74HC1G125GV

INTEGRATED CIRCUITS DATA SHEET 74HC1G125; 74HCT1G125 Bus buffer/line drivers; 3-state Product specification Supersedes data of 2002 May 17 2004 Jul 27 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state FEATURES • Wide supply voltage range from 2.0 to 6.0 V • Symmetrical output impedance • High noise immunity • Low power dissipation • Balanced propagation delays • Very small 5 pins package • Output capability: bus driver. 74HC1G125; 74HCT1G125 DESCRIPTION The 74HC1G/HCT1G125 is a high-speed Si-gate CMOS device. The 74HC1G/HCT1G125 provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input pin (OE). A HIGH at pin OE causes the output as assume a high-impedance OFF-state. The bus driver output currents are equal compared to the 74HC/HCT125. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 °C; tr = tf ≤ 6.0 ns. TYPICAL SYMBOL tPHL/tPLH CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; ∑ (CL × VCC2 × fo) = sum of outputs. 2. For HC1G the condition is VI = GND to VCC. For HCT1G the condition is VI = GND to VCC − 1.5 V. FUNCTION TABLE See note 1. INPUTS OE L L H Note 1. H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. A L H X OUTPUT Y L H Z PARAMETER propagation delay A to Y input capacitance power dissipation capacitance notes 1 and 2 CONDITIONS HC1G CL = 15 pF; VCC = 5 V 9 1.5 30 HCT1G 10 1.5 27 ns pF pF UNIT 2004 Jul 27 2 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state ORDERING INFORMATION 74HC1G125; 74HCT1G125 PACKAGE TYPE NUMBER 74HC1G125GW 74HCT1G125GW 74HC1G125GV 74HCT1G125GV PINNING PIN 1 2 3 4 5 OE A GND Y VCC SYMBOL output enable input data input A ground (0 V) data output Y supply voltage DESCRIPTION TEMPERATURE RANGE −40 to +125 °C −40 to +125 °C −40 to +125 °C −40 to +125 °C PINS 5 5 5 5 PACKAGE SC-88A SC-88A SC-74A SC-74A MATERIAL plastic plastic plastic plastic CODE SOT353 SOT353 SOT753 SOT753 MARKING HM TM H25 T25 handbook, halfpage OE 1 A2 GND 3 MNA117 5 VCC handbook, halfpage 2 A Y 4 125 1 4 Y MNA118 OE Fig.1 Pin configuration. Fig.2 Logic symbol. handbook, halfpage 2 4 1 OE MNA119 handbook, halfpage A Y OE MNA120 Fig.3 IEC logic symbol. Fig.4 Logic diagram. 2004 Jul 27 3 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state RECOMMENDED OPERATING CONDITIONS 74HC1G125; 74HCT1G125 74HC1G125 SYMBOL VCC VI VO Tamb PARAMETER supply voltage input voltage output voltage operating ambient temperature input rise and fall times CONDITIONS MIN. 2.0 0 0 see DC and AC −40 characteristics per device VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V − − − TYP. 5.0 − − +25 MAX. 6.0 VCC VCC +125 74HCT1G125 UNIT MIN. 4.5 0 0 −40 TYP. 5.0 − − +25 MAX. 5.5 VCC VCC +125 V V V °C tr, tf − − − 1000 500 400 − − − − − − − 500 − ns ns ns LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK IOK IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 55 °C the value of PD derates linearly with 2.5 mW/K. PARAMETER supply voltage input diode current output diode current output source or sink current VCC or GND current storage temperature power dissipation per package for temperature range from −40 to +125 °C; note 2 VI < −0.5 V or VI > VCC + 0.5 V; note 1 VO < −0.5 V or VO > VCC + 0.5 V; note 1 −0.5 V < VO < VCC + 0.5 V; note 1 note 1 CONDITIONS MIN. −0.5 − − − − −65 − MAX. +7.0 ±20 ±20 ±12.5 ±25 +150 200 UNIT V mA mA mA mA °C mW 2004 Jul 27 4 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state DC CHARACTERISTICS 74HC1G125; 74HCT1G125 Family 74HC1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH HIGH-level input voltage VCC (V) 2.0 4.5 6.0 VIL LOW-level input voltage 2.0 4.5 6.0 VOH HIGH-level output voltage VI = VIH or VIL; IO = −20 µA VI = VIH or VIL; IO = −20 µA VI = VIH or VIL; IO = −20 µA VI = VIH or VIL; IO = −2.0 mA VI = VIH or VIL; IO = −2.6 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 20 µA VI = VIH or VIL; IO = 20 µA VI = VIH or VIL; IO = 20 µA VI = VIH or VIL; IO = 2.0 mA VI = VIH or VIL; IO = 2.6 mA ILI IOZ ICC Note 1. All typical values are measured at Tamb = 25 °C. input leakage current 3-state output current OFF-state quiescent supply current VI = VCC or GND 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 MIN. 1.5 3.15 4.2 − − − 1.9 4.4 5.9 4.13 5.63 − − − − − − − − Tamb (°C) −40 to +85 TYP.