74ABT540

INTEGRATED CIRCUITS 74ABT540 Octal buffer, inverting (3-State) Product specification Supersedes data of 1996 Oct 08 IC23 Data Handbook 1998 Jan 16 Philips Semiconductors Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 FEATURES • Octal bus interface • 3-State buffers • Live insertion/extraction permitted • Efficient pinout to facilitate PC board layout • Output capability: +64mA/–32mA • Latch-up protection exceeds 500mA per Jedec JC40.2 Std 17 • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V per Machine Model DESCRIPTION The 74ABT540 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT540 device is an octal inverting buffer that is ideal for driving bus lines. The device features input and outputs on opposite sides of the package to facilitate printed circuit board layout. • Power-up 3-State QUICK REFERENCE DATA SYMBOL tPLH tPHL CIN COUT ICCZ PARAMETER Propagation delay An to Yn Input capacitance Output capacitance Total supply current CONDITIONS Tamb = 25°C; GND = 0V CL = 50pF; VCC = 5V VI = 0V or VCC Outputs disabled; VO = 0V or VCC Outputs disabled; VCC = 5.5V TYPICAL 3.1 3 7 50 UNIT ns pF pF µA ORDERING INFORMATION PACKAGES 20-Pin Plastic DIP 20-Pin plastic SO 20-Pin Plastic SSOP Type II 20-Pin Plastic TSSOP Type I TEMPERATURE RANGE –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C OUTSIDE NORTH AMERICA 74ABT540 N 74ABT540 D 74ABT540 DB 74ABT540 PW NORTH AMERICA 74ABT540 N 74ABT540 D 74ABT540 DB 74ABT540PW DH DWG NUMBER SOT146-1 SOT163-1 SOT339-1 SOT360-1 PIN CONFIGURATION LOGIC SYMBOL OE0 OE0 A0 A1 A2 A3 A4 A5 A6 A7 1 2 3 4 5 6 7 8 9 20 19 18 17 16 15 14 13 12 11 VCC OE1 Y0 A1 Y1 Y2 Y3 Y4 Y5 Y6 Y7 A4 A2 OE1 A0 1 19 2 3 4 5 18 Y0 17 Y1 16 Y2 15 Y3 6 7 14 Y4 13 Y5 8 12 Y6 9 11 Y7 A3 A5 A6 A7 GND 10 SA00197 SA00198 1998 Jan 16 2 853–1609 18864 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 LOGIC SYMBOL (IEEE/IEC) PIN DESCRIPTION PIN NUMBER 2, 3, 4, 5, 6, 7, 8, 9 SYMBOL A0 – A7 Y0 – Y7 OE0, OE1 GND VCC NAME AND FUNCTION Data inputs Data outputs Output enables Ground (0V) Positive supply voltage 1 19 & EN 18, 17, 16, 15, 14, 13, 12, 11 1, 19 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 20 FUNCTION TABLE INPUTS OE0 L L X H H L X Z OE1 L L H X An L H X X OUTPUTS Yn H L Z Z SA00199 = High voltage level = Low voltage level = Don’t care = High impedance ”off” state ABSOLUTE MAXIMUM RATINGS1, 2 SYMBOL VCC IIK VI IOK VOUT IOUT Tstg PARAMETER DC supply voltage DC input diode current DC input voltage3 DC output diode current DC output voltage3 DC output current Storage temperature range VO < 0 output in Off or High state output in Low state VI < 0 CONDITIONS RATING –0.5 to +7.0 –18 –1.2 to +7.0 –50 –0.5 to +5.5 128 –65 to 150 UNIT V mA V mA V mA °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Jan 16 3 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER Min VCC VI VIH VIL IOH IOL ∆t/∆v Tamb DC supply voltage Input voltage High-level input voltage Low-level Input voltage High-level output current Low-level output current Input transition rise or fall rate Operating free-air temperature range 0 –40 4.5 0 2.0 0.8 –32 64 10 +85 LIMITS Max 5.5 VCC V V V V mA mA ns/V °C UNIT DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Tamb = +25°C Min VIK Input clamp voltage VCC = 4.5V; IIK = –18mA VCC = 4.5V; IOH = –3mA; VI = VIL or VIH VOH High-level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or VIH VCC = 4.5V; IOH = –32mA; VI = VIL or VIH VOL II IOFF IPU/IPD