MB8F

Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier MB05F t hru M B10F μ VOLTAGE - 50 TO 1000 VOLTS CURRENT - 0.5 AMPERES FEATURES ● ● ● ● ● ● ● MBF ● Low profile space Ideal for automated placement Glass passivated chip junction Low forward voltage drop Low leakage current High forward surge capability High temperature soldering： 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC MECHANICAL DATA ● ● ● Case: MBF Molded plastic over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Polarity symbols marked on body MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS (TA = 25 C unless otherwise noted) ° Symbol M B05F M B1F M B2F M B4F M B6F M B8F M B10F UNIT Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward output rectified current at TA=30℃ -on glass-epoxy P.C.B(NOTE 1) -on aluminum substrate(NOTE 2) Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load(JEDEC Method) Maximum instantaneous forwad voltage drop per leg at 0.4A Maximum DC reverse current at TA = 25 ℃ rated DC blocking voltage per leg TA = 125℃ Typical junction capacitance per leg at 4.0 V ,1MHz (NOTE 1) VRRM VRMS VDC IF(AV) IFSM VF IR CJ RθJA RθJA RθJL 50 35 50 100 200 400 600 800 1000 70 140 280 420 560 700 100 200 400 600 800 1000 0.5 0.8 35 1 5.0 100 13 85 70 20 V V V A A V μA pF ℃/ W ℃ Thermal resistance per leg (NOTE 2) (NOTE 1) TJ, TSTG Operating junction and storage temperature range –55 to +150 NOTE1:On glass epoxy P.C.B. mounted on 0.05×0.05″(1.3×1.3mm) pads NOTE2:On aluminum substrate P.C.B. with an area of 0.8″×0.8″(20×20mm) mounted on 0.05×0.05″(1.3×1.3mm) solder pad Web Site: WWW.PS-PFS.COM Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier MB05F t hru M B10F VOLTAGE - 50 TO 1000 VOLTS CURRENT - 0.5 AMPERES Characteristic Curves (TA=25 ℃ unless otherwise noted) Web Site: WWW.PS-PFS.COM