BAT54VV

BAT54VV Schottky barrier triple diode in ultra small SOT666 package Rev. 01 — 14 September 2004 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier triple diode with an integrated guard ring for stress protection. Three electrically isolated Schottky barrier diodes, encapsulated in a SOT666 ultra small SMD plastic package. 1.2 Features s s s s Low forward voltage Ultra small SMD plastic package Low capacitance Flat leads: excellent coplanarity and improved thermal behavior. 1.3 Applications s s s s Ultra high-speed switching Voltage clamping Line termination Inverse-polarity protection. 1.4 Quick reference data Table 1: Symbol VR IF Quick reference data Parameter continuous reverse voltage continuous forward current Conditions Min Typ Max 30 200 Unit V mA 2. Pinning information Table 2: Pin 1 2 3 4 5 6 Pinning Description anode (diode 1) anode (diode 2) anode (diode 3) cathode (diode 3) 1 2 3 sym046 Simplified outline 6 5 4 Symbol 6 5 4 cathode (diode 2) cathode (diode 1) 1 2 3 SOT666 Philips Semiconductors BAT54VV Schottky barrier triple diode in ultra small SOT666 package 3. Ordering information Table 3: Ordering information Package Name BAT54VV Description plastic surface mounted package; 6 leads Version SOT666 Type number 4. Marking Table 4: BAT54VV Marking codes Marking code C6 Type number 5. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode VR IF IFRM IFSM Ptot Tj Tamb Tstg [1] [2] Parameter continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current total power dissipation junction temperature ambient temperature storage temperature Conditions Min - Max 30 200 300 600 170 125 +125 +150 Unit V mA mA mA mW °C °C °C tp ≤ 1 s; δ ≤ 0.5 tp < 10 ms Tamb ≤ 25 °C [1] [2] −65 −65 Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. Single diode loaded. 6. Thermal characteristics Table 6: Symbol Rth(j-a) [1] [2] Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1] [2] Min - Typ - Max 590 Unit K/W Refer to SOT666 standard mounting conditions. Reflow soldering is the only recommended soldering method. 9397 750 13524 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 14 September 2004 2 of 9 Philips Semiconductors BAT54VV Schottky barrier triple diode in ultra small SOT666 package 7. Characteristics Table 7: Characteristics Tamb = 25 °C unless otherwise specified. Symbol Per diode VF forward voltage see Figure 1; IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA IR Cd [1] [1] Parameter Conditions Min Typ Max Unit - - 240 320 400 500 800 2 10 mV mV mV mV mV µA pF reverse current diode capacitance Pulse test: tp ≤ 300 µs; δ ≤ 0.02. VR = 25 V; see Figure 2 VR = 1 V; f = 1 MHz; see Figure 3 9397 750 13524 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 14 September 2004 3 of 9 Philips Semiconductors BAT54VV Schottky barrier triple diode in ultra small SOT666 package 103 IF (mA) 102 (1) (2) (3) msa892 103 IR (µA) 102 (2) (1) msa893 10 10 1 (1) (2) (3) 1 (3) 10−1 0 0.4 0.8 VF (V) 1.2 10−1 0 10 20 VR (V) 30 (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. Fig 1. Forward current as a function of forward voltage; typical values. Fig 2. Reverse current as a function of reverse voltage; typical values. msa891 15 Cd (pF) 10 5 0 0 10 20 VR (V) 30 Tamb = 25 °C; f = 1 MHz. Fig 3. Diode capacitance as a function of reverse voltage; typical values. 9397 750 13524 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 14 September 2004 4 of 9 Philips Semiconductors BAT54VV Schottky barrier triple diode in ultra small SOT666 package 8. Package outline Plastic surface mounted package; 6 leads SOT666 D A E X S YS HE 6 5 4 pin 1 index A 1 e1 e 2 bp 3 wMA Lp detail X c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1 OUTLINE VERSION SOT666 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 01-01-04 01-08-27 Fig 4. Package outline SOT666. 9397 750 13524 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 14 September 2004 5 of 9 Philips Semiconductors BAT54VV Schottky barrier triple diode in ultra small SOT666 package 9. Packing information Table 8: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number BAT54VV [1] Package SOT666 Description 4 mm pitch, 8 mm tape and reel Packing quantity 4000 -115 For further information and the availability of packing methods, see Section 14. 9397 750 13524 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 14 September 2004 6 of 9 Philips Semiconductors BAT54VV Schottky barrier triple diode in ultra small SOT666 package 10. Revision history Table 9: Revision history Release date 20040914 Data sheet status Product data sheet Change notice Doc. number 9397 750 13524 Supersedes Document ID BAT54VV_1 9397 750 13524 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 14 September 2004 7 of 9 Philips Semiconductors BAT54VV Schottky barrier triple diode in ultra small SOT666 package 11. Data sheet status Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). III Product data Production [1] [2] [3] Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 12. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 13. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 14. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com 9397 750 13524 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 14 September 2004 8 of 9 Philips Semiconductors BAT54VV Schottky barrier triple diode in ultra small SOT666 package 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 2 3 5 6 7 8 8 8 8 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 14 September 2004 Document number: 9397 750 13524 Published in The Netherlands