(1) 1.2 2.4 3.2 0.8 2.1 2.8 2.0 4.5 6.0 4.32 5.81 0 0 0 0.15 0.16 − − − MAX. − − − 0.5 1.35 1.8 − − − − − 0.1 0.1 0.1 0.33 0.33 1.0 5 10 −40 to +125 MIN. 1.5 3.15 4.2 − − − 1.9 4.4 5.9 3.7 5.2 − − − − − − − − MAX. − − − 0.5 1.35 1.8 − − − − − 0.1 0.1 0.1 0.4 0.4 1.0 10 20 V V V V V V V V V V V V V V V V µA µA µA UNIT VI = VIH or VIL; 6.0 VO = VCC or GND VI = VCC or GND; 6.0 IO = 0 2004 Jul 27 5 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 Family 74HCT1G At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL; IO = −20 µA VI = VIH or VIL; IO = −2.0 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 20 µA VI = VIH or VIL; IO = 2.0 mA ILI IOZ ICC ∆ICC Note 1. All typical values are measured at Tamb = 25 °C. input leakage current VI = VCC or GND 3-state output current OFF-state quiescent supply current additional supply current per input VI = VIH or VIL; VO = VCC or GND VI = VCC or GND; IO = 0 VI = VCC − 2.1 V; IO = 0 VCC (V) 4.5 to 5.5 4.5 to 5.5 4.5 4.5 4.5 4.5 5.5 5.5 5.5 4.5 to 5.5 MIN. 2.0 − 4.4 4.13 − − − − − − Tamb (°C) −40 to +85 TYP.(1) 1.6 1.2 4.5 4.32 0 0.15 − − − − MAX. − 0.8 − − 0.1 0.33 1.0 5 10 500 −40 to +125 MIN. 2.0 − 4.4 3.7 − − − − − − MAX. − 0.8 − − 0.1 0.4 1.0 10 20 850 V V V V V V µA µA µA µA UNIT 2004 Jul 27 6 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state AC CHARACTERISTICS Type 74HC1G125 GND = 0 V; tr = tf ≤ 6.0 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPHL/tPLH propagation delay A to Y see Figs 5 and 7 VCC (V) 2.0 4.5 6.0 tPZH/tPZL 3-state output enable time OE to Y 3-state output disable time OE to Y see Figs 6 and 7 2.0 4.5 6.0 see Figs 6 and 7 2.0 4.5 6.0 MIN. − − − − − − − − − 74HC1G125; 74HCT1G125 Tamb (°C) −40 to +85 TYP.(1) 24 10 8 19 9 7 18 12 11 MAX. 125 25 21 155 31 26 155 31 26 − − − − − − − − − −40 to +125 MIN. MAX. 150 30 26 190 38 32 190 38 32 ns ns ns ns ns ns ns ns ns UNIT tPHZ/tPLZ Note 1. All typical values are measured at Tamb = 25 °C. Type 74HCT1G125 GND = 0 V; tr = tf ≤ 6.0 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPHL/tPLH tPZH/tPZL propagation delay A to Y 3-state output enable time OE to Y 3-state output disable time OE to Y see Figs 5 and 7 see Figs 6 and 7 VCC (V) 4.5 4.5 MIN. − − Tamb (°C) −40 to +85 TYP.(1) 11 10 MAX. 30 35 − − −40 to +125 MIN. MAX. 36 42 ns ns UNIT tPHZ/tPLZ see Figs 6 and 7 4.5 − 11 31 − 38 ns Note 1. All typical values are measured at Tamb = 25 °C. 2004 Jul 27 7 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state AC WAVEFORMS 74HC1G125; 74HCT1G125 handbook, halfpage VI VM A input GND tPHL tPLH Y output VM MNA121 For HC1G: VM = 50%; VI = GND to VCC. For HCT1G: VM = 1.3 V; VI = GND to 3.0 V. Fig.5 The input (A) to output (Y) propagation delays. handbook, full pagewidth VI OE input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW tPHZ output HIGH-to-OFF OFF-to-HIGH GND output enabled output disabled output enabled MNA122 VM tPZL VM VOL +0.3 V tPZH VOH −0.3 V VM For HC1G: VM = 50%; VI = GND to VCC. For HCT1G: VM = 1.3 V; VI = GND to 3.0 V. Fig.6 The 3-state enable and disable times. 2004 Jul 27 8 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 handbook, halfpage VCC VI D.U.T. RT CL 50 pF MNA123 PULSE GENERATOR VO RL = 1 kΩ S1 VCC open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH open VCC GND S1 Definitions for test circuit: CL = load capacitance including jig and probe capacitance (see “AC characteristics”). RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig.7 Load circuitry for switching times. 2004 Jul 27 9 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state PACKAGE OUTLINES Plastic surface mounted package; 5 leads 74HC1G125; 74HCT1G125 SOT353 D B E A X y HE vMA 5 4 Q A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E (2) 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT353 REFERENCES IEC JEDEC EIAJ SC-88A EUROPEAN PROJECTION ISSUE DATE 97-02-28 2004 Jul 27 10 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state 74HC1G125; 74HCT1G125 Plastic surface mounted package; 5 leads SOT753 D B E A X y HE vMA 5 4 Q A A1 c 1 2 3 detail X Lp e bp wM B 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.100 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT753 REFERENCES IEC JEDEC JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 2004 Jul 27 11 Philips Semiconductors Product specification Bus buffer/line drivers; 3-state DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development 74HC1G125; 74HCT1G125 DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes  Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2004 Jul 27 12 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2004 SCA76 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R44/04/pp13 Date of release: 2004 Jul 27 Document order number: 9397 750 13725