BGU7005

BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo Rev. 4 — 6 May 2011 Product data sheet 1. Product profile 1.1 General description The BGU7005 is a Low Noise Amplifier (LNA) for GNSS receiver applications in a plastic leadless 6-pin, extremely small SOT886 package. The BGU7005 requires only one external matching inductor and one external decoupling capacitor. The BGU7005 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption and optimal performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 16.5 dB gain at a noise figure of 0.85 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Covers full GNSS L1 band, from 1559 MHz to 1610 MHz Noise figure (NF) = 0.85 dB Gain 16.5 dB High input 1 dB compression point Pi(1dB) of −11 dBm High out of band IP3i of 9 dBm Supply voltage 1.5 V to 2.85 V Power-down mode current consumption < 1 μA Optimized performance at low supply current of 4.5 mA Integrated matching for the output Requires only one input matching inductor and one supply decoupling capacitor Input and output DC decoupled ESD protection on all pins (HBM > 2 kV) Integrated temperature stabilized bias for easy design Small 6-pin leadless package 1 mm × 1.45 mm × 0.5 mm 110 GHz transit frequency - SiGe:C technology NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 1.3 Applications LNA for GPS in automotive applications like Toll Collection and Emergency Call. LNA for GPS in smart phones, feature phones, tablet PCs, Personal Navigation Devices, Digital Still Cameras, Digital Video Cameras, RF Front End modules, complete GPS chipset modules and theft protection (laptop, ATM). 1.4 Quick reference data Table 1. Quick reference data f = 1559 MHz to 1610 MHz; VCC = 1.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter VCC ICC supply voltage supply current Conditions RF input AC coupled VENABLE ≥ 0.8 V Pi < −40 dBm Pi = −20 dBm Gp NF power gain noise figure Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pi < −40 dBm, no jammer Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pi(1dB) input power at 1 dB gain compression f = 1575 MHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V IP3i input third-order intercept point f = 1.575 GHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V [1] [2] [3] PCB losses are subtracted. Including PCB losses. f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = −30 dBm. [3] [3] [3] [1] [2] Min Typ Max Unit 1.5 3.2 8.1 14 15 4.5 2.85 V 5.7 mA dB dB dB dB dB dBm dBm dBm dBm dBm dBm 11.6 14.4 mA 16.5 19 17.5 20 0.85 1.2 0.9 1.2 1.3 1.6 - −15 −12 −14 −11 −11 −8 5 5 5 8 9 12 2. Pinning information Table 2. Pin 1 2 3 4 5 6 Pinning Description GND GND RF_IN VCC ENABLE RF_OUT 6 5 bottom view 4 2 1 sym129 Simplified outline 1 2 3 Graphic symbol 4 5 3 6 BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 2 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 3. Ordering information Table 3. Ordering information Package Name BGU7005 XSON6 Description Version plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 × 1.45 × 0.5 mm Type number 4. Marking Table 4. BGU7005 Marking codes Marking code AC Type number 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VENABLE VRF_IN Parameter supply voltage voltage on pin ENABLE voltage on pin RF_IN Conditions RF input AC coupled VCC ≥ 2.5 V VCC < 2.5 V DC VCC ≥ 3.0 V VCC < 3.0 V VRF_OUT voltage on pin RF_OUT DC VCC ≥ 1.8 V VCC < 1.8 V Pi Ptot Tstg Tj [1] [2] [3] [3] [2][3] [3] [2][3] [2] Min −0.5 −0.5 −0.5 −0.5 −0.5 −0.5 −0.5 - Max 3.1 3.1 VCC + 0.6 3.6 VCC + 0.6 3.6 VCC + 1.8 0 55 150 150 Unit V V V V V V V dBm mW °C °C input power total power dissipation storage temperature junction temperature Tsp is the temperature at the soldering point of the emitter lead. Tsp ≤ 130 °C [1] −65 - Due to internal ESD diode protection, the applied voltage should not exceed the specified maximum in order to avoid excess current. The RF input and RF output are AC coupled through internal DC blocking capacitor. 