BUK456-100B

Philips Semiconductors Product specification PowerMOS transistor BUK456-100A/B GENERAL DESCRIPTION N-channel enhancement mode field-effect power transistor in a plastic envelope. The device is intended for use in Switched Mode Power Supplies (SMPS), motor control, welding, DC/DC and AC/DC converters, and in general purpose switching applications. QUICK REFERENCE DATA SYMBOL VDS ID Ptot Tj RDS(ON) PARAMETER BUK456 Drain-source voltage Drain current (DC) Total power dissipation Junction temperature Drain-source on-state resistance MAX. -100A 100 34 150 175 0.057 MAX. -100B 100 32 150 175 0.065 UNIT V A W ˚C Ω PINNING - TO220AB PIN 1 2 3 tab gate drain source drain DESCRIPTION PIN CONFIGURATION tab SYMBOL d g 1 23 s LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL VDS VDGR ±VGS ID ID IDM Ptot Tstg Tj PARAMETER Drain-source voltage Drain-gate voltage Gate-source voltage Drain current (DC) Drain current (DC) Drain current (pulse peak value) Total power dissipation Storage temperature Junction temperature CONDITIONS RGS = 20 kΩ Tmb = 25 ˚C Tmb = 100 ˚C Tmb = 25 ˚C Tmb = 25 ˚C MIN. - 55 -100A 34 24 136 150 175 175 MAX. 100 100 30 -100B 32 22 128 UNIT V V V A A A W ˚C ˚C THERMAL RESISTANCES SYMBOL Rth j-mb Rth j-a PARAMETER Thermal resistance junction to mounting base Thermal resistance junction to ambient CONDITIONS MIN. TYP. 60 MAX. 1.0 UNIT K/W K/W April 1998 1 Rev 1.100 Philips Semiconductors Product specification PowerMOS transistor BUK456-100A/B STATIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL V(BR)DSS VGS(TO) IDSS IDSS IGSS RDS(ON) PARAMETER Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current Zero gate voltage drain current Gate source leakage current Drain-source on-state resistance CONDITIONS VGS = 0 V; ID = 0.25 mA VDS = VGS; ID = 1 mA VDS = 100 V; VGS = 0 V; Tj = 25 ˚C VDS = 100 V; VGS = 0 V; Tj =125 ˚C VGS = ±30 V; VDS = 0 V VGS = 10 V; BUK456-100A BUK456-100B ID = 15 A MIN. 100 2.1 TYP. 3.0 1 0.1 10 0.052 0.06 MAX. 4.0 10 1.0 100 0.057 0.065 UNIT V V µA mA nA Ω Ω DYNAMIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL gfs Ciss Coss Crss td on tr td off tf Ld Ld Ls PARAMETER Forward transconductance Input capacitance Output capacitance Feedback capacitance Turn-on delay time Turn-on rise time Turn-off delay time Turn-off fall time Internal drain inductance Internal drain inductance Internal source inductance CONDITIONS VDS = 25 V; ID = 15 A VGS = 0 V; VDS = 25 V; f = 1 MHz VDD = 30 V; ID = 3 A; VGS = 10 V; Rgen = 50 Ω; RGS = 50 Ω Measured from contact screw on tab to centre of die Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad MIN. 12 TYP. 16 1500 450 130 20 40 150 65 3.5 4.5 7.5 MAX. 2000 600 200 30 60 200 85 UNIT S pF pF pF ns ns ns ns nH nH nH REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL IDR IDRM VSD trr Qrr PARAMETER Continuous reverse drain current Pulsed reverse drain current Diode forward voltage Reverse recovery time Reverse recovery charge CONDITIONS IF = 34 A ; VGS = 0 V IF = 34 A; -dIF/dt = 100 A/µs; VGS = 0 V; VR = 30 V MIN. TYP. 1.8 100 1.0 MAX. 34 136 2.5 UNIT A A V ns µC April 1998 2 Rev 1.100 Philips Semiconductors Product specification PowerMOS transistor BUK456-100A/B 120 110 100 90 80 70 60 50 40 30 20 10 0 PD% Normalised Power Derating 10 Zth j-mb / (K/W) BUKx56-lv 1 D= 0.5 0.1 0.2 0.1 0.05 0.02 P D 0 tp tp T t 1E+01 0.01 D= 0 20 40 60 80 100 Tmb / C 120 140 160 180 0.001 1E-05 1E-03 t/s T 1E-01 Fig.1. Normalised power dissipation. PD% = 100⋅PD/PD 25 ˚C = f(Tmb) ID% Normalised Current Derating Fig.4. