74LVC1G332GV

74LVC1G332 Single 3-input OR gate Rev. 01 — 11 October 2006 Product data sheet 1. General description The 74LVC1G332 is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V applications. Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall time. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. The 74LVC1G332 provides one 3-input OR function. 2. Features I Wide supply voltage range from 1.65 V to 5.5 V I High noise immunity I Complies with JEDEC standard: N JESD8-7 (1.65 V to 1.95 V) N JESD8-5 (2.3 V to 2.7 V) N JESD8B/JESD36 (2.7 V to 3.6 V) I ±24 mA output drive (VCC = 3.0 V) I CMOS low power consumption I Latch-up performance exceeds 250 mA I Direct interface with TTL levels I Inputs accept voltages up to 5 V I ESD protection: N HBM JESD22-A114-D exceeds 2000 V N MM JESD22-A115-A exceeds 200 V N CDM JESD22-C101-C exceeds 1000 V I Multiple package options I Specified from −40 °C to +85 °C and −40 °C to +125 °C NXP Semiconductors 74LVC1G332 Single 3-input OR gate 3. Ordering information Table 1. Ordering information Package Temperature range 74LVC1G332GW 74LVC1G332GV 74LVC1G332GM 74LVC1G332GF −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C −40 °C to +125 °C Name SC-88 SC-74 XSON6 XSON6 Description plastic surface-mounted package; 6 leads plastic surface-mounted package (TSOP6); 6 leads Version SOT363 SOT457 Type number plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 × 1.45 × 0.5 mm plastic extremely thin small outline package; no leads; SOT891 6 terminals; body 1 × 1 × 0.5 mm 4. Marking Table 2. Marking Marking code YG YG YG YG Type number 74LVC1G332GW 74LVC1G332GV 74LVC1G332GM 74LVC1G332GF 5. Functional diagram B 3 1 6 B A C 001aad933 Y 4 1 3 6 1 4 A C Y 001aad934 001aad935 Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 2 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate 6. Pinning information 6.1 Pinning 74LVC1G332 74LVC1G332 A GND 1 2 6 5 C GND VCC B B 3 001aaf473 A 1 6 C A GND 74LVC1G332 1 2 3 6 5 4 C VCC Y 2 5 VCC 3 4 Y B 4 Y 001aaf474 001aaf475 Transparent top view Transparent top view Fig 4. Pin configuration SOT363 (SC-88) and SOT457 (SC-74) Fig 5. Pin configuration SOT886 (XSON6) Fig 6. Pin configuration SOT891 (XSON6) 6.2 Pin description Table 3. Symbol A GND B Y VCC C Pin description Pin 1 2 3 4 5 6 Description data input A ground (0 V) data input B data output Y supply voltage data input C 7. Functional description Table 4. Input A H X X L [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care. Function table[1] Output B X H X L C X X H L Y H H H L 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 3 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IO ICC IGND Ptot Tstg [1] [2] [3] Parameter supply voltage input clamping current input voltage output clamping current output voltage output current supply current ground current total power dissipation storage temperature Conditions VI < 0 V [1] Min −0.5 −0.5 [1][2] [1][2] Max +6.5 −50 +6.5 ±50 VCC + 0.5 +6.5 ±50 100 −100 250 +150 Unit V mA V mA V V mA mA mA mW °C VO > VCC or VO < 0 V Active mode Power-down mode VO = 0 V to VCC −0.5 −0.5 - Tamb = −40 °C to +125 °C [3] −65 The input and output voltage ratings may be exceeded if the input and output current ratings are observed. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. For SC-88 packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K. 9. Recommended operating conditions Table 6. Symbol VCC VI VO Tamb ∆t/∆V Recommended operating conditions Parameter supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 1.65 V to 2.7 V VCC = 2.7 V to 5.5 V Active mode VCC = 0 V; Power-down mode Conditions Min 1.65 0 0 0 −40 0 0 Typ Max 5.5 5.5 VCC 5.5 +125 20 10 Unit V V V V °C ns/V ns/V 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 4 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate 10. Static characteristics Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol VIH Parameter HIGH-level input voltage Conditions VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOH HIGH-level output voltage VI = VIH or VIL IO = −100 µA; VCC = 1.65 V to 5.5 V IO = −4 mA; VCC = 1.65 V IO = −8 mA; VCC = 2.3 V IO = −12 mA; VCC = 2.7 V IO = −24 mA; VCC = 3.0 V IO = −32 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V II IOFF ICC ∆ICC CI VIH input leakage current supply current additional supply current input capacitance HIGH-level input voltage VCC = 0 V to 5.5 V; VI = 5.5 V or GND VCC = 1.65 V to 5.5 V; VI = VCC or GND; IO = 0 A per pin; VCC = 2.3 V to 5.5 V; VI = VCC − 0.6 V; IO = 0 A VCC = 3.3 V; VI = GND to VCC VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V 74LVC1G332_1 Min 0.65 × VCC 1.7 2.0 0.7 × VCC VCC − 0.1 1.2 1.9 2.2 2.3 3.8 0.65 × VCC 1.7 2.0 0.7 × VCC - Typ[1] Max ±0.1 ±0.1 0.1 5 3 0.35 × VCC 0.7 0.8 0.3 × VCC 0.1 0.45 0.3 0.4 0.55 0.55 ±5 ±10 10 500 0.35 × VCC 0.7 0.8 0.3 × VCC Unit V V V V V V V V V V V V V V V V V V V V µA µA µA µA pF V V V V V V V V 5 of 15 Tamb = −40 °C to +85 °C power-off leakage current VCC = 0 V; VI or VO = 5.5 V Tamb = −40 °C to +125 °C © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 NXP Semiconductors 74LVC1G332 Single 3-input