6. Thermal characteristics Table 6. Symbol Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Typ 225 Unit K/W BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 3 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 7. Characteristics Table 7. Characteristics f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE ≥ 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter VCC ICC supply voltage supply current Conditions RF input AC coupled VENABLE ≥ 0.8 V Pi < −40 dBm Pi = −20 dBm VENABLE ≤ 0.35 V Tamb Gp ambient temperature power gain Tamb = 25 °C Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pjam = −20 dBm; fjam = 850 MHz Pjam = −20 dBm; fjam = 1850 MHz −40 °C ≤ Tamb ≤ +85 °C Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pjam = −20 dBm; fjam = 850 MHz Pjam = −20 dBm; fjam = 1850 MHz RLin RLout ISL NF input return loss output return loss isolation noise figure Tamb = 25 °C Pi < −40 dBm, no jammer Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pjam = −20 dBm; fjam = 850 MHz Pjam = −20 dBm; fjam = 1850 MHz −40 °C ≤ Tamb ≤ +85 °C Pi < −40 dBm, no jammer Pi = −20 dBm, no jammer Pjam = −20 dBm; fjam = 850 MHz Pjam = −20 dBm; fjam = 1850 MHz 1.7 1.9 1.8 2.0 dB dB dB dB [1] [2] Min Typ 1.5 3.2 8.1 4.5 - Max Unit 2.85 V 5.7 1 +85 mA μA °C dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB 11.6 14.4 mA −40 +25 14 15 15 15 13 14 14 14 5 6 10 10 20 - 16.5 19 17.5 20 17.5 20 17.5 20 8 10 20 14 23 20 21 21 21 - Pi < −40 dBm Pi = −20 dBm Pi < −40 dBm Pi = −20 dBm 0.85 1.2 0.9 1.2 1.1 1.3 1.3 1.6 1.5 1.7 BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 4 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS Table 7. Characteristics …continued f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE ≥ 0.8 V; Pi < −40 dBm; Tamb = 25 °C; input matched to 50 Ω using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Pi(1dB) Conditions VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V f = 806 MHz to 928 MHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V f = 1612 MHz to 1909 MHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V IP3i input third-order intercept point f = 1.575 GHz VCC = 1.5 V VCC = 1.8 V VCC = 2.85 V ton toff K [1] [2] [3] [4] [5] [4] [4] [4] [5] [5] [3] [3] [3] [3] [3] [3] Min Typ −15 −12 −14 −11 −11 −8 −15 −12 −14 −11 −14 −11 −13 −10 −12 −9 −10 −7 5 5 5 1 8 9 12 - Max Unit 2 1 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm μs μs input power at 1 dB gain compression f = 1575 MHz turn-on time turn-off time Rollett stability factor PCB losses are subtracted. Including PCB losses. Out of band. f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = −30 dBm. Within 10 % of the final gain. Table 8. ENABLE (pin 5) −40 °C ≤ Tamb ≤ +85 °C; 1.5 V ≤ VCC ≤ 2.85 V VENABLE (V) ≤ 0.35 ≥ 0.8 State OFF ON BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 5 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 8. Application information 8.1 GNSS LNA Ven Vcc C1 RFin 5 L1 3 IC1 4 1 6 RFout 2 001aak685 For a list of components see Table 9. Fig 1. Schematics GNSS LNA evaluation board Table 9. List of components For schematics see Figure 1. Component C1 IC1 L1 Description decoupling capacitor BGU7005 high quality matching inductor Value 1 nF 5.6 nH Supplier various NXP Murata LQW15A Remarks 6 ICC (mA) 5 001aak688 6 ICC (mA) 5 001aak689 (1) (2) (3) (3) (2) (1) 4 4 3 1.0 1.5 2.0 2.5 3.0 3.5 VCC (V) 3 −55 −15 25 65 105 Tamb (°C) Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Pi = −45 dBm. