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74LV20D

74LV20D

  • 厂商:

    PHILIPS

  • 封装:

  • 描述:

    74LV20D - Dual 4-input NAND gate - NXP Semiconductors

  • 数据手册
  • 价格&库存
74LV20D 数据手册
INTEGRATED CIRCUITS 74LV20 Dual 4-input NAND gate Product specification Supersedes data of 1997 Mar 28 IC24 Data Handbook 1998 Apr 20 Philips Semiconductors Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 FEATURES • Optimized for Low Voltage applications: 1.0 to 3.6V • Accepts TTL input levels between VCC = 2.7V and VCC = 3.6V • Typical VOLP (output ground bounce) t 0.8V @ VCC = 3.3V, • Typical VOHV (output VOH undershoot) u 2V @ VCC = 3.3V, • Output capability: standard • ICC category: SSI QUICK REFERENCE DATA GND = 0V; Tamb = 25°C; tr =tf v2.5 ns SYMBOL tPHL/tPLH CI CPD PARAMETER Propagation delay nA, nB, nC, nD to nY Input capacitance Power dissipation capacitance per gate Tamb = 25°C Tamb = 25°C DESCRIPTION The 74LV20 is a low–voltage Si–gate CMOS device and is pin and function compatible with 74HC/HCT20. The 74LV20 provides the 4–input NAND function. CONDITIONS CL = 15pF VCC = 3.3V Notes 1 and 2 TYPICAL 8 3.5 22 UNIT ns pF pF NOTES: 1 CPD is used to determine the dynamic power dissipation (PD in µW) VCC2 x fi )S (CL VCC2 fo) where: PD = CPD fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; VCC2 fo) = sum of the outputs. S (CL 2 The condition is VI = GND to VCC ORDERING INFORMATION PACKAGES 14-Pin Plastic DIL 14-Pin Plastic SO 14-Pin Plastic SSOP Type II 14-Pin Plastic TSSOP Type I TEMPERATURE RANGE –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C OUTSIDE NORTH AMERICA 74LV20 N 74LV20 D 74LV20 DB 74LV20 PW NORTH AMERICA 74LV20 N 74LV20 D 74LV20 DB 74LV20PW DH PKG. DWG. # SOT27-1 SOT108-1 SOT337-1 SOT402-1 PIN DESCRIPTION PIN NUMBER 1, 9 2, 10 3, 11 4, 12 5, 13 6, 8 7 14 SYMBOL 1A to 2A 1B to 2B NC 1C to 2C 1D to 2D 1Y to 2Y GND VCC Data inputs Data inputs No connection Data inputs Data inputs Data outputs Ground (0V) Positive supply voltage FUNCTION FUNCTION TABLE INPUTS nA L X X X H nB X L X X H nC X X L X H nD X X X L H OUTPUTS nY H H H H L NOTES: H = HIGH voltage level L = LOW voltage level X = Don’t care 1998 Apr 20 2 853–1962 19256 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 PIN CONFIGURATION LOGIC SYMBOL 1 1A 1B NC 1C 1D 1Y GND 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC 2D 2C NC 2B 2A 2Y 9 10 12 13 2 4 5 1A 1B 1Y 1C 1D 6 2A 2B 2Y 2C 2D 8 SV00360 SV00361 LOGIC SYMBOL (IEEE/IEC) LOGIC DIAGRAM 1 2 4 5 & A 6 B Y C D 9 10 12 13 & SV00363 8 SV00362 1998 Apr 20 3 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VO Tamb Input voltage Output voltage Operating ambient temperature range in free air Input rise and fall times See DC and AC characteristics VCC = 1.0V to 2.0V VCC = 2.0V to 2.7V VCC = 2.7V to 3.6V PARAMETER DC supply voltage CONDITIONS See Note1 MIN 1.0 0 0 –40 –40 – – – – – – – TYP. 3.3 – – MAX 3.6 VCC VCC +85 +125 500 200 100 UNIT V V V °C tr, tf ns/V NOTES: 1 The LV is guaranteed to function down to VCC = 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V. ABSOLUTE MAXIMUM RATINGS1, 2 In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V) SYMBOL VCC ±IIK ±IOK ±IO ±IGND, ±ICC Tstg PTOT PARAMETER DC supply voltage DC input diode current DC output diode current DC output source or sink current – standard outputs DC VCC or GND current for types with –standard outputs Storage temperature range Power dissipation per package –plastic DIL –plastic mini-pack (SO) –plastic shrink mini-pack (SSOP and TSSOP) for temperature range: –40 to +125°C above +70°C derate linearly with 12mW/K above +70°C derate linearly with 8 mW/K above +60°C derate linearly with 5.5 mW/K VI < –0.5 or VI > VCC + 0.5V VO < –0.5 