74HC08

INTEGRATED CIRCUITS DATA SHEET 74HC08; 74HCT08 Quad 2-input AND gate Product specification Supersedes data of 1990 Dec 01 2003 Jul 25 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 FEATURES • Complies with JEDEC standard no. 8-1A • ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. • Specified from −40 to +85 °C and −40 to +125 °C. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns. DESCRIPTION The 74HC/HCT08 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The 74HC/HCT08 provide the 2-input AND function. TYPICAL SYMBOL tPHL/tPLH CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; Σ(CL × VCC2 × fo) = sum of the outputs. 2. For 74HC08: the condition is VI = GND to VCC. For 74HCT08: the condition is VI = GND to VCC − 1.5 V. FUNCTION TABLE INPUT nA L L H H Note 1. H = HIGH voltage level; L = LOW voltage level. nB L H L H OUTPUT nY L L L H PARAMETER propagation delay nA, nB to nY input capacitance power dissipation capacitance per gate notes 1 and 2 CONDITIONS 74HC08 CL = 15 pF; VCC = 5 V 7 3.5 10 74HCT08 11 3.5 20 ns pF pF UNIT 2003 Jul 25 2 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE 74HC08N 74HCT08N 74HC08D 74HCT08D 74HC08DB 74HCT08DB 74HC08PW 74HCT08PW 74HC08BQ 74HCT08BQ PINNING PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 SYMBOL 1A 1B 1Y 2A 2B 2Y GND 3Y 3A 3B 4Y 4A 4B VCC data input data input data output data input data input data output ground (0 V) data output data input data input data output data input data input supply voltage DESCRIPTION −40 to +125 °C −40 to +125 °C −40 to +125 °C −40 to +125 °C −40 to +125 °C −40 to +125 °C −40 to +125 °C −40 to +125 °C −40 to +125 °C −40 to +125 °C PINS 14 14 14 14 14 14 14 14 14 14 PACKAGE DIP14 DIP14 SO14 SO14 SSOP14 SSOP14 TSSOP14 TSSOP14 DHVQFN14 DHVQFN14 MATERIAL plastic plastic plastic plastic plastic plastic plastic plastic plastic plastic CODE SOT27-1 SOT27-1 SOT108-1 SOT108-1 SOT337-1 SOT337-1 SOT402-1 SOT402-1 SOT762-1 SOT762-1 2003 Jul 25 3 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 handbook, halfpage handbook, halfpage 1A 1 VCC 14 13 12 4B 4A 4Y 3B 3A 1A 1B 1Y 2A 2B 2Y GND 1 2 3 4 5 6 7 MNA220 14 VCC 13 4B 12 4A 1B 1Y 2A 2B 2Y 2 3 4 5 6 7 Top view GND 8 3Y 08 11 4Y 10 3B 9 3A GND(1) 11 10 9 8 3Y MCE183 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig.1 Pin configuration DIP14, SO14 and (T)SSOP14. Fig.2 Pin configuration DHVQFN14. handbook, halfpage handbook, halfpage 1 2 & 3 1 2 4 5 9 10 12 13 1A 1B 2A 2B 3A 3B 4A 4B 1Y 3 4 & 6 2Y 6 5 3Y 8 9 10 & 8 4Y 11 12 MNA222 & 11 13 MNA223 Fig.3 Logic symbol. Fig.4 IEC logic symbol. 2003 Jul 25 4 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 A handbook, halfpage Y B MNB037 handbook, halfpage A Y B MNA221 Fig.5 HC logic diagram (one gate). Fig.6 HCT logic diagram (one gate). RECOMMENDED OPERATING CONDITIONS 74HC08 SYMBOL VCC VI VO Tamb tr, tf PARAMETER supply voltage input voltage output voltage ambient temperature input rise and fall times CONDITIONS MIN. 2.0 0 0 see DC and AC −40 characteristics per device VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V − − − TYP. 5.0 − − +25 − 6.0 − MAX. 6.0 VCC VCC +125 1000 500 400 MIN. 4.5 0 0 −40 − − − TYP. 5.0 − − +25 − 6.0 − MAX. 5.5 VCC VCC +125 − 500 − V V V °C ns ns ns 