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T ID / A VGS / V = 15 20 10 120 110 100 90 80 70 60 50 40 30 20 10 0 70 60 50 40 BUK456-100A 8 7 6 30 20 5 10 0 20 40 60 80 100 Tmb / C 120 140 160 180 0 4 0 2 4 VDS / V 6 8 10 Fig.2. Normalised continuous drain current. ID% = 100⋅ID/ID 25 ˚C = f(Tmb); conditions: VGS ≥ 10 V ID / A BUK456-100A,B Fig.5. Typical output characteristics, Tj = 25 ˚C. ID = f(VDS); parameter VGS RDS(ON) / Ohm 4.5 5 5.5 6 6.5 7 BUK456-100A VGS / V = 7.5 8 10 0.1 20 1000 0.2 100 RD S N (O )= VD ID S/ A B tp = 10 us 100 us 10 DC 1 ms 10 ms 100 ms 1 0 1 10 VDS / V 100 1000 0 20 40 ID / A 60 80 Fig.3. Safe operating area. Tmb = 25 ˚C ID & IDM = f(VDS); IDM single pulse; parameter tp Fig.6. Typical on-state resistance, Tj = 25 ˚C. RDS(ON) = f(ID); parameter VGS April 1998 3 Rev 1.100 Philips Semiconductors Product specification PowerMOS transistor BUK456-100A/B 70 60 50 40 30 20 ID / A Tj / C = 25 BUK456-100A 4 VGS(TO) / V max. 150 typ. 3 min. 2 1 10 0 0 0 2 4 VGS / V 6 8 10 -60 -20 20 60 Tj / C 100 140 180 Fig.7. Typical transfer characteristics. ID = f(VGS) ; conditions: VDS = 25 V; parameter Tj Fig.10. Gate threshold voltage. VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS ID / A SUB-THRESHOLD CONDUCTION gfs / S 20 BUK456-100A 1E-01 1E-02 1E-03 2% typ 98 % 10 1E-04 1E-05 0 0 20 40 ID / A 60 1E-06 0 1 2 VGS / V 3 4 Fig.8. Typical transconductance, Tj = 25 ˚C. gfs = f(ID); conditions: VDS = 25 V a Normalised RDS(ON) = f(Tj) Fig.11. Sub-threshold drain current. ID = f(VGS); conditions: Tj = 25 ˚C; VDS = VGS 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10000 C / pF BUK4y6-100 Ciss 1000 Coss 100 Crss -60 -20 20 60 Tj / C 100 140 180 10 0 20 VDS / V 40 Fig.9. Normalised drain-source on-state resistance. a = RDS(ON)/RDS(ON)25 ˚C = f(Tj); ID = 15 A; VGS = 10 V Fig.12. Typical capacitances, Ciss, Coss, Crss. C = f(VDS); conditions: VGS = 0 V; f = 1 MHz April 1998 4 Rev 1.100 Philips Semiconductors Product specification PowerMOS transistor BUK456-100A/B 12 10 8 6 VGS / V VDS / V =20 BUK456-100 70 60 50 IF / A BUK456-100A 80 40 Tj / C = 150 30 25 4 2 0 20 10 0 0 20 QG / nC 40 0 1 VSDS / V 2 Fig.13. Typical turn-on gate-charge characteristics. VGS = f(QG); conditions: ID = 34 A; parameter VDS Fig.14. Typical reverse diode current. IF = f(VSDS); conditions: VGS = 0 V; parameter Tj April 1998 5 Rev 1.100 Philips Semiconductors Product specification PowerMOS transistor BUK456-100A/B MECHANICAL DATA Dimensions in mm Net Mass: 2 g 4,5 max 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 2,54 2,54 0,9 max (3x) 0,6 2,4 Fig.15. SOT78 (TO220AB); pin 2 connected to mounting base. Notes 1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to mounting instructions for SOT78 (TO220) envelopes. 3. Epoxy meets UL94 V0 at 1/8". April 1998 6 Rev 1.100 Philips Semiconductors Product specification PowerMOS transistor BUK456-100A/B DEFINITIONS Data sheet status Objective specification Product specification Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. © Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. April 1998 7 Rev 1.100