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 2. Supply current as a function of supply voltage; typical values Fig 3. Supply current as a function of ambient temperature; typical values BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 6 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 20 Gp (dB) 16 001aak690 20 Gp (dB) 16 001aak691 12 (1) (2) 12 (4) (3) 8 (3) 8 (2) (1) 4 4 0 500 1000 1500 2000 2500 3000 f (MHz) 0 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C VCC = 1.8 V; Tamb = 25 °C. (1) Pi = −45 dBm (2) Pi = −30 dBm (3) Pi = −20 dBm (4) Pi = −15 dBm Fig 4. Power gain as a function of frequency; typical values Fig 5. Power gain as a function of frequency; typical values 18 Gp (dB) (3) 001aak692 20 Gp (dB) 17 Gp (3) (2) (1) (3) (2) (1) 001aak693 20 ICC (mA) 15 12 (2) (1) 14 ICC 6 11 10 5 0 500 1000 1500 2000 2500 3000 f (MHz) 8 −50 −40 −30 −20 −10 0 Pi (dBm) 0 Pi = −45 dBm; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 6. Power gain as a function of frequency; typical values Fig 7. Power gain as a function of input power; typical values BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 7 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 1.6 NF (dB) 1.2 001aao101 1.6 NF (dB) 1.2 001aak694 0.8 0.8 0.4 0.4 0 1550 1564 1578 1592 1606 1620 f (MHz) 0 1.2 1.6 2.0 2.4 2.8 3.2 VCC (V) f = 1575 MHz; Tamb = 25 °C; no jammer. f = 1575 MHz; Tamb = 25 °C; no jammer. Fig 8. Noise figure as a function of supply voltage; typical values Fig 9. Noise figure as a function of ambient temperature; typical values 1.6 NF (dB) 1.2 001aak695 4 NF (dB) 3 001aak696 0.8 2 (3) 0.4 1 (2) (1) 0 −50 −20 10 40 70 100 Tamb (°C) 0 −50 −40 −30 −20 −10 0 Pjam (dBm) f = 1575 MHz; VCC = 1.8 V; no jammer. fjam= 850 MHz; Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 10. Noise figure as a function of ambient temperature; typical values Fig 11. Noise figure as a function of jamming power; typical values BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 8 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 4 NF (dB) 3 001aak697 0 RLin (dB) −3 001aak698 −6 2 −9 (3) 1 (2) (1) −12 (1) (2) (3) 0 −50 −40 −30 −20 −10 0 Pjam (dBm) −15 500 1000 1500 2000 2500 3000 f (MHz) fjam= 1850 MHz; Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 12. Noise figure as a function of jamming power; typical values Fig 13. Input return loss as a function of frequency; typical values 0 RLin (dB) −3 (1) 001aak699 0 RLin (dB) −3 001aak700 −6 (2) (3) (4) −6 −9 −9 (1) −12 −12 (2) (3) −15 500 1000 1500 2000 2500 3000 f (MHz) −15 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 °C. (1) Pi = −45 dBm (2) Pi = −30 dBm (3) Pi = −20 dBm (4) Pi = −15 dBm Pi = −45 dBm; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 14. Input return loss as a function of frequency; typical values Fig 15. Input return loss as a function of frequency; typical values BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 9 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 0 RLin (dB) −3 001aak701 0 RLout (dB) −4 (1) (2) (3) 001aak702 −6 −8 −9 (1) (2) (3) −12 −12 −16 −15 −50 −40 −30 −20 −10 0 Pi (dBm) −20 500 1000 1500 2000 2500 3000 f (MHz) Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 16. Input return loss as a function of input power; typical values Fig 17. Output return loss as a function of frequency; typical values 0 RLout (dB) −4 001aak703 0 RLout (dB) −4 001aak704 −8 −8 −12 (4) −12 −16 (3) (2) (1) −16 (1) (2) (3) −20 500 1000 1500 2000 2500 3000 f (MHz) −20 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 °C. (1) Pi = −45 dBm (2) Pi = −30 dBm (3) Pi = −20 dBm (4) Pi = −15 dBm Pi = −45 dBm; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 18. Output return loss as a function of frequency; typical values Fig 19. Output return loss as a function of frequency; typical values BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 10 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 0 RLout (dB) −4 001aak705 0 ISL (dB) −10 (1) (2) 001aak706 −8 −20 −12 (1) (2) (3) (3) −16 −30 −20 −50 −40 −30 −20 −10 0 Pi (dBm) −40 500 1000 1500 2000 2500 3000 f (MHz) Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 20. Output return loss as a function of input power; typical values Fig 