74HCT08 UNIT LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK IOK IO ICC, IGND Tstg Ptot PARAMETER supply voltage input diode current output diode current output source or sink current VCC or GND current storage temperature power dissipation DIP14 package other packages Notes 1. For DIP14 packages: above 70 °C derate linearly with 12 mW/K. 2. For SO14 packages: above 70 °C derate linearly with 8 mW/K. For SSOP14 and TSSOP14 packages: above 60 °C derate linearly with 5.5 mW/K. For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K. 2003 Jul 25 5 Tamb = −40 to +125 °C; note 1 Tamb = −40 to +125 °C; note 2 − − 750 500 mW mW VI < −0.5 V or VI > VCC + 0.5 V VO < −0.5 V or VO > VCC + 0.5 V −0.5 V < VO < VCC + 0.5 V CONDITIONS − − − − −65 MIN. −0.5 MAX. +7.0 ±20 ±20 ±25 ±50 +150 V mA mA mA mA °C UNIT Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 DC CHARACTERISTICS Family 74HC08 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL Tamb = 25 °C VIH HIGH-level input voltage 2.0 4.5 6.0 VIL LOW-level input voltage 2.0 4.5 6.0 VOH HIGH-level output voltage VI = VIH or VIL IO = −20 µA IO = −20 µA IO = −4.0 mA IO = −20 µA IO = −5.2 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA IO = 20 µA IO = 4.0 mA IO = 20 µA IO = 5.2 mA ILI IOZ ICC input leakage current VI = VCC or GND 3-state output OFF current VI = VIH or VIL; VO = VCC or GND quiescent supply current 2.0 4.5 4.5 6.0 6.0 6.0 6.0 − − − − − − − − 0 0 0.15 0 0.16 0.1 − − 0.1 0.1 0.26 0.1 0.26 ±.0.1 ±.0.5 2 V V V V V µA µA µA 2.0 4.5 4.5 6.0 6.0 1.9 4.4 3.98 5.9 5.48 2.0 4.5 4.32 6.0 5.81 − − − − − V V V V V 1.5 3.15 4.2 − − − 1.2 2.4 3.2 0.8 2.1 2.8 − − − 0.5 1.35 1.8 V V V V V V PARAMETER OTHER VCC (V) MIN. TYP. MAX. UNIT VI = VCC or GND; IO = 0 6.0 2003 Jul 25 6 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = −40 to +85 °C VIH HIGH-level input voltage 2.0 4.5 6.0 VIL LOW-level input voltage 2.0 4.5 6.0 VOH HIGH-level output voltage VI = VIH or VIL IO = −20 µA IO = −20 µA IO = −4.0 mA IO = −20 µA IO = −5.2 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA IO = 20 µA IO = 4.0 mA IO = 20 µA IO = 5.2 mA ILI IOZ ICC input leakage current VI = VCC or GND 3-state output OFF current VI = VIH or VIL; VO = VCC or GND quiescent supply current 2.0 4.5 4.5 6.0 6.0 6.0 6.0 − − − − − − − − − − − − − − − − 0.1 0.1 0.33 0.1 0.33 ±1.0 ±.5.0 20 V V V V V µA µA µA 2.0 4.5 4.5 6.0 6.0 1.9 4.4 3.84 5.9 5.34 − − − − − − − − − − V V V V V 1.5 3.15 4.2 − − − − − − − − − − − − 0.5 1.35 1.8 V V V V V V VCC (V) MIN. TYP. MAX. UNIT VI = VCC or GND; IO = 0 6.0 2003 Jul 25 7 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = −40 to +125 °C VIH HIGH-level input voltage 2.0 4.5 6.0 VIL LOW-level input voltage 2.0 4.5 6.0 VOH HIGH-level output voltage VI = VIH or VIL IO = −20 µA IO = −20 µA IO = −4.0 mA IO = −20 µA IO = −5.2 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA IO = 20 µA IO = 4.0 mA IO = 20 µA IO = 5.2 mA ILI IOZ ICC input leakage current VI = VCC or GND 3-state output OFF current VI = VIH or VIL; VO = VCC or GND quiescent supply current 2.0 4.5 4.5 6.0 6.0 6.0 6.0 − − − − − − − − − − − − − − − − 0.1 0.1 0.4 0.1 0.4 ±1.0 ±10.0 40 V V V V V µA µA µA 2.0 4.5 4.5 6.0 6.0 1.9 4.4 3.7 5.9 5.2 − − − − − − − − − − V V V V V 1.5 3.15 