PE42821MLBA-X

Product Specification PE42821 UltraCMOS® SPDT RF Switch 100–2700 MHz Product Description The PE42821 is a HaRP™ technology-enhanced high power reflective SPDT RF switch designed for use in mobile radio, relay replacement and other high performance wireless applications. This switch is a pin-compatible faster switching version of the PE42820. It maintains high linearity and power handling from 100 MHz through 2.7 GHz. PE42821 also features low insertion loss and is offered in a 32-lead 5 × 5 mm QFN package. In addition, no external blocking capacitors are required if 0 VDC is present on the RF ports. The PE42821 is manufactured on Peregrine’s UltraCMOS® process, a patented variation of silicon-oninsulator (SOI) technology on a sapphire substrate. Peregrine’s HaRP technology enhancements deliver high linearity and excellent harmonics performance. It is an innovative feature of the UltraCMOS process, offering the performance of GaAs with the economy and integration of conventional CMOS. Features  High power handling  45 dBm @ 850 MHz, 32W  44 dBm @ 2 GHz, 25W  High linearity  82 dBm IIP3 @ 850 MHz  76 dBm IIP3 @ 2.7 GHz  Low insertion loss  0.35 dB @ 850 MHz  0.60 dB @ 2 GHz  Fast switching time of 4 µs     (bypass mode) Wide supply range of 2.3–5.5V +1.8V control logic compatible ESD performance  1.5 kV HBM on all pins External negative supply option Figure 2. Package Type 32-lead 5 × 5 mm QFN Figure 1. Functional Diagram DOC-52312 Document No. DOC-13714-4 │ www.psemi.com ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 12 PE42821 Product Specification Table 1. Electrical Specifications @ +25 °C (ZS = ZL = 50Ω), unless otherwise noted Normal mode1: VDD = 3.3V, VSS_EXT = 0V or Bypass mode2: VDD = 3.3V, VSS_EXT = –3.3V Parameter Insertion loss Path 3 RFC–RFX Isolation Return loss Input 0.1 dB compression point4 Unit 100 MHz–1 GHz 0.40 0.55 dB 1–2 GHz 0.60 0.80 dB 2–2.7 GHz 0.80 1.05 dB dB 1–2 GHz 26 28 dB 2–2.7 GHz 22 24 dB VDD, V1 = 0V, +27 dBm 6 dB 100 MHz–1 GHz 20 dB 1–2 GHz 13 dB 2–2.7 GHz 14 dB 2fo: +45 dBm pulsed @ 1GHz, 50Ω 3fo: +45 dBm pulsed @ 1GHz, 50Ω –82 –78 dBc –85 –81 dBc 850 MHz 2700 MHz 82 dBm RFC–RFX 76 dBm RFC–RFX 100 MHz–2 GHz 2–2.7 GHz 45.5 44.5 dBm dBm RFC–RFX Input IP3 Max 35 RFX Harmonics Typ 33 RFC–RFX 3 Switching time in normal mode1 50% CTRL to 90% or 10% RF 2 50% CTRL to 90% or 10% RF Switching time in bypass mode Settling time Min 100 MHz–1 GHz RFX–RFX Unbiased isolation Condition 7 11 4 50% CTRL to harmonics within specifications 5 15 µs µs 25 µs Notes: 1. Normal mode: single external positive supply used. 2. Bypass mode: both external positive supply and external negative supply used. 3. Performance specified with external matching. Refer to Evaluation Kit section for additional information. 4. The input 0.1dB compression point is a linearity figure of merit. Refer to Table 3 for the operating RF input power (50Ω). 5. See harmonics specs above. ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 12 Document No. DOC-13714-4 │ UltraCMOS® RFIC Solutions PE42821 Product Specification Figure 3. Pin Configuration (Top View) Table 3. Operating Ranges Pin 1 Dot Marking Parameter Symbol Min Supply voltage VDD 2.3 Supply current IDD Supply voltage Supply current Normal mode GND 1 24 GND RF1 2 23 RF2 GND 3 GND 4 GND 5 GND Bypass mode 22 GND 21 GND 20 GND 6 19 GND GND 7 18 GND 8 17 Exposed Ground Pad 1, 3–11, 14, 15, 17– 22, 24–27, 29–32 2 Pin Name GND 1 RF1 Max Unit 5.5 V 130 200 µA VDD 3.3 5.5 V IDD 50 80 µA –3.2 V 2 Negative supply voltage VSS_EXT –3.6 GND Negative supply current ISS –40 GND Normal or Bypass mode Digital input high (V1) VIH 1.17 3.63 V Digital input low (V1) VIL –0.3 0.6 V RF input power, CW 100 MHz–2 GHz >2–2.7 GHz PMAX,CW 43 42 dBm dBm RF input power, pulsed4 100 MHz–2 GHz >2–2.7 GHz PMAX,PULSED 45 44 dBm dBm 27 dBm +85 °C +140 °C Table 2. Pin Descriptions Pin # Typ 1 Description Ground RF input power, unbiased PMAX,UNB –16 µA RF port 12 VDD Supply voltage (nominal 3.3V) 13 V1 Digital control logic input 1 16 VSS_EXT2 23 RF21 RF port 28 RFC1 RF common Pad GND Exposed pad: ground for proper operation External VSS negative voltage control Operating temperature range (Case) Operating junction temperature TOP TJ –40 Notes: 1. Normal mode: connect pin 16 to GND to enable internal negative voltage generator. 2. Bypass mode: apply a negative voltage to VSS_EXT (pin 16) to bypass and disable internal negative voltage generator. 