21. Isolation as a function of frequency; typical values 0 ISL (dB) −10 (4) (3) (2) (1) 001aak707 0 ISL (dB) −10 (1) (2) (3) 001aak708 −20 −20 −30 −30 −40 500 1000 1500 2000 2500 3000 f (MHz) −40 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 °C. (1) Pi = −45 dBm (2) Pi = −30 dBm (3) Pi = −20 dBm (4) Pi = −15 dBm Pi = −45 dBm; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V Fig 22. Isolation as a function of frequency; typical values Fig 23. Isolation as a function of frequency; typical values BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 11 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 0 ISL (dB) −10 (1) (2) (3) 001aak709 0 Pi(1dB) (dBm) −4 001aak710 −8 (3) (2) (1) −20 −12 −30 −16 −40 −50 −40 −30 −20 −10 0 Pi (dBm) −20 1.2 1.6 2.0 2.4 2.8 3.2 VCC (V) Tamb = 25 °C; f = 1575 MHz. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V f = 850 MHz. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 24. Isolation as a function of input power; typical values Fig 25. Input power at 1 dB gain compression as a function of supply voltage; typical values 0 Pi(1dB) (dBm) −4 001aak711 0 Pi(1dB) (dBm) 001aak716 (3) (2) (1) −4 (3) (2) (1) −8 −8 −12 −12 −16 −16 −20 1.2 1.6 2.0 2.4 2.8 3.2 VCC (V) −20 1.2 1.6 2.0 2.4 2.8 3.2 VCC (V) f = 1850 MHz. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C f = 1575 MHz. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 26. Input power at 1 dB gain compression as a function of supply voltage; typical values Fig 27. Input power at 1 dB gain compression as a function of supply voltage; typical values BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 12 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 20 IMD3, PL (dBm) 0 −20 −40 −60 −80 001aak717 PL of 1713 MHz signal 20 IMD3, PL (dBm) 0 −20 −40 001aak718 (1) (2) (3) PL of 1713 MHz signal (1) (2) (3) IMD3 of 1575 MHz signal IMD3 of 1575 MHz signal −60 −80 (1) (2) (3) (1) (2) (3) −100 −120 −40 −100 −120 −40 −35 −30 −25 −20 −15 Pi (dBm) −35 −30 −25 −20 −15 Pi (dBm) f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; Tamb = 25 °C. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; VCC = 1.8 V. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 28. Third order intermodulation distortion and output power as function of input power; typical values Fig 29. Third order intermodulation distortion and output power as function of input power; typical values 102 (3) 001aak719 102 K (3) (2) (1) 001aak720 K (2) (1) 10 10 1 1 10−1 0 2000 4000 6000 8000 10000 f (MHz) 10−1 0 2000 4000 6000 8000 10000 f (MHz) Tamb = 25 °C; Pi = −45 dBm. (1) VCC = 1.5 V (2) VCC = 1.8 V (3) VCC = 2.85 V VCC = 1.8 V; Pi = −45 dBm. (1) Tamb = −40 °C (2) Tamb = +25 °C (3) Tamb = +85 °C Fig 30. Rollett stability factor as a function of frequency; typical values Fig 31. Rollett stability factor as a function of frequency; typical values BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 13 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 8.2 GPS front-end The GPS LNA is typically used in a GPS front-end. A GPS front-end application circuit and its characteristics is provided here. Ven Vcc C1 RFin BPF1 L1 5 3 IC1 4 1 BPF2 6 RFout 2 001aak721 For a list of components see Table 10. Fig 32. Schematics GPS front-end evaluation board Table 10. List of components For schematics see Figure 32. Component BPF1, BPF2 Description GPS SAW filter Value Supplier Murata SAFEA1G57KE0F00 Remarks Alternatives from Epcos: • • • • • C1 IC1 L1 decoupling capacitor BGU7005 high quality matching inductor 1 nF Various NXP B9444 SAFEA1G57KH0F00 SAFEA1G57KB0F00 FAR-F6KA-1G5754-L4AA FAR-F6KA-1G5754-L4AJ Alternatives from Murata: Alternatives from Fujitsu: 5.6 nH Murata LQW15A 8.3 Characteristics GPS front-end Table 11. Characteristics GPS front-end f = 1575 MHz; VCC = 1.8 V; VENABLE ≥ 0.8 V; power at LNA input Pi < −40 dBm; Tamb = 25 °C; input and output matched to 50 