BGM1011

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage MBD128 BGM1011 MMIC wideband amplifier Preliminary specification 2002 Jan 14 Philips Semiconductors Preliminary specification MMIC wideband amplifier FEATURES • Internally matched to 50 Ω • Very high gain (up to 37 dB at 2 Ghz) • Sloped gain curve for optimal performance with output into lossy cable • 14 dBm saturated output power at 1 GHz • High linearity (23 dBm IP3(out) at 1 GHz) • 40 dB isolation APPLICATIONS • LNB IF amplifiers • Cable systems • General purpose. 1 2 3 MAM455 BGM1011 PINNING PIN 1 2, 5 3 4 6 VS GND2 RF out GND1 RF in DESCRIPTION 6 5 4 1 6 3 4 2, 5 DESCRIPTION Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package. Top view Marking code: C1-. Fig.1 Simplified outline (SOT363) and symbol. QUICK REFERENCE DATA SYMBOL VS IS |s21|2 NF PL(sat) PARAMETER DC supply voltage DC supply current insertion power gain noise figure saturated load power f = 1 GHz f = 1 GHz f = 1 GHz CONDITIONS 5 25.5 30 4.7 13.8 TYP. 6 − − − − MAX. V mA dB dB dBm UNIT LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) SYMBOL VS IS Ptot Tstg Tj PD PARAMETER DC supply voltage supply current total power dissipation storage temperature operating junction temperature maximum drive power CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B. Ts ≤ 90 °C CONDITIONS RF input AC coupled − − − −65 − − MIN. 6 35 200 +150 150 0 MAX. UNIT V mA mW °C °C dBm 2002 Jan 14 2 Philips Semiconductors Preliminary specification MMIC wideband amplifier THERMAL RESISTANCE SYMBOL Rth j-s PARAMETER CONDITIONS BGM1011 VALUE 300 UNIT K/W thermal resistance from junction to solder point Ptot = 200 mW; Ts ≤ 90 °C CHARACTERISTICS VS = 5 V; IS = 25.5 mA; Tj = 25 °C unless otherwise specified. SYMBOL IS |s21 |2 PARAMETER supply current insertion power gain f = 100 MHz f = 1 GHz f = 1.8 GHz f = 2.2 GHz f = 2.6 GHz f = 3 GHz RL IN RL OUT NF BW K PL(sat) PL 1 dB IP3(in) IP3(out) return losses input return losses output noise figure bandwidth stability factor saturated load power load power input intercept point output intercept point f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz at |s21|2 −3 dB below flat gain at 1 GHz f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz at 1 dB gain compression; f = 1 GHz at 1 dB gain compression; f = 2.2 GHz f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz CONDITIONS − − − − − − − − − − − − − − − − − − − − − − − MIN. 20 TYP. 25.5 25 30 35 37 32 28 11 8 18 12 4.7 4.6 2.9 1.8 0.9 13.8 10.8 12.2 7.7 −7 −20 23 16 MAX. 32 − − − − − − − − − − − − − − − − − − − − − − − UNIT mA dB dB dB dB dB dB dB dB dB dB dB dB GHz − − dBm dBm dBm dBm dBm dBm dBm dBm 2002 Jan 14 3 Philips Semiconductors Preliminary specification MMIC wideband amplifier APPLICATION INFORMATION BGM1011 Figure 2 shows a typical application circuit for the BGM1011 MMIC. The device is internally matched to 50 Ω, and therefore does not need any external matching. The value of the input and output DC blocking capacitors C1, C2 should be not more than 100 pF for applications above 100 MHz. Their values can be used to fine tune the input and output impedance. However, when the device is operated below 100 MHz, the capacitor value should be increased. The nominal value of the RF choke, L1 is 100 nH. At frequencies below 100 MHz this value should be increased to 200 nH. At frequencies between 1 and 3 GHz a much lower value must be used (e.g. 18 nH) to improve return losses. For optimal results, a good quality chip inductor such as the TDK MLG 1608 (0603), or a wire-wound SMD type should be chosen. Capacitor, C4 and resistor, R1 are added for optimal supply decoupling. Both the RF choke, L1 and the 22 nF supply decoupling capacitor, C3 should be located as closely as possible to the MMIC. Separate paths must be used for the ground planes of the ground pins GND1, GND2, and these paths must be as short as possible. When using vias, use multiple vias per pin in order to limit ground path inductance. Vs C4 1 [Vs] R1 L1 C3 C1 RF in 6 [In] Fig.2 Typical application circuit BGM1011 SOT363 C2 RF out 3 [Out] 4 [GND1] 2,5 [GND2] Fig.2 Typical application circuit List of components used for the typical application; an amplifier for LNB IF output. COMPONENT C1, C2 C3 C4 R1 L1 DESCRIPTION multilayer ceramic chip capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor SMD resistor SMD inductor 100 pF 22 nF 5.6 pF 10 Ω 10 to 200 nH VALUE DIMENSIONS. 