BAP51-04W

DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D102 BAP51-04W General purpose PIN diode Preliminary specification 2002 Feb 19 Philips Semiconductors Preliminary specification General purpose PIN diode FEATURES • Two elements in series configuration in a small SMD plastic package • Low diode capacitance • Low diode forward resistance. APPLICATIONS handbook, halfpage BAP51-04W PINNING PIN 1 2 3 3 DESCRIPTION anode cathode common connection 3 • General RF applications. 1 2 DESCRIPTION Two planar PIN diodes in series configuration in a SOT323 small SMD plastic package. 1 Top view Marking code: W6- 2 MAM391 Fig.1 Simplified outline (SOT323) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode VR IF Ptot Tstg Tj continuous reverse voltage continuous forward current total power dissipation storage temperature junction temperature Ts = 90 °C − − − −65 −65 50 50 240 +150 +150 V mA mW °C °C PARAMETER CONDITIONS MIN. MAX. UNIT 2002 Feb 19 2 Philips Semiconductors Preliminary specification General purpose PIN diode ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL Per diode VF VR IR Cd forward voltage reverse voltage reverse current diode capacitance IF = 50 mA IR = 10 µA VR = 50 V VR = 0; f = 1 MHz VR = 1 V; f = 1 MHz VR = 5 V; f = 1 MHz rD diode forward resistance IF = 0.5 mA; f = 100 MHz; note 1 IF = 1 mA; f = 100 MHz; note 1 IF = 10 mA; f = 100 MHz; note 1 τL charge carrier life time when switched from IF = 10 mA to IR = 6 mA; RL = 100 Ω; measured at IR = 3 mA IF = 10 mA; f = 100 MHz − 50 − − − − − − − − PARAMETER CONDITIONS MIN. BAP51-04W TYP. MAX. UNIT 0.95 − − 0.4 0.3 0.2 5.5 3.6 1.5 550 1.1 − 100 − 0.55 0.35 9 6.5 2.5 − V V nA pF pF pF Ω Ω Ω ns LS Note series inductance − 1.6 − nH 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to soldering point VALUE 250 UNIT K/W 2002 Feb 19 3 Philips Semiconductors Preliminary specification General purpose PIN diode GRAPHICAL DATA BAP51-04W 102 handbook, halfpage rD (Ω) 10 MLD507 handbook, halfpage 500 Cd MLD508 (fF) 400 300 200 1 100 10−1 10−1 1 10 IF (mA) 102 0 0 4 8 12 16 VR (V) 20 f = 100 MHz; T j = 25 °C. f = 100 MHz; T j = 25 °C. Fig.2 Forward resistance as a function of forward current; typical values. Fig.3 Diode capacitance as a function of reverse voltage; typical values. MGS659 handbook, halfpage |S | 2 0 21 (dB) − 0.5 handbook, halfpage s2 0 MLD509 21 (dB) −10 (1) (2) (3) −1 −20 −1.5 −30 −2 −40 − 2.5 0.5 (1) I F = 10 mA. (2) I F = 1 mA (3) I F = 0.5 mA 1 1.5 2 2.5 f (GHz) 3 −50 0.5 1 1.5 2 2.5 f (GHz) 3 Diode inserted in series with a 50 Ω stripline circuit and biased via the analyzer Tee network. T amb = 25 °C. Diode zero biased and inserted in series with a 50 Ω stripline circuit. T amb = 25 °C. Fig.4 Insertion loss ( |s21|2) of the diode as a function of frequency; typical values. Fig.5 Isolation (|s21|2) of the diode as a function of frequency; typical values. 2002 Feb 19 4 Philips Semiconductors Preliminary specification General purpose PIN diode PACKAGE OUTLINE BAP51-04W Plastic surface mounted package; 3 leads SOT323 D B E A X y HE vMA 3 Q A A1 c 1 e1 e bp 2 wM B Lp detail X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.4 0.3 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.23 0.13 v 0.2 w 0.2 OUTLINE VERSION SOT323 REFERENCES IEC JEDEC EIAJ SC-70 EUROPEAN PROJECTION ISSUE DATE 97-02-28 2002 Feb 19 5 Philips Semiconductors Preliminary specification General purpose PIN diode DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS BAP51-04W This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2002 Feb 19 6 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. SCA73 The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613512/01/pp7 Date of release: 2 002 Feb 19 Document order number: 9397 750 09456