or VO > VCC + 0.5V –0.5V < VO < VCC + 0.5V CONDITIONS RATING –0.5 to +4.6 20 50 25 50 –65 to +150 750 500 400 UNIT V mA mA mA mA °C mW NOTES: 1 Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2 The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Apr 20 4 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 DC CHARACTERISTICS Over recommended operating conditions voltages are referenced to GND (ground = 0V) LIMITS SYMBOL PARAMETER TEST CONDITIONS MIN VIH HIGH level Input level Input voltage VCC = 1.2V VCC = 2.0V VCC = 2.7 to 3.6V VIL LOW level Input level Input voltage VCC = 1.2V VCC = 2.0V VCC = 2.7 to 3.6V HIGH level output voltage; all outputs HIGH level output voltage; STANDARD outputs VCC = 1.2V; VI = VIH or VIL; –IO = 100µA VCC = 2.0V; VI = VIH or VIL; –IO = 100µA VCC = 2.7V; VI = VIH or VIL; –IO = 100µA VCC = 3.0V; VI = VIH or VIL; –IO = 100µA VOH VCC = 3.0V; VI = VIH or VIL; –IO = 6mA VCC = 1.2V; VI = VIH or VIL; IO = 100µA VOL LOW level output voltage; all outputs LOW level output voltage; STANDARD outputs Input leakage current Quiescent supply current; SSI Additional quiescent supply current per input VCC = 2.0V; VI = VIH or VIL; IO = 100µA VCC = 2.7V; VI = VIH or VIL; IO = 100µA VCC = 3.0V;VI = VIH or VIL; IO = 100µA VCC = 3.0V;VI = VIH or VIL; IO = 6mA 1.2 1.8 2.5 2.8 2.40 2.0 2.7 3.0 2.82 0 0 0 0 0.25 0.2 0.2 0.2 0.40 0.2 0.2 0.2 0.50 V V 1.8 2.5 2.8 2.20 V V 0.9 1.4 2.0 0.3 0.6 0.8 -40°C to +85°C TYP1 MAX -40°C to +125°C MIN 0.9 1.4 2.0 0.3 0.6 0.8 V V MAX UNIT VOH VOL II ICC ∆ICC VCC = 3.6V; VI = VCC or GND VCC = 3.6V; VI = VCC or GND; IO = 0 VCC = 2.7V to 3.6V; VI = VCC –0.6V 1.0 20.0 500 1.0 40 850 µA µA µA NOTE: 1 All typical values are measured at Tamb = 25°C. AC CHARACTERISTICS GND = 0V; tr = tf ≤ 2.5ns; CL = 50pF; RL = 1KΩ SYMBOL PARAMETER WAVEFORM CONDITION VCC(V) 1.2 tPHL/tPLH Propagation delay g y nA, nB, nC, nD to nY Figures 1, 2 2.0 2.7 3.0 to 3.6 NOTE: 1 Unless otherwise stated, all typical values are at Tamb = 25°C. 2 Typical value measured at VCC = 3.3V. MIN – – – – LIMITS –40 to +85 °C TYP1 50 17 13 102 MAX – 32 24 19 LIMITS –40 to +125 °C MIN – – – – MAX – 39 29 23 ns UNIT 1998 Apr 20 5 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 AC WAVEFORMS VM = 1.5V at VCC w 2.7V v 3.6V VM = 0.5V * VCC at VCC t 2.7V VOL and VOH are the typical output voltage drop that occur with the output load. TEST CIRCUIT VCC VI PULSE GENERATOR VI nA, nB, nC, nD INPUT GND tPHL VOH nY OUTPUT VM TEST VOL tPLH/tPHL < 2.7V 2.7–3.6V VCC 2.7V VCC VI tPLH VM RT D.U.T. VO 50pF CL RL = 1k Test Circuit for switching times DEFINITIONS RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators. SV00364 Figure 1.Input (nA, nB, nC, nD) to output (nY) propagation delays. SV00901 Figure 2. Load circuitry for switching times 1998 Apr 20 6 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 1998 Apr 28 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 1998 Apr 28 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1 1998 Apr 28 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 1998 Apr 28 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 NOTES 1998 Apr 28 Philips Semiconductors Product specification Dual 4-input NAND gate 74LV20 DEFINITIONS Data Sheet Identification Objective Specification Product Status Formative or in Design Definition This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Preliminary Specification Preproduction Product Product Specification Full Production Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 © Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Document order number: Date of release: 05-96 9397-750-044011 Philips Semiconductors 1998 Apr 28
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