IOZH IOZL ICEX IO ICCH ICCL ICCZ Quiescent supply current Low-level output voltage Input leakage current Power-off leakage current Power-up/down 3-State output current3 3-State output High current 3-State output Low current Output High leakage current Output current1 VCC = 4.5V; IOL = 64mA; VI = VIL or VIH VCC = 5.5V; VI = GND or 5.5V VCC = 0.0V; VI or VO ≤ 4.5V VCC = 2.1V; VO = 0.5V; VI = GND or VCC; VOE = Don’t care VCC = 5.5V; VO = 2.7V; VI = VIL or VIH VCC = 5.5V; VO = 0.5V; VI = VIL or VIH VCC = 5.5V; VO = 5.5V; VI = GND or VCC VCC = 5.5V; VO = 2.5V VCC = 5.5V; Outputs High, VI = GND or VCC VCC = 5.5V; Outputs Low, VI = GND or VCC VCC = 5.5V; Outputs 3-State; VI = GND or VCC Outputs enabled, one input at 3.4V, other inputs at VCC or GND; VCC = 5.5V ∆ICC Additional supply current per input pin2 Outputs 3-State, one data input at 3.4V, other inputs at VCC or GND; VCC = 5.5V Outputs 3-State, one enable input at 3.4V, other inputs at VCC or GND; VCC = 5.5V –50 2.5 3.0 2.0 Typ –0.9 2.9 3.4 2.4 0.42 ±0.01 ±5.0 ±5.0 5.0 –5.0 5.0 –100 50 24 50 0.5 0.5 0.5 0.55 ±1.0 ±100 ±50 50 –50 50 –180 250 30 250 1.5 50 1.5 –50 Max –1.2 2.5 3.0 2.0 0.55 ±1.0 ±100 ±50 50 –50 50 –180 250 30 250 1.5 50 1.5 Tamb = –40°C to +85°C Min Max –1.2 V V V V V µA µA µA µA µA mA mA µA mA µA mA µA mA UNIT NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This parameter is valid for any VCC between 0V and 2.1V, with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a transition time of up to 100µsec is permitted. 1998 Jan 16 4 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 AC CHARACTERISTICS GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER WAVEFORM Min tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation delay An to Yn Output enable time to High and Low level Output disable time from High and Low level 1 2 2 1.0 1.0 1.1 1.1 1.5 1.2 Tamb = +25°C VCC = +5.0V Typ 2.9 3.1 4.1 4.6 3.6 2.9 Max 4.1 4.3 4.9 5.8 6.8 5.7 Tamb = –40°C to +85°C VCC = +5.0V ±0.5V Min 1.0 1.0 1.1 1.1 1.5 1.2 Max 4.8 4.8 5.9 6.4 7.3 6.2 ns ns ns UNIT AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V OEn INPUT An INPUT VM VM VM VM Yn OUTPUT tPZL tPLZ 3.5V tPHL tPLH VM tPZH tPHZ VOL + 0.3V VOL VOH Yn OUTPUT VM VM Yn OUTPUT VM VOH – 0.3V 0V SA00200 SA00201 Waveform 1. Waveforms Showing the Input (An) to Output (Yn) Propagation Delays Waveform 2. Waveforms Showing the 3-State Output Enable and Disable Times TEST CIRCUIT AND WAVEFORMS 7V From Output Under Test CL = 50 pF 500 Ω S1 Open GND 500 Ω Load Circuit TEST tpd tPLZ/tPZL tPHZ/tPZH S1 open 7V open DEFINITIONS Load capacitance includes jig and probe capacitance; CL = see AC CHARACTERISTICS for value. SA00012 1998 Jan 16 5 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 1998 Jan 16 6 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 1998 Jan 16 7 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 1998 Jan 16 8 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 1998 Jan 16 9 Philips Semiconductors Product specification Octal buffer, inverting (3-State) 74ABT540 Data sheet status Data sheet status Objective specification Preliminary specification Product specification Product status Development Qualification Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Production [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 © Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Document order number: Date of release: 05-96 9397-750-03471 Philips Semiconductors yyyy mmm dd 10