3. Maximum VIH voltage is limited to VDD and cannot exceed 3.6V. 4. Pulsed, 10% duty cycle of 4620 µs period, 50Ω. Notes: 1. RF pins 2, 23 and 28 must be at 0 VDC. The RF pins do not require DC blocking capacitors for proper operation if the 0 VDC requirement is met. 2. Use VSS_EXT (pin 16, VSS_EXT = –VDD) to bypass and disable internal negative voltage generator. Connect VSS_EXT (pin 16, VSS_EXT = GND) to enable internal negative voltage generator. Document No. DOC-13714-4 │ www.psemi.com ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 12 PE42821 Product Specification Table 5. Control Logic Truth Table Table 4. Absolute Maximum Ratings Parameter/Condition Supply voltage Digital input voltage (V1) Maximum input power 100 MHz–2 GHz >2–2.7 GHz Symbol Min Max Unit Path CTRL VDD –0.3 5.5 V RFC–RF1 H VCTRL –0.3 3.6 V RFC–RF2 L 45.5 44.5 dBm dBm +150 °C PMAX,ABS Storage temperature range TST Maximum case temperature TCASE +85 °C TJ +200 °C VESD,HBM 1500 V VESD,MM 200 V VESD,CDM 250 V Peak maximum junction temperature (10 seconds max) ESD voltage HBM1, all pins 2 ESD voltage MM , all pins 3 ESD voltage CDM , all pins –65 Notes: 1. Human Body Model (MIL-STD 883 Method 3015) 2. Machine Model (JEDEC JESD22-A115) 3. Charged Device Model (JEDEC JESD22-C101) Exceeding absolute maximum ratings may cause permanent damage. Operation should be restricted to the limits in the Operating Ranges table. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. Optional External VSS Control (VSS_EXT) For applications that require a faster switching rate or spur-free performance, this part can be operated in bypass mode. Bypass mode requires an external negative voltage in addition to an external VDD supply voltage. As specified in Table 3, the external negative voltage (VSS_EXT) when applied to pin 16 will disable and bypass the internal negative voltage generator. Switching Frequency The PE42821 has a maximum 25 kHz switching rate in normal mode (pin 16 = GND). A faster switching rate is available in bypass mode (pin 16 = VSS_EXT). The rate at which the PE42821 can be switched is then limited to the switching time as specified in Table 1. Electrostatic Discharge (ESD) Precautions When handling this UltraCMOS device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rating specified. Switching frequency describes the time duration between switching events. Switching time is the time duration between the point the control signal reaches 50% of the final value and the point the output signal reaches within 10% or 90% of its target value. Latch-Up Avoidance Spurious Performance Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up. The typical low-frequency spurious performance of the PE42821 in normal mode is –137 dBm (pin 16 = GND). If spur-free performance is desired, the internal negative voltage generator can be disabled by applying a negative voltage to VSS_EXT (pin 16). Moisture Sensitivity Level The Moisture Sensitivity Level rating for the 32lead 5x5 mm QFN package is MSL3. Hot Switching Capability The typical hot switching capability of the PE42821 is +30 dBm. Hot switching occurs when RF power is applied while switching between RF ports. ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 12 Document No. DOC-13714-4 │ UltraCMOS® RFIC Solutions PE42821 Product Specification Typical Performance Data @ +25 °C, VDD = 3.3V, VSS_EXT = 0V, unless otherwise noted Figure 4. Insertion Loss vs. Temp (RFC–RFX) Figure 5. Insertion Loss vs. VDD (RFC–RFX) Figure 6. RFC Port Return Loss vs. Temp (RF1 Active) Figure 7. RFC Port Return Loss vs. VDD (RF1 Active) Document No. DOC-13714-4 │ www.psemi.com ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 5 of 12 PE42821 Product Specification Typical Performance Data @ +25 °C, VDD = 3.3V, VSS_EXT = 0V, unless otherwise noted Figure 8. Active Port Return Loss vs. Temp (RF1 Active) Figure 9. Active Port Return Loss vs. VDD (RF1 Active) Figure 10. Isolation vs. Temp (RFC–RFX, RFX Active) Figure 11. Isolation vs. VDD (RFC–RFX, RFX Active) ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 6 of 12 Document No. DOC-13714-4 │ UltraCMOS® RFIC Solutions PE42821 Product Specification Typical Performance Data @ +25 °C, VDD = 3.3V, VSS_EXT = 0V, unless otherwise noted Figure 12. Isolation vs. Temp (RFX–RFX, RFX Active) Document No. DOC-13714-4 │ www.psemi.com Figure 13. Isolation vs. VDD (RFX–RFX, RFX Active) ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 7 of 12 PE42821 Product Specification Thermal Data Though the insertion loss for this part is very low, when handling high power RF signals, the junction temperature rises significantly. Table 6. Theta JC Parameter Theta JC (+85 °C) Min Typ 20 Max Unit C/W VSWR conditions that present short circuit loads to the part can cause significantly more power dissipation than with proper matching. Special consideration needs to be made in the design of the PCB to properly dissipate the heat away from the part and maintain the 85°C maximum case temperature. It is recommended to use best design practices for high power QFN packages: multi-layer PCBs with thermal vias in a thermal pad soldered to the slug of the package. Special care also needs to be made to alleviate solder voiding under the part. ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 8 of 12 Document No. DOC-13714-4 │ UltraCMOS® RFIC Solutions PE42821 Product Specification Evaluation Kit Figure 14. Evaluation Board Layout The PE42821 Evaluation Kit board was designed to ease customer evaluation of the PE42821 RF switch. The evaluation board in Figure 14 was designed to test the part. DC power is supplied through J10, with VDD on pin 9, and GND on the entire lower row of even numbered pins. To evaluate a switch path, add or remove jumpers on V1 (pin 3) using Table 5. The ANT port is connected through a 50Ω transmission line via the top SMA connector, J1. RF1 and RF2 paths are also connected through 50Ω transmission lines via SMA connectors as J2 and J3. A 50Ω through transmission line is available via SMA connectors J5 and J6. This transmission line can be used to estimate the loss of the PCB over the environmental conditions being evaluated. An open-ended 50Ω transmission line is also provided at J4 for calibration if needed. Narrow trace widths are used near each part to improve impedance matching. The shunt C1 on RFC port is to provide for high frequency impedance matching. PRT-10605 Document No. DOC-13714-4 │ www.psemi.com ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 9 of 12 PE42821 Product Specification Figure 15. Evaluation Board Schematic DOC-13627 ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 10 of 12 Document No. DOC-13714-4 │ UltraCMOS® RFIC Solutions PE42821 Product Specification Figure 16. Package Drawing 32-lead 5x5 mm QFN A 0.10 C (2X) 5.00 3.30±0.05 B 17 0.50 24 16 5.00 25 3.30±0.05 8 1 3.50 5.20 3.35 DETAIL A BOTTOM VIEW TOP VIEW Pin #1 Corner 3.35 32 9 0.10 C (2X) 0.50 (X28) 0.575 (x32) 3.50 0.24±0.05 (X32) 0.290 (x32) 0.375±0.05 (X32) 5.20 RECOMMENDED LAND PATTERN 0.85±0.05 DOC-01872 0.10 C 0.10 0.05 0.05 C C A B C ALL FEATURES SEATING PLANE SIDE VIEW 0.203 Ref. C 0.05 0.18 0.15 0.10 DETAIL A Figure 17. Top Marking Specification 42821 YYWW ZZZZZZ = Pin 1 indicator YYWW = Date code, last two digits of the year and work week ZZZZZZ = Six digits of the lot number 17-0085 Document No. DOC-13714-4 │ www.psemi.com ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 11 of 12 PE42821 Product Specification Figure 18. Tape and Reel Specs Pin 1 Notes: 1. 10 sprocket hole pitch cumulative tolerance ± 0.2. 2. Camber in compliance with EIA 481. 3. Pocket position relative to sprocket hole measured. as true position of pocket, not pocket hole. Top of Device Ao = 5.25 ± 0.1 mm Bo = 5.25 ± 0.1 mm Ko = 1.10 ± 0.1 mm Device Orientation in Tape Table 7. Ordering Information Order Code Description Package Shipping Method PE42821MLBA-X PE42821 SPDT RF switch Green 32-lead 5 × 5 mm QFN 500 units/T&R EK42821-02 PE42821 Evaluation kit Evaluation kit 1/Box Sales Contact and Information For sales and contact information please visit www.psemi.com. Advance Information: The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification: The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification: The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). The information in this datasheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. ©2012-2015 Peregrine Semiconductor Corp. All rights reserved. Page 12 of 12 No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, UltraCMOS and UTSi are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. Peregrine products are protected under one or more of the following U.S. Patents: http://patents.psemi.com. Document No. DOC-13714-4 │ UltraCMOS® RFIC Solutions