BGU7044

BGU7044 1 GHz wideband low-noise amplifier Rev. 1 — 2 January 2012 Product data sheet 1. Product profile 1.1 General description The BGU7044 MMIC is a 3.3 V wideband amplifier with internal biasing. It is designed specifically for high linearity, low-noise applications over a frequency range of 40 MHz to 1 GHz. It is especially suited for Set-Top Box applications. The LNA is housed in a 6-pin SOT363 plastic SMD package. 1.2 Features and benefits         Voltage supply of 3.3 V Internally biased Gain of 14 dB Flat gain between 40 MHz and 1 GHz Noise figure of 2.8 dB High linearity with an IP3O of 29 dBm 75  input and output impedance ESD protection > 2 kV Human Body Model (HBM) and > 1.5 kV Charged Device Model (CDM) on all pins 1.3 Applications     Terrestrial Silicon and cable Set-Top Boxes (STB) Silicon and “Can” tuners Personal Video Recorders (PVR) and Digital Video Recorders (DVR) Home networking and in-house signal distribution NXP Semiconductors BGU7044 1 GHz wideband low-noise amplifier 1.4 Quick reference data Table 1. Quick reference data Tamb = 25 C; typical values at VCC = 3.3 V; ZS = ZL = 75 ; Rbias = 18 ; 40 MHz  f1  1000 MHz. Symbol Parameter VCC ICC(tot) Tamb NF PL(1dB) IP3O [1] Conditions RF input AC coupled Min 3.1 30 40 - Typ Max Unit 3.3 34 2.8 13 29 3.5 38 +85 V mA C dB dBm dBm supply voltage total supply current ambient temperature noise figure output power at 1 dB gain compression output third-order intercept point 1 GHz [1] - The fundamental frequency (f1) is 1000 MHz. The intermodulation product (IM3) is 2  f2  f1, where f2 = f1  1 MHz. Input power Pi = 10 dBm. 2. Pinning information Table 2. Pin 1 2 3 4 5 6 Pinning Description RF_OUT VCC n.c. n.c. GND RF_IN 1 2 3 5 4 sym141 Simplified outline 6 5 4 Graphic symbol 3 2 6 1 3. Ordering information Table 3. Ordering information Package Name BGU7044 Description plastic surface-mounted package; 6 leads Version SOT363 Type number 4. Marking Table 4. BGU7044 Marking Marking code LJ* Description * = p : made in Hong Kong * = W : made in China * = t : made in Malaysia Type number BGU7044 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 2 January 2012 2 of 10 NXP Semiconductors BGU7044 1 GHz wideband low-noise amplifier 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC ICC(tot) Ptot Pi Tstg Tj Tamb VESD Parameter supply voltage total supply current total power dissipation input power storage temperature junction temperature ambient temperature electrostatic discharge voltage Human Body Model (HBM); according to JEDEC standard 22-A114E Charged Device Model (CDM); according to JEDEC standard 22-C101B [1] Tsp is the temperature at the solder point of the ground lead. Conditions RF input AC coupled configurable with external resistor Tsp  100 C single tone [1] Min Max 0.6 3.5 65 40 2 60 250 20 +150 150 +85 - Unit V mA mW dBm C C C kV 1.5 - kV 6. Thermal characteristics Table 6. Symbol Rth(j-sp) Thermal characteristics Parameter thermal resistance from junction to solder point Conditions Typ 240 Unit K/W 7. Characteristics Table 7. Characteristics Tamb = 25 C; typical values at VCC = 3.3 V; ZS = ZL = 75 ; Rbias = 18 ; 40 MHz  f1  1000 MHz. Symbol Parameter VCC ICC(tot) s212 SLsl FL NF RLin RLout PL(1dB) IP3O [1] Conditions RF input AC coupled Min 3.1 30 - Typ 3.3 34 14 1 0.2 2.8 20 12 13 29 Max Unit 3.5 38 V mA dB dB dB dB dB dB dBm dBm supply voltage total supply current insertion power gain slope straight line flatness of frequency response noise figure input return loss output return loss output power at 1 dB gain compression output third-order intercept point 1 GHz [1] - The fundamental frequency (f1) is 1000 MHz. The intermodulation product (IM3) is 2  f2  f1, where f2 = f1  1 MHz. Input power Pi = 10 dBm. BGU7044 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 2 January 2012 3 of 10 NXP Semiconductors BGU7044 1 GHz wideband low-noise amplifier 8. Application information Other applications are possible. Please contact your local sales representative for more information. Application notes are available on the NXP website. 8.1 Application circuit VCC C4 C3 n.c. 3 X1 C1 R1 = Rbias 2 6 4 5 n.c. 1 L1 C2 X2 RF_IN RF_OUT 001aam382 Components are listed inTable 8. Fig 1. BGU7044 application circuit All control and supply lines must be decoupled properly. The decoupling capacitors must be placed as close to the device as possible. 8.2 Application circuit board layout GND GND GND VER.2 C4 BP CTRL GAIN CTRL X1 VCC VCC X2 C3 RF_IN C1 L1 R1 C2 RF_OUT IN 75 OHM OUT 001aao235 PCB material = FR4. PCB thickness = 1.6 mm. PCB size = 30 mm  30 mm. r = 4.5; thickness of copper layer = 35 m. Components are listed in Table 8 Fig 2. BGU7044 application circuit board layout BGU7044 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 2 January 2012 4 of 10 NXP Semiconductors BGU7044 1 GHz wideband low-noise amplifier Table 8. List of components See Figure 1 and Figure 2 Component C1, C2 C3 C4 L1 R1 X1, X2 [1] Description capacitor capacitor capacitor chip ferrite bead resistor connector Value 10 nF 10 nF 10 F 1.5 k 18  75  [1] [1] Remarks Function DC blocking decoupling decoupling Murata BLM18HE152SN1DF Rbias F-connector, edge mount PCB reflow type, Bomar 861V509ERG RF choke bias setting input/output L1 and R1 must have a power rating of 0.1 W or higher. BGU7044 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 2 January 2012 5 of 10 NXP Semiconductors BGU7044 1 GHz wideband low-noise amplifier 9. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 1 e1 e 2 bp 3 wM B detail X Lp c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT363 REFERENCES IEC JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 3. BGU7044 Package outline SOT363 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 2 January 2012 6 of 10 NXP Semiconductors BGU7044 1 GHz wideband low-noise amplifier 10. Abbreviations Table 9. Acronym AC DC ESD LNA MMIC PCB RF SMD Abbreviations Description Alternating Current Direct Current ElectroStatic Discharge Low-Noise Amplifier Monolithic Microwave Integrated Circuit Printed-Circuit Board Radio Frequency Surface-Mounted Device 11. Revision history Table 10. Revision history Release date 20120102 Data sheet status Product data sheet Change notice Supersedes Document ID BGU7044 v.1 BGU7044 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 2 January 2012 7 of 10 NXP Semiconductors BGU7044 1 GHz wideband low-noise amplifier 12. Legal information 12.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. © NXP B.V. 2012. All rights reserved. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BGU7044 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 2 January 2012 8 of 10 NXP Semiconductors BGU7044 1 GHz wideband low-noise amplifier In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGU7044 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 2 January 2012 9 of 10 NXP Semiconductors BGU7044 1 GHz wideband low-noise amplifier 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 8.2 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 4 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 4 Application circuit board layout . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 2 January 2012 Document identifier: BGU7044