Ω; unless otherwise specified. Symbol Parameter VCC ICC Tamb Gp RLin RLout supply voltage supply current ambient temperature power gain input return loss output return loss power at LNA input Pi < −40 dBm power at LNA input Pi = −20 dBm power at LNA input Pi < −40 dBm power at LNA input Pi = −20 dBm power at LNA input Pi < −40 dBm power at LNA input Pi = −20 dBm BGU7005 All information provided in this document is subject to legal disclaimers. Conditions RF input AC coupled Min Typ 1.5 [1] [1] [1] [1] [1] [1] Max 2.85 +85 Unit V mA °C dB dB dB dB dB dB 4.5 −40 +25 - 14.5 15.5 8.5 10.5 14.5 12.5 - © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 14 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS Table 11. Characteristics GPS front-end …continued f = 1575 MHz; VCC = 1.8 V; VENABLE ≥ 0.8 V; power at LNA input Pi < −40 dBm; Tamb = 25 °C; input and output matched to 50 Ω; unless otherwise specified. Symbol Parameter NF Pi(1dB) noise figure input power at 1 dB gain compression Conditions power at LNA input Pi < −40 dBm power at LNA input Pi = −20 dBm f = 1575 MHz f = 806 MHz to 928 MHz f = 1612 MHz to 1909 MHz IP3i α ton toff [1] [2] [3] [4] [5] [2] [2] [3] [1] [1] Min Typ 1.8 1.9 −8.2 31 40 64 95 90 - Max - Unit dB dB dBm dBm dBm dBm input third-order intercept point attenuation turn-on time turn-off time Power at GPS front-end input = power at LNA input + attenuation BPF1. Out of band. f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = +10 dBm. Relative to f = 1575 MHz. Within 10 % of the final gain. f = 850 MHz f = 1850 MHz [4] [4] [5] [5] 2 1 dBc dBc μs μs BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 15 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 9. Package outline XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× L1 L (2) e 6 e1 5 e1 4 6× (2) A A1 D E terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 Fig 33. Package outline SOT886 (XSON6) BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 16 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 10. Abbreviations Table 12. Acronym AC GNSS GPS HBM LNA MMIC PDA RF SAW SiGe:C Abbreviations Description Alternating Current Global Navigation Satellite System Global Positioning System Human Body Model Low Noise Amplifier Monolithic Microwave Integrated Circuit Personal Digital Assistant Radio Frequency Surface Acoustic Wave Silicon Germanium Carbon 11. Revision history Table 13. Revision history Release date 20110506 Data sheet status Product data sheet Change notice Supersedes BGU7005 v.3 Document ID BGU7005 v.4 Modifications: • • • • Section 1.2 on page 1: removed ‘optimized for 1.8 V’ at list no.12. Table 1 on page 2: some values ICC have been changed/added. Table 5 on page 3: added VENABLE,VRF_IN and VRF_OUT and notes [2] and [3]. Table 7 on page 4: several changes have been made. Product data sheet Product data sheet Preliminary data sheet BGU7005_2 BGU7005_1 - BGU7005 v.3 BGU7005_2 BGU7005_1 20100623 20100304 20091028 BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 17 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 12. Legal information 12.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. © NXP B.V. 2011. All rights reserved. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or BGU7005 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 4 — 6 May 2011 18 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGU7005 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 4 — 6 May 2011 19 of 20 NXP Semiconductors BGU7005 SiGe:C Low Noise Amplifier MMIC for GPS 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 8.2 8.3 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 6 GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 GPS front-end. . . . . . . . . . . . . . . . . . . . . . . . . 14 Characteristics GPS front-end . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 May 2011 Document identifier: BGU7005