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BYW29

BYW29

  • 厂商:

    PHILIPS

  • 封装:

  • 描述:

    BYW29 - Rectifier diodes ultrafast - NXP Semiconductors

  • 数据手册
  • 价格&库存
BYW29 数据手册
Philips Semiconductors Product specification Rectifier diodes ultrafast GENERAL DESCRIPTION Glass passivated high efficiency rectifier diodes in a plastic envelope, featuring low forward voltage drop, ultra-fast recovery times and soft recovery characteristic. They are intended for use in switched mode power supplies and high frequency circuits in general where low conduction and switching losses are essential. BYW29 series QUICK REFERENCE DATA SYMBOL VRRM VF IF(AV) trr PARAMETER BYW29Repetitive peak reverse voltage Forward voltage Forward current Reverse recovery time MAX. 100 100 0.895 8 25 MAX. 150 150 0.895 8 25 MAX. 200 200 0.895 8 25 UNIT V V A ns PINNING - TO220AC PIN 1 2 tab DESCRIPTION cathode (k) anode (a) cathode (k) PIN CONFIGURATION tab SYMBOL a k 1 2 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL VRRM VRWM VR IF(AV) PARAMETER Repetitive peak reverse voltage Crest working reverse voltage Continuous reverse voltage Average forward current1 square wave; δ = 0.5; Tmb ≤ 128 ˚C sinusoidal; a = 1.57; Tmb ≤ 130 ˚C CONDITIONS MIN. -40 -100 100 100 100 MAX. -150 150 150 150 8 7.3 11.3 16 80 88 32 150 150 -200 200 200 200 UNIT V V V A A A A A A A2s ˚C ˚C IF(RMS) IFRM IFSM I2t Tstg Tj RMS forward current Repetitive peak forward current t = 25 µs; δ = 0.5; Tmb ≤ 128 ˚C Non-repetitive peak forward t = 10 ms current t = 8.3 ms sinusoidal; with reapplied VRWM(max) I2t for fusing t = 10 ms Storage temperature Operating junction temperature 1 Neglecting switching and reverse current losses October 1994 1 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes ultrafast THERMAL RESISTANCES SYMBOL Rth j-mb Rth j-a PARAMETER Thermal resistance junction to mounting base Thermal resistance junction to ambient CONDITIONS MIN. in free air - BYW29 series TYP. 60 MAX. 2.7 - UNIT K/W K/W STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL VF IR PARAMETER Forward voltage Reverse current CONDITIONS IF = 8 A; Tj = 150˚C IF = 8 A IF = 20 A VR = VRWM; Tj = 100 ˚C VR = VRWM MIN. TYP. 0.80 0.92 1.1 0.3 2 MAX. 0.895 1.05 1.3 0.6 10 UNIT V V V mA µA DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL Qs trr Irrm Vfr PARAMETER Reverse recovery charge Reverse recovery time Peak reverse recovery current Forward recovery voltage CONDITIONS IF = 2 A; VR ≥ 30 V; -dIF/dt = 20 A/µs IF = 1 A; VR ≥ 30 V; -dIF/dt = 100 A/µs IF = 10 A; VR ≥ 30 V; Tj = 100 ˚C; -dIF/dt = 50 A/µs IF = 1 A; dIF/dt = 10 A/µs MIN. TYP. 4 20 1 1 MAX. 11 25 2 UNIT nC ns A V October 1994 2 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes ultrafast BYW29 series I dI F dt F 8 7 PF / W Vo = 0.791 V Rs = 0.013 Ohms BYW29 Tmb(max) / C a = 1.57 1.9 2.2 128.4 131.1 133.8 136.5 139.2 141.9 144.6 147.3 t 6 rr time 5 4 3 4 2.8 Q I R I s 10% 100% 2 1 rrm 0 0 1 2 3 4 IF(AV) / A 5 6 7 150 8 Fig.1. Definition of trr, Qs and Irrm Fig.4. Maximum forward dissipation PF = f(IF(AV)); sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). trr / ns 1000 I F 100 IF=10A time IF=1A V F V V F time 10 fr 1 1 10 dIF/dt (A/us) 100 Fig.2. Definition of Vfr Fig.5. Maximum trr at Tj = 25 ˚C. 12 10 8 6 PF / W Vo = 0.791 V Rs = 0.013 Ohms BYW29 Tmb(max) / C D = 1.0 120.3 123 trr / ns 1000 0.5 0.2 0.1 128.4 133.8 139.2 144.6 T t 100 IF=10A IF=1A 4 I tp D= tp T 10 2 0 0 2 4 6 IF(AV) / A 8 10 150 12 1 1 10 dIF/dt (A/us) 100 Fig.3. Maximum forward dissipation PF = f(IF(AV)); square current waveform where IF(AV) =IF(RMS) x √D. Fig.6. Maximum trr at Tj = 100 ˚C. October 1994 3 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes ultrafast BYW29 series 10 Irrm / A 100 Qs / nC IF=10A 1 IF=1A IF=10A 5A 2A 1A 10 0.1 0.01 1 10 -dIF/dt (A/us) 100 1.0 1.0 10 -dIF/dt (A/us) 100 Fig.7. Maximum Irrm at Tj = 25 ˚C. Fig.10. Maximum Qs at Tj = 25 ˚C. 10 Irrm / A 10 Zth (K/W) IF=10A 1 IF=1A 1 0.1 0.1 P D tp t 0.01 1 10 -dIF/dt (A/us) 100 0.01 10 us 1 ms tp / s 0.1 s 10 s Fig.8. Maximum Irrm at Tj = 100 ˚C. Fig.11. Transient thermal impedance; Zth j-mb = f(tp). 30 IF / A Tj=150 C Tj=25 C BYW29 20 typ 10 max 0 0 0.5 1 VF / V 1.5 2 Fig.9. Typical and maximum forward characteristic IF = f(VF); parameter Tj October 1994 4 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes ultrafast MECHANICAL DATA Dimensions in mm Net Mass: 2 g BYW29 series 4,5 max 10,3 max 1,3 3,7 2,8 5,9 min 3,0 max not tinned 3,0 15,8 max 13,5 min 1,3 max 1 (2x) 2 0,9 max (2x) 0,6 2,4 5,08 Fig.12. TO220AC; pin 1 connected to mounting base. Notes 1. Accessories supplied on request: refer to mounting instructions for TO220 envelopes. 2. Epoxy meets UL94 V0 at 1/8". October 1994 5 Rev 1.100 Philips Semiconductors Product specification Rectifier diodes ultrafast DEFINITIONS Data sheet status Objective specification Product specification Limiting values BYW29 series This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. © Philips Electronics N.V. 1994 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. October 1994 6 Rev 1.100
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