0603 0603 0603 0603 0603 2002 Jan 14 4 Philips Semiconductors Preliminary specification MMIC wideband amplifier BGM1011 90° +1 135° +0.5 45° +2 1.0 0.8 0.6 +0.2 +5 0 180° 0.2 0.5 3GHz 1 100MHz 2 5 0° 0 0.4 0.2 -0.2 -5 -2 -135° I S = 25.5 mA; VS = 5.0 V; PD = −35 dBm; ZO = 50 Ω. -0.5 -1 -45° 1.0 -90° Fig.3 Input reflection coefficient (s11); typical values. 90 ° +1 135 ° +0.5 45 ° +2 1.0 0.8 0.6 +0.2 3GHz 100MHz 0.4 0.2 0 180 ° 0.2 1 2 5 0° 0 +5 -0.2 -5 -135 ° I S = 25.5 mA; VS = 5.0 V; PD = −35 dBm; ZO = 50 Ω. -0.5 -1 -2 -45 ° 1.0 -90 ° Fig.4 Output reflection coefficient (s22); typical values. 2002 Jan 14 5 Philips Semiconductors Preliminary specification MMIC wideband amplifier BGM1011 0 |s12|2 (dB) -10 40 2 |s21| (dB) 35 (2) (3) -20 (1) 30 -30 25 -40 -50 0 1000 2000 f (MHz) 3000 20 0 1000 2000 f (MHz) 3000 I S = 25.5 mA; VS = 5.0 V; PD = −35 dBm; ZO = 50 Ω. PD = −35 dBm; ZO = 50 Ω. (1) I S = 19.5 mA; VS= 4.5 V (2) I S = 25.5 mA; VS= 5.0 V (3) I S = 29.8 mA; VS= 5.5 V Fig.5 Isolation (|s12|2) as a function of frequency; typical values. Fig.6 Insertion gain (|s21|2) as a function of frequency; typical values. 20 PL (dBm) 15 (3) (2) (1) 15 PL (dBm) (3) 10 (2) (1) 10 5 5 0 0 -30 -25 -20 -15 -10 -5 0 PD (dBm) -5 -40 -35 -30 -25 -20 -15 -10 -5 0 PD (dBm) f = 1 GHz; ZO = 50 Ω. (1) VS= 4.5 V (2) VS= 5.0 V (3) VS= 5.5 V f = 2.2 GHz; Z O = 50 Ω. (1) VS= 4.5 V (2) VS= 5.0 V (3) VS= 5.5 V Fig.7 Load power as a function of drive power at 1 GHz; typical values. Fig.8 Load power as a function of drive power at 2.2 GHz; typical values. 2002 Jan 14 6 Philips Semiconductors Preliminary specification MMIC wideband amplifier BGM1011 6 NF (dB) 5.5 (3) 5 K 4 3 5 2 (2) 4.5 (1) 1 4 0 1000 2000 3000 f (MHz) 0 0 1000 2000 3000 f (MHz) ZO = 50 Ω. (1) I S = 19.5 mA; VS= 4.5 V (2) I S = 25.5 mA; VS= 5.0 V (3) I S = 29.8 mA; VS= 5.5 V IS = 25.5 mA; V S = 5.0 V; ZO = 50 Ω. Fig.9 Noise figure as a function of frequency; typical values. Fig.10 Stability factor as a function of frequency; typical values. 2002 Jan 14 7 Scattering parameters: VS = 5.0 V; IS = 25.5 mA; PD = −35 dBm; ZO = 50 Ω; Tamb = 25 °C s21 MAGNITUDE (ratio) 17.83811 18.52172 20.26048 4.7 13.8 29.73953 35.11364 42.13907 50.8261 60.12684 67.60676 67.08784 56.50393 41.27266 31.24721 23.98115 154.16 0.014548 55.48 164.33 0.013946 50.499 178.27 0.013803 52.913 −160.5 0.013121 46.727 −131.3 0.011761 49.659 0.26347 0.28137 0.30823 0.33170 0.37422 −100.2 0.010019 42.512 0.24156 −73.19 0.008713 44.601 0.21778 −52.69 0.007684 33.26 0.18642 −36.83 0.007313 23.979 0.15786 −33.18 −44.12 −65.13 −100.6 −146.8 173.89 151.71 136.52 130.13 −24.67 0.008254 9.695 0.13665 −25.66 −14.9 0.009534 0.12032 −0.816 −15.72 −7.408 0.010391 0.10619 1.087 −5.884 −1.373 0.011953 0.10301 30.828 1.7 1.8 1.7 1.7 1.6 1.4 1.1 0.9 0.9 0.9 1.0 1.2 1.3 −9.388 4.008 0.014492 −9.722 0.13121 63.715 1.6 12.011 0.017526 3.391 0.22343 80.749 1.4 24.366 0.01974 16.631 0.32582 75.129 1.2 ANGLE (deg) MAGNITUDE (ratio) ANGLE (deg) MAGNITUDE (ratio) ANGLE (deg) KFACTOR s12 s22 s11 2002 Jan 14 f (MHz) MAGNITUDE (ratio) ANGLE(d eg) 100 0.36264 13.342 Philips Semiconductors 200 0.36374 0.954 400 0.36404 −11.09 600 0.35160 −19.36 800 0.32818 −26.32 1000 0.29729 −29.66 MMIC wideband amplifier 1200 0.25490 −31.1 1400 0.20591 −24.6 1600 0.18024 −4.547 1800 0.23153 16.758 2000 0.32983 16.643 2200 0.39031 4.096 8 2400 0.34466 −8.496 2600 0.25915 −10.05 2800 0.21573 −1.301 3000 0.20270 12.698 Preliminary specification BGM1011 Philips Semiconductors Preliminary specification MMIC wideband amplifier PACKAGE OUTLINE BGM1011 Plastic surface mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC EIAJ SC-88 EUROPEAN PROJECTION ISSUE DATE 97-02-28 2002 Jan 14 9 Philips Semiconductors Preliminary specification MMIC wideband amplifier DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS BGM1011 This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2002 Jan 14 10 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. SCA73 The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613516/02/pp11 Date of release: 2 002 Jan 14 Document order number: 9397 750 09297