 1.14 2.93 0.48 0.67 26.0 25.6 00111 7 1.27 2.78 0.47 0.68 29.0 26.0 0x08 01000 8 1.40 2.64 0.46 0.69 32.0 26.5 0x09 01001 9 1.52 2.51 0.45 0.70 35.0 27.2 0x0A 01010 10 1.65 2.39 0.45 0.71 38.0 28.0 0x0B 01011 11 1.78 2.27 0.44 0.72 41.0 29.0 0x0C 01100 12 1.90 2.17 0.43 0.73 44.0 30.2 0x0D 01101 13 2.03 2.08 0.42 0.73 47.0 31.6 0x0E 01110 14 2.16 2.00 0.42 0.74 50.0 33.2 0x0F 01111 15 2.29 1.93 0.41 0.75 53.0 35.1 Hex Bin Dec CS [pF] RS [Ω] CP1 [pF] CP2 [pF] 0x00 00000 0 0.38 1.40 0.52 0x01 00001 1 0.51 2.27 0.51 0x02 00010 2 0.63 2.83 0x03 00011 3 0.76 0x04 00100 4 0x05 00101 0x06 00110 0x07 Variable Equation (state = 0, 1, 2…31) Units 0x10 10000 16 2.41 1.86 0.40 0.76 56.0 37.3 CS 0.127*state + 0.38 pF 0x11 10001 17 2.54 1.80 0.39 0.77 59.0 39.7 RS 20/[state+20/(state+0.7)] + 0.7 Ω 0x12 10010 18 2.67 1.75 0.39 0.78 62.0 42.5 RP1 8+3*state Ω 0x13 10011 19 2.79 1.70 0.38 0.79 65.0 45.6 RP2 25000+3*state^3 Ω 0x14 10100 20 2.92 1.65 0.37 0.80 68.0 49.0 CP1 –0.0075*state+0.52 pF 0x15 10101 21 3.05 1.61 0.36 0.81 71.0 52.8 CP2 0.0096*state+0.61 pF 0x16 10110 22 3.17 1.57 0.36 0.82 74.0 56.9 LS 0.35 nH 0x17 10111 23 3.30 1.54 0.35 0.83 77.0 61.5 0x18 11000 24 3.43 1.51 0.34 0.84 80.0 66.5 0x19 11001 25 3.56 1.48 0.33 0.85 83.0 71.9 0x1A 11010 26 3.68 1.45 0.33 0.86 86.0 77.7 0x1B 11011 27 3.81 1.42 0.32 0.87 89.0 84.0 0x1C 11100 28 3.94 1.40 0.31 0.88 92.0 90.9 0x1D 11101 29 4.06 1.37 0.30 0.89 95.0 98.2 0x1E 11110 30 4.19 1.35 0.30 0.90 98.0 106.0 0x1F 11111 31 4.32 1.33 0.29 0.91 101.0 114.4 Document No. DOC-82123-3 │ www.psemi.com ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 11 PE64906 Product Specification Series Operation In series configuration, the effective capacitance between RF+ and RF- ports is represented by CS and tuning ratio as CSmax/CSmin. Figure 16. Measured Series S11/S22 (major states) S11 C0 S22 C0 S11 C1 Figure 14. Effective Capacitance Diagram S22 C1 S11 C2 S22 C2 S11 C4 S22 C4 S11 C8 S22 C8 S11 C15 S22 C15 S11 C31 Shunt configuration (looking into RF+ when RF- is grounded) will have higher total capacitance at RF+ due to parallel combination of CS with parasitic capacitance CP1 (CS + CP1), as demonstrated in Figure 15 and Table 9. Figure 17. Measured Series S21 vs. Frequency (major states) 0 -5 Figure 15. Typical Capacitance vs. State -10 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -15 dB(S21) Capacitance S22 C31 Frequency(.3 - 3000 MHz) -20 C0 C1 C2 C4 C8 C16 C31 -25 -30 0 5 10 15 Capacitance in Series Configuration (Cs) -35 Capacitance in Shunt Configuration (Cs+Cp1) -40 20 25 30 State Table 9. Effective Capacitance Summary Effective Capacitance Cmin (state 0) Series (RF+ to RF-) CS 0.38 4.32 11.4:1 Shunt (RF+ to GND) CS + CP1 0.90 4.6 5.1:1 Configuration Cmax Tuning (state 31) Ratio 0 0.5 1 1.5 2 Frequency (GHz) 2.5 3 When the DTC is used as a part of a reactive network, impedance transformation may cause the internal RF voltages (VP and VM in Figure 13) to exceed peak operating RF voltage. The complete RF circuit must be simulated using actual input power and load conditions to ensure neither VP nor VM exceeds 30 VPK. S11 and S21 for series configuration is illustrated in Figures 16 and 17. S21 includes mismatch and dissipative losses and is not indicative of tuning network loss. Equivalent Circuit Model can be used for simulation of tuning network loss. ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 8 of 11 Document No. DOC-82123-3 │ UltraCMOS® RFIC Solutions PE64906 Product Specification Layout Recommendations Evaluation Board For optimal results, place a ground fill directly under the DTC package on the PCB. Layout isolation is desired between all control and RF lines. When using the DTC in a shunt configuration, it is important to make sure the RF-pin is solidly grounded to a filled ground plane. Ground traces should be as short as possible to minimize inductance. A continuous ground plane is preferred on the top layer of the PCB. When multiple DTCs are used together, the physical distance between them should be minimized and the connection should be as wide as possible to minimize series parasitic inductance. The 101-0675 Evaluation Board (EVB) was designed for accurate measurement of the DTC impedance and loss. Two configurations are available: 1 Port Shunt (J3) and 2 Port Shunt (J4, J5). Three calibration standards are provided. The open (J2) and short (J1) standards (104 ps delay) are used for performing port extensions and accounting for electrical length and transmission line loss. The Thru (J9, J10) standard can be used to estimate PCB transmission line losses for scalar de-embedding of the 2 Port Series configuration (J4, J5). Figure 18. Recommended Schematic of Multiple DTCs The board consists of a 4 layer stack with 2 outer layers made of Rogers 4350B (εr = 3.48) and 2 inner layers of FR4 (εr = 4.80). The total thickness of this board is 62 mils (1.57 mm). The inner layers provide a ground plane for the transmission lines. Each transmission line is designed using a coplanar waveguide with ground plane (CPWG) model using a trace width of 32 mils (0.813 mm), gap of 15 mils (0.381 mm), and a metal thickness of 1.4 mils (0.051 mm). Figure 20. Evaluation Board Layout Figure 19. Recommended Layout of Multiple DTCs 101-0675 Document No. DOC-82123-3 │ www.psemi.com ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 9 of 11 PE64906 Product Specification Figure 21. Package Drawing 10-lead 2 x 2 x 0.55 mm QFN 2.00 A 0.90±0.05 (2X) B 0.25 (x10) 0.25±0.05 (x10) 0.10 C 0.45 (x10) 0.50 (x6) 6 9 0.90±0.05 2.00 0.20±0.05 (X10) 2.40 0.95 4 0.10 C 1 0.50 (2X) (x6) 0.95 2.40 1.50 Pin #1 Corner RECOMMENDED LAND PATTERN BOTTOM VIEW TOP VIEW DOC-01865 0.10 C 0.10 0.05 0.60 MAX 0.05 C C A B C ALL FEATURES SEATING PLANE 0.152 Ref. C 0.05 Notes: 1. Dimensions are in millimeters 2. Dimensions and tolerances per ASME Y14.5M, 1994 SIDE VIEW Figure 22. Top Marking Specifications PPZZ YWW 17-0112 Package Marking PP DG* ZZ 00-99 Y 0-9 WW 01-53 Definition Part number marking for PE64906 Last two digits of lot code Last digit of year, starting from 2009 (0 for 2010, 1 for 2011, etc) Work week * Note: (PP), the package marking specific to the PE64906, is shown in the figure instead of the standard Peregrine package marking symbol (P) ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 10 of 11 Marking Spec Symbol Document No. DOC-82123-3 │ UltraCMOS® RFIC Solutions PE64906 Product Specification Figure 23. Tape and Reel Specifications Tape Feed Direction Table 10. Ordering Information Order Code Description Package Shipping Method PE64906B-Z PE64906 DTC 10-lead 2x2 mm QFN 3,000 units/T&R EK64906-12 PE64906 Evaluation kit Evaluation kit 1 set/box Document Categories Disclaimers Advance Information The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and features may change in any manner without notice. The information in this document is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this document are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. Preliminary Specification The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). Patent Statement Peregrine products are protected under one or more of the following U.S. patents: patents.psemi.com. Sales Contact Copyright and Trademark For additional information, contact Sales at sales@psemi.com. ©2017, Peregrine Semiconductor Corporation. All rights reserved. The Peregrine name, logo, UTSi and UltraCMOS are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. Document No. DOC-82123-3 │ www.psemi.com ©2017 Peregrine Semiconductor Corp. All rights reserved. Page 11 of 11
EK64906-12 价格&库存

很抱歉,暂时无法提供与“EK64906-12”相匹配的价格&库存,您可以联系我们找货

免费人工找货