BZA418A

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D302 BZA418A Quadruple ESD transient voltage suppressor Product specification 2002 Sep 02 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor FEATURES • ESD rating >8 kV, according to IEC1000-4-2 • SOT457 surface mount package • Common anode configuration • Non-clamping range −0.5 to 18 V • Maximum reverse peak power dissipation: 19.6 W at tp = 1 ms • Maximum clamping voltage at peak pulse current: 27 V at IZSM = 0.7 A. APPLICATIONS • Computers and peripherals • Audio and video equipment • Communication systems • Medical equipment. 1 2 3 MAM357 BZA418A PINNING PIN 1 2 3 4 5 6 cathode 1 common cathode 2 cathode 3 common cathode 4 DESCRIPTION handbook, halfpage 6 5 4 1 3 4 6 2 5 DESCRIPTION Monolithic transient voltage suppressor diode in a six lead SOT457 (SC-74) package for 4-bit wide ESD transient suppression at 18 V level. Top view Marking code: L1. Fig.1 Simplified outline (SOT457) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode IZ IF IFSM IZSM Ptot PZSM Tstg Tj Notes 1. Ts is the temperature at the soldering point of the anode pin. 2. DC working current limited by Ptot max. working current continuous forward current non-repetitive peak forward current non-repetitive peak reverse current total power dissipation non repetitive peak reverse power dissipation storage temperature junction temperature Ts = 60 °C; note 1 Ts = 60 °C tp = 1 ms; square pulse tp = 1 ms; square pulse; see Fig.2 Ts = 60 °C; see Fig.3 square pulse; tp = 1 ms; see Fig.4 − − − − − − −65 −65 note 2 100 3.75 0.7 720 19.6 +150 +150 mA mA A A mW W °C °C PARAMETER CONDITIONS MIN. MAX. UNIT 2002 Sep 02 2 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to soldering point CONDITIONS one or more diodes loaded BZA418A VALUE 125 UNIT K/W ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL Per diode VZ VF VZSM IR rdif SZ Cd working voltage forward voltage reverse current differential resistance temperature coefficient of working voltage diode capacitance IZ = 1 mA IF = 200 mA VR = 14 V IZ = 1 mA IZ = 5 mA see Fig.5 VR = 0; f = 1 MHz − − − 48 14 pF pF VR = 13 V; f = 1 MHz − 17.1 − − − − − 18 − − − − 14.4 18.9 1.3 27 75 125 − V V V nA Ω mV/K PARAMETER CONDITIONS MIN. TYP. MAX. UNIT non-repetitive peak reverse voltage IZSM = 0.7 A; tp = 1 ms 2002 Sep 02 3 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor BZA418A handbook, halfpage 10 MDA197 handbook, halfpage 1000 Ptot MDA198 IZSM (A) (mW) 800 600 1 400 200 10−1 10−1 1 tp (ms) 10 0 0 50 100 150 Ts (oC) 200 All diodes loaded. Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time. Fig.3 Power derating curve. 102 handbook, halfpage MDA199 handbook, halfpage 50 Cd MDA200 PZSM (W) (pF) 40 30 10 20 10 1 10−1 1 tp (ms) 10 0 0 5 10 VR (V) 15 PZSM = VZSM × IZSM. VZSM is the non-repetitive peak reverse voltage at IZSM. Tj = 25 °C; f = 1 MHz. Fig.4 Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Fig.5 Diode capacitance as a function of reverse voltage; typical values. 2002 Sep 02 4 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor APPLICATION INFORMATION Typical common anode application BZA418A A quadruple transient suppressor in a SOT457 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs 6 and 7. handbook, full pagewidth keyboard, terminal, printer, etc. I/O A B C D FUNCTIONAL DECODER BZA418A GND MGU788 Fig.6 Computer interface protection. handbook, full pagewidth VDD address bus VGG RAM ROM data bus I/O CPU CLOCK control bus BZA418A GND MGU789 Fig.7 Microprocessor protection. 2002 Sep 02 5 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA418A is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point. BZA418A 2002 Sep 02 6 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor PACKAGE OUTLINE Plastic surface mounted package; 6 leads BZA418A SOT457 D B E A X y HE vMA 6 5 4 Q pin 1 index A A1 c 1 2 3 Lp e bp wM B detail X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.1 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1 OUTLINE VERSION SOT457 REFERENCES IEC JEDEC EIAJ SC-74 EUROPEAN PROJECTION ISSUE DATE 97-02-28 01-05-04 2002 Sep 02 7 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS BZA418A This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2002 Sep 02 8 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor NOTES BZA418A 2002 Sep 02 9 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor NOTES BZA418A 2002 Sep 02 10 Philips Semiconductors Product specification Quadruple ESD transient voltage suppressor NOTES BZA418A 2002 Sep 02 11 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2002 SCA74 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/01/pp12 Date of release: 2002 Sep 02 Document order number: 9397 750 10098