4.2 − − − − − − − − − − − − 0.5 1.35 1.8 V V V V V V VCC (V) MIN. TYP. MAX. UNIT VI = VCC or GND; IO = 0 6.0 2003 Jul 25 8 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 Family 74HCT08 At recommended operating conditions; voltages are referenced to GND (ground = 0). TEST CONDITIONS SYMBOL Tamb = 25 °C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL IO = −20 µA IO = −4.0 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA IO = 4.0 mA ILI IOZ input leakage current 3-state output OFF current VI = VCC or GND 4.5 4.5 5.5 − − − − 0 0.15 − − 0.1 0.26 ±0.1 ±0.5 V V µA µA 4.5 4.5 4.4 3.84 4.5 4.32 − − V V 4.5 to 5.5 4.5 to 5.5 2.0 − 1.6 1.2 − 0.8 V V PARAMETER OTHER VCC (V) MIN. TYP. MAX. UNIT VI = VIH or VIL; 5.5 VO = VCC or GND; IO = 0 VI = VCC or GND; IO = 0 VI = VCC − 2.1 V; IO = 0 5.5 4.5 to 5.5 ICC ∆ICC quiescent supply current additional supply current per input − − − 60 2 216 µA µA Tamb = −40 to +85 °C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL IO = −20 µA IO = −4.0 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA IO = 4.0 mA ILI IOZ input leakage current 3-state output OFF current VI = VCC or GND 4.5 4.5 5.5 − − − − − − − − 0.1 0.33 ±1.0 ±5.0 V V µA µA 4.5 4.5 4.4 3.84 − − − − V V 4.5 to 5.5 4.5 to 5.5 2.0 − − − − 0.8 V V VI = VIH or VIL; 5.5 VO = VCC or GND; IO = 0 VI = VCC or GND; IO = 0 VI = VCC − 2.1 V; IO = 0 5.5 4.5 to 5.5 ICC ∆ICC quiescent supply current additional supply current per input − − − − 20 270 µA µA 2003 Jul 25 9 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 TEST CONDITIONS SYMBOL Tamb = −40 to +125 °C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL IO = −20 µA IO = −4.0 mA VOL LOW-level output voltage VI = VIH or VIL IO = 20 µA IO = 4.0 mA ILI IOZ input leakage current 3-state output OFF current VI = VCC or GND 4.5 4.5 5.5 − − − − − − − − 0.1 0.4 ±1.0 ±10 V V µA µA 4.5 4.5 4.4 3.7 − − − − V V 4.5 to 5.5 4.5 to 5.5 2.0 − − − − 0.8 V V PARAMETER OTHER VCC (V) MIN. TYP. MAX. UNIT 5.5 VI = VIH or VIL; VO = VCC or GND; IO = 0 VI = VCC or GND; IO = 0 VI = VCC − 2.1 V; IO = 0 5.5 4.5 to 5.5 ICC ∆ICC quiescent supply current additional supply current per input − − − − 40 294 µA µA 2003 Jul 25 10 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 AC CHARACTERISTICS Family 74HC08 GND = 0 V; tf = tf = 6 ns; CL = 50 pF. TEST CONDITIONS SYMBOL Tamb = 25 °C tPHL/tPLH propagation delay nA, nB to nY see Figs 7 and 8 2.0 4.5 6.0 tTHL/tTLH output transition time see Figs 7 and 8 2.0 4.5 6.0 Tamb = −40 to +85 °C tPHL/tPLH propagation delay nA, nB to nY see Figs 7 and 8 2.0 4.5 6.0 tTHL/tTLH output transition time see Figs 7 and 8 2.0 4.5 6.0 Tamb = −40 to +125 °C tPHL/tPLH propagation delay nA, nB to nY see Figs 7 and 8 2.0 4.5 6.0 tTHL/tTLH output transition time see Figs 7 and 8 2.0 4.5 6.0 − − − − − − − − − − − − 135 27 23 110 22 19 ns ns ns ns ns ns − − − − − − − − − − − − 115 23 20 95 19 16 ns ns ns ns ns ns − − − − − − 25 9 7 19 7 6 90 18 15 75 15 13 ns ns ns ns ns ns PARAMETER WAVEFORMS VCC (V) MIN. TYP. MAX. UNIT 2003 Jul 25 11 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 Family 74HCT08 GND = 0 V; tf = tf = 6 ns; CL = 50 pF. TEST CONDITIONS SYMBOL Tamb = 25 °C tPHL/tPLH tTHL/tTLH propagation delay nA, nB to nY output transition