74LV368DB

INTEGRATED CIRCUITS 74LV368 Hex buffer/line driver; inverting (3-State) Product specification Supersedes data of 1997 Apr 07 IC24 Data Handbook 1998 May 29 Philips Semiconductors Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 FEATURES • Optimized for Low Voltage applications: 1.0 to 3.6V • Accepts TTL input levels between VCC = 2.7V and VCC = 3.6V • Typical VOLP (output ground bounce) t 0.8V @ VCC = 3.3V, • Typical VOHV (output VOH undershoot) u 2V @ VCC = 3.3V, • Inverting outputs • Output capability: bus driver • ICC category: SSI QUICK REFERENCE DATA GND = 0V; Tamb = 25°C; tr =tf v2.5 ns SYMBOL tPHL/tPLH CI CPD PARAMETER Propagation delay nA to nY Input capacitance Power dissipation capacitance per buffer Tamb = 25°C Tamb = 25°C DESCRIPTION The 74LV368 a low–voltage Si–gate CMOS device and is pin and function compatible with 74HC/HCT368. The 74LV368 is a hex inverting buffer/line driver with 3–state outputs. The 3–state outputs (nY) are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high impedance OFF–state. CONDITIONS CL = 15pF VCC = 3.3V Notes 1, 2 TYPICAL 9.0 3.5 30 UNIT ns pF pF NOTES: 1 CPD is used to determine the dynamic power dissipation (PD in µW) VCC2 x fi )S (CL VCC2 fo) where: PD = CPD fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V; VCC2 fo) = sum of the outputs. S (CL 2 The condition is VI = GND to VCC ORDERING INFORMATION PACKAGES 16-Pin Plastic DIL 16-Pin Plastic SO 16-Pin Plastic SSOP Type II 16-Pin Plastic TSSOP Type I TEMPERATURE RANGE –40°C to +125°C –40°C to +125°C –40°C to +125°C –40°C to +125°C OUTSIDE NORTH AMERICA 74LV368 N 74LV368 D 74LV368 DB 74LV368 PW NORTH AMERICA 74LV368 N 74LV368 D 74LV368 DB 74LV368PW DH PKG. DWG. # SOT38-4 SOT109-1 SOT338-1 SOT403-1 1998 May 29 2 853–1966 19466 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 PIN CONFIGURATION LOGIC SYMBOL (IEEE/IEC) 1 EN 1OE 1A 1Y 2A 2Y 3A 3Y GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC 2OE 6A 6Y 5A 5Y 4A 4Y 2 4 6 10 3 5 7 9 15 EN 12 14 11 13 SV00373 SV00374 PIN DESCRIPTION PIN NUMBER 1, 15 2, 4, 6, 10, 12, 14 3, 5, 7, 9, 11, 13 8 16 SYMBOL 1OE to 2OE 1A to 6A 1Y to 6Y GND VCC FUNCTION Output enable inputs (active LOW) Data inputs Bus outputs Ground (0V) Positive supply voltage LOGIC SYMBOL 2 1A 1Y 3 4 2A 2Y 5 6 3A 3Y 7 10 4A 4Y 9 1 1OE 5Y 11 12 5A 14 6A 6Y 13 15 2OE SV00375 1998 May 29 3 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 FUNCTIONAL DIAGRAM FUNCTION TABLE INPUTS nOE nA L H X OUTPUT nY H L Z 2 1A 1Y 3 L L H NOTES: H = HIGH voltage level L = LOW voltage level X = Don’t care Z = High impedance OFF-state 4 2A 2Y 5 6 3A 3Y 7 10 4A 4Y 9 1 1OE 12 5A 5Y 11 14 6A 6Y 13 15 2OE SV00376 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VO Tamb tr, tf Input voltage Output voltage Operating ambient temperature range in free air Input rise and fall times See DC and AC characteristics VCC = 1.0V to 2.0V VCC = 2.0V to 2.7V VCC = 2.7V to 3.6V PARAMETER DC supply voltage CONDITIONS See Note1 MIN 1.0 0 0 –40 –40 – – – – – – TYP. 3.3 – – MAX 3.6 VCC VCC +85 +125 500 200 100 UNIT V V V °C ns/V NOTES: 1 The LV is guaranteed to function down to VCC = 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V. ABSOLUTE MAXIMUM RATINGS1, 2 In accordance with the Absolute Maximum Rating System (IEC 134); Voltages are referenced to GND (ground = 0V) SYMBOL VCC ±IIK ±IOK ±IO ±IGND, ±ICC Tstg PTOT PARAMETER DC supply voltage DC input diode current DC output diode current DC output source or sink current – bus driver outputs DC VCC or GND current for types with –bus driver outputs Storage temperature range Power dissipation per package –plastic DIL –plastic mini-pack (SO) –plastic shrink mini-pack (SSOP and TSSOP) for temperature range: –40 to +125°C above +70°C derate linearly with 12mW/K above +70°C derate linearly with 8 mW/K above +60°C derate linearly with 5.5 mW/K VI < –0.5 or VI > VCC + 0.5V VO < –0.5 or VO > VCC + 0.5V –0.5V < VO < VCC + 0.5V CONDITIONS RATING –0.5 to +4.6 20 50 35 70 –65 to +150 750 500 400 UNIT V mA mA mA mA °C mW NOTES: 1 Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2 The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 May 29 4 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 DC CHARACTERISTICS