OR gate Table 7. Static characteristics …continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol VOH Parameter Conditions IO = −100 µA; VCC = 1.65 V to 5.5 V IO = −4 mA; VCC = 1.65 V IO = −8 mA; VCC = 2.3 V IO = −12 mA; VCC = 2.7 V IO = −24 mA; VCC = 3.0 V IO = −32 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 µA; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V II IOFF ICC ∆ICC input leakage current supply current additional supply current VCC = 0 V to 5.5 V; VI = 5.5 V or GND VCC = 1.65 V to 5.5 V; VI = VCC or GND; IO = 0 A per pin; VCC = 2.3 V to 5.5 V; VI = VCC − 0.6 V; IO = 0 A power-off leakage current VCC = 0 V; VI or VO = 5.5 V 0.1 0.70 0.45 0.60 0.80 0.80 ±100 ±200 200 5000 V V V V V V µA µA µA µA Min VCC − 0.1 0.95 1.7 1.9 2.0 3.4 Typ[1] Max Unit V V V V V V HIGH-level output voltage VI = VIH or VIL [1] All typical values are measured at VCC = 3.3 V and Tamb = 25 °C. 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 8. Symbol Parameter tpd Conditions [2] −40 °C to +85 °C Min Typ[1] Max −40 °C to +125 °C Unit Min Max propagation delay A, B and C to Y; see Figure 7 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 1.5 1.0 1.0 1.0 1.0 4.7 3.0 3.0 2.6 1.9 17.2 6.2 6.0 4.8 3.5 1.5 1.0 1.0 1.0 1.0 21.5 7.8 7.5 6.2 4.4 ns ns ns ns ns 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 6 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 8. Symbol Parameter CPD power dissipation capacitance Conditions VI = GND to VCC; VCC = 3.3 V [3] −40 °C to +85 °C Min Typ[1] 12 Max - −40 °C to +125 °C Unit Min Max pF [1] [2] [3] Typical values are measured at Tamb = 25 °C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively. tpd is the same as tPLH and tPHL. CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(CL × VCC2 × fo) = sum of outputs. 12. AC waveforms VI A, B, C input GND t PHL VOH Y output VOL VM 001aad936 VM t PLH Measurement points are given in Table 9. VOL and VOH are typical output voltage drops that occur with the output load. Fig 7. The input A, B and C to output Y propagation delays Table 9. VCC 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V Measurement points Input VM 0.5 × VCC 0.5 × VCC 1.5 V 1.5 V 0.5 × VCC Output VM 0.5 × VCC 0.5 × VCC 1.5 V 1.5 V 0.5 × VCC Supply voltage 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 7 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate VEXT VCC PULSE GENERATOR VI DUT RT CL RL RL VO mna616 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance; should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 8. Load circuitry for switching times Table 10. VCC 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V Test data Input VI VCC VCC 2.7 V 2.7 V VCC tr = t f ≤ 2.0 ns ≤ 2.0 ns ≤ 2.5 ns ≤ 2.5 ns ≤ 2.5 ns Load CL 30 pF 30 pF 50 pF 50 pF 50 pF RL 1 kΩ 500 Ω 500 Ω 500 Ω 500 Ω VEXT tPLH, tPHL open open open open open Supply voltage 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 8 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate 13. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 9. Package outline SOT363 (SC-88) 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 9 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate Plastic surface-mounted package (TSOP6); 6 leads SOT457 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 c 1 2 3 Lp e bp wM B detail X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.1 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT457 REFERENCES IEC JEDEC JEITA SC-74 EUROPEAN PROJECTION ISSUE DATE 05-11-07 06-03-16 Fig 10. Package outline SOT457 (SC-74) 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 10 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× L1 L (2) e 6 e1 5 e1 4 6× (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 Fig 11. Package outline SOT886 (XSON6) 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 11 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm SOT891 1 2 b 3 L1 e L 6 e1 5 e1 4 A A1 D E terminal 1 index area 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 max 0.04 b 0.20 0.12 D 1.05 0.95 E 1.05 0.95 e 0.55 e1 0.35 L 0.35 0.27 L1 0.40 0.32 OUTLINE VERSION SOT891 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-03-11 05-04-06 Fig 12. Package outline SOT891 (XSON6) 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 12 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate 14. Abbreviations Table 11. Acronym CDM CMOS DUT ESD HBM MM TTL Abbreviations Description Charged Device Model Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic 15. Revision history Table 12. Revision history Release date 20061011 Data sheet status Product data sheet Change notice Supersedes Document ID 74LVC1G332_1 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 13 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate 16. Legal information 16.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com 74LVC1G332_1 © NXP B.V. 2006. All rights reserved. Product data sheet Rev. 01 — 11 October 2006 14 of 15 NXP Semiconductors 74LVC1G332 Single 3-input OR gate 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 October 2006 Document identifier: 74LVC1G332_1