time see Figs 7 and 8 4.5 see Figs 7 and 8 4.5 − − − − − − 14 7 − − − − 24 15 ns ns PARAMETER WAVEFORMS VCC (V) MIN. TYP. MAX. UNIT Tamb = −40 to +85 °C tPHL/tPLH tTHL/tTLH propagation delay nA, nB to nY output transition time see Figs 7 and 8 4.5 see Figs 7 and 8 4.5 30 19 ns ns Tamb = −40 to +125 °C tPHL/tPLH tTHL/tTLH propagation delay nA, nB to nY output transition time see Figs 7 and 8 4.5 see Figs 7 and 8 4.5 36 22 ns ns AC WAVEFORMS V handbook, halfpage I nA, nB input GND t PHL VOH nY output VOL t THL VM VM 10% VM VM t PLH 90% t TLH MNA726 74HC08: VM = 50%; VI = GND to VCC. 74HCT08: VM = 1.3 V; VI = GND to 3 V. Fig.7 Waveforms showing the input (nA, nB) to output (nY) propagation delays and the output transition times. 2003 Jul 25 12 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 handbook, halfpage VCC VI D.U.T RT CL 50 pF VO PULSE GENERATOR MGK565 Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.8 Load circuitry for switching times. 2003 Jul 25 13 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 PACKAGE OUTLINES DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 D seating plane ME A2 A L A1 c Z e b1 b 14 8 MH wM (e 1) pin 1 index E 1 7 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT27-1 REFERENCES IEC 050G04 JEDEC MO-001 JEITA SC-501-14 EUROPEAN PROJECTION A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.13 0.068 0.044 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087 ISSUE DATE 99-12-27 03-02-13 2003 Jul 25 14 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE vMA Z 14 8 Q A2 A1 pin 1 index θ Lp 1 e bp 7 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 θ inches 0.069 0.010 0.057 0.004 0.049 0.019 0.0100 0.35 0.014 0.0075 0.34 0.244 0.039 0.041 0.228 0.016 8 0o o Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 2003 Jul 25 15 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1 D E A X c y HE vM A Z 14 8 Q A2 pin 1 index Lp L 1 bp 7 wM detail X A1 (A 3) θ A e 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.4 0.9 θ 8 0o o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT337-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 2003 Jul 25 16 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 D E A X c y HE vMA Z 14 8 Q A2 pin 1 index A1 θ Lp L (A 3) A 1 e bp 7 wM detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 θ 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 2003 Jul 25 17 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm D B A A A1 E c terminal 1 index area detail X terminal 1 index area e 2 L e1 b 6 vMCAB wM C y1 C C y 1 Eh 14 7 e 8 13 Dh 0 9 X 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 3.1 2.9 Dh 1.65 1.35 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 2 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT762-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27 2003 Jul 25 18 Philips Semiconductors Product specification Quad 2-input AND gate 74HC08; 74HCT08 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes  Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2003 Jul 25 19 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2003 SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613508/03/pp20 Date of release: 2003 Jul 25 Document order number: 9397 750 11265