FOR THE LV FAMILY Over recommended operating conditions voltages are referenced to GND (ground = 0V) LIMITS SYMBOL PARAMETER TEST CONDITIONS MIN VIH HIGH level Input level Input voltage VCC = 1.2V VCC = 2.0V VCC = 2.7 to 3.6V VIL LOW level Input level Input voltage VCC = 1.2V VCC = 2.0V VCC = 2.7 to 3.6V HIGH level output voltage; all outputs HIGH level output voltage; BUS driver outputs VCC = 1.2V; VI = VIH or VIL; –IO = 100µA VCC = 2.0V; VI = VIH or VIL; –IO = 100µA VCC = 2.7V; VI = VIH or VIL; –IO = 100µA VCC = 3.0V; VI = VIH or VIL; –IO = 100µA VOH VCC = 3.0V;VI = VIH or VIL; –IO = 8mA VCC = 1.2V; VI = VIH or VIL; IO = 100µA VOL LOW level output voltage; all outputs LOW level output voltage; BUS driver outputs Input leakage current 3-State output OFF-state current Quiescent supply current; MSI Additional quiescent supply current per input VCC = 2.0V; VI = VIH or VIL; IO = 100µA VCC = 2.7V; VI = VIH or VIL; IO = 100µA VCC = 3.0V;VI = VIH or VIL; IO = 100µA VOL II IOZ ICC ∆ICC VCC = 3.0V;VI = VIH or VIL; IO = 8mA VCC = 3.6V; VI = VCC or GND VCC = 3.6V; VI = VIH or VIL; VO = VCC or GND VCC = 3.6V; VI = VCC or GND; IO = 0 VCC = 2.7V to 3.6V; VI = VCC –0.6V 1.2 1.8 2.5 2.8 2.40 2.0 2.7 3.0 2.82 0 0 0 0 0.20 0.2 0.2 0.2 0.40 1.0 5 20.0 500 0.2 0.2 0.2 0.50 1.0 10 160 850 V µA µA µA µA V 1.8 2.5 2.8 2.20 V V 0.9 1.4 2.0 0.3 0.6 0.8 -40°C to +85°C TYP1 MAX -40°C to +125°C MIN 0.9 1.4 2.0 0.3 0.6 0.8 V V MAX UNIT VOH NOTE: 1 All typical values are measured at Tamb = 25°C. 1998 May 29 5 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 AC CHARACTERISTICS GND = 0V; tr = tf = 2.5ns; CL = 50pF; RL = 1KΩ SYMBOL PARAMETER WAVEFORM CONDITION VCC(V) 1.2 tPZL/tPLH Propagation delay g y nA, to nY Figures, 1, 3 2.0 2.7 3.0 to 3.6 1.2 tPZH/tPZL 3-State output enable time time nOE to nY Figures, 2, 3 2.0 2.7 3.0 to 3.6 1.2 tPHZ/tPLZ 3-State output disable time time nOE to nY Figures, 2, 3 2.0 2.7 3.0 to 3.6 NOTE: 1 Unless otherwise stated, all typical values are at Tamb = 25°C. 2 Typical value measured at VCC = 3.3V. MIN – – – – – – – – – – – – LIMITS –40 to +85 °C TYP1 55 19 14 102 75 26 19 142 90 32 24 192 MAX – 36 26 21 – 49 36 29 – 59 44 36 LIMITS –40 to +125 °C MIN – – – – – – – – – – – – MAX – 44 33 26 – 60 44 35 – 70 52 42 ns ns ns UNIT AC WAVEFORMS VM = 1.5V at VCC w 2.7V VM = 0.5V * VCC at VCC t 2.7V VOL and VOH are the typical output voltage drop that occur with the output load. VX = VOL + 0.3V at VCC w 2.7V VX = VOL + 0.1 * VCC at VCC < 2.7V VY = VOH – 0.3V at VCC w 2.7V VY = VOH – 0.1VCC at VCC < 2.7V VI nA, nB INPUT GND tPHL VOH nY OUTPUT VM tPLH VM VOH OUTPUT HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled outputs enabled VI OE INPUT GND tPLZ VCC OUTPUT LOW-to-OFF OFF-to-LOW VOL tPHZ VY VM VX tPZH tPZL VM VM SV00344 VOL SV00377 Figure 2. 3-State enable and disable times Figure 1.Input (nA) to output (nY) propagation delay 1998 May 29 6 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 TEST CIRCUIT VCC S1 2 * VCC Open GND VI PULSE GENERATOR RT D.U.T. VO RL = 1k 50pF CL RL = 1k Test Circuit for switching times DEFINITIONS RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators. SWITCH POSITION TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH S1 Open 2 < VCC GND VCC < 2.7V 2.7–3.6V VI VCC 2.7V SV00895 Figure 3. Load circuitry for switching times 1998 May 29 7 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 1997 Apr 02 8 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 1997 Apr 02 9 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 1997 Apr 02 10 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3-State) 74LV368 TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 1997 Apr 02 11 Philips Semiconductors Product specification Hex buffer/line driver; inverting (3–State) 74LV368 DEFINITIONS Data Sheet Identification Objective Specification Product Status Formative or in Design Definition This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Preliminary Specification Preproduction Product Product Specification Full Production Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 © Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Document order number: Date of release: 05-96 9397-750-04446 Philips Semiconductors 1997 Apr 07 12