BZA900AVL

DISCRETE SEMICONDUCTORS DATA SHEET M3D743 BZA900AVL series Quadruple low capacitance ESD suppressor Product specification Supersedes data of 2003 Apr 15 2003 Oct 20 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor FEATURES • Low diode capacitance • Low leakage current • SOT665 surface mount package • Common anode configuration. APPLICATIONS • Communication systems • Computers and peripherals • Audio and video equipment. DESCRIPTION Monolithic transient voltage suppressor diode in a five lead SOT665 package for 4-bit wide ESD transient suppression. MARKING TYPE NUMBER BZA956AVL BZA962AVL BZA968AVL ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BZA956AVL BZA962AVL BZA968AVL − − − DESCRIPTION plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads MARKING CODE V3 V2 V1 1 2 3 handbook, halfpage 5 BZA900AVL series PINNING PIN 1 2 3 4 5 cathode 1 common anode cathode 2 cathode 3 cathode 4 DESCRIPTION 4 1 3 2 4 5 MGW315 Fig.1 Simplified outline (SOT665) and symbol. VERSION SOT665 SOT665 SOT665 2003 Oct 20 2 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode IZ IF IFSM Ptot PZSM Tstg Tj ESD working current continuous forward current non-repetitive peak forward current total power dissipation non repetitive peak reverse power dissipation storage temperature junction temperature electrostatic discharge HBM MIL-Std 883 Notes 1. DC working current limited by Ptot(max). 2. Device mounted on standard printed-circuit board. ESD STANDARDS COMPLIANCE STANDARD IEC 61000-4-2, level 4 (ESD) HBM MIL-Std 883, class 3 THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s PARAMETER thermal resistance from junction to ambient thermal resistance from junction to solder point; note 1 CONDITIONS all diodes loaded one diode loaded all diodes loaded >4 kV Tamb = 25 °C Tamb = 25 °C tp = 1 ms; square pulse Tamb = 25 °C; note 2; see Fig.5 square pulse; tp = 1 ms PARAMETER CONDITIONS BZA900AVL series MIN. − − − − − −65 − MAX. UNIT note 1 200 3.5 335 6 +150 150 − − mA mA A mW W °C °C kV kV IEC 61000-4-2 (contact discharge) 15 10 CONDITIONS >15 kV (air); >8 kV (contact discharge) VALUE 370 135 125 UNIT K/W K/W K/W Note 1. Solder point of common anode (pin 2). 2003 Oct 20 3 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL VF IR PARAMETER forward voltage reverse current BZA956AVL BZA962AVL BZA968AVL VZ working voltage BZA956AVL BZA962AVL BZA968AVL rdif differential resistance BZA956AVL BZA962AVL BZA968AVL SZ temperature coefficient BZA956AVL BZA962AVL BZA968AVL Cd diode capacitance BZA956AVL BZA962AVL BZA968AVL diode capacitance BZA956AVL BZA962AVL BZA968AVL IZSM non-repetitive peak reverse current BZA956AVL BZA962AVL BZA968AVL tp = 1 ms; Tamb = 25 °C − − − f = 1 MHz; VR = 5 V − − − f = 1 MHz; VR = 0 − − − IZ = 1 mA − − − IZ = 1 mA − − − VR = 3 V VR = 4 V VR = 4.3 V IZ = 1 mA 5.32 5.89 6.46 − − − CONDITIONS IF = 200 mA − MIN. BZA900AVL series TYP. − − − − 5.6 6.2 6.8 − − − 1.3 2.4 2.9 22 18 16 12 9 8 − − − MAX. 1.2 200 100 20 5.88 6.51 7.14 200 150 100 − − − 28 22 19 17 12 11 0.90 0.85 0.80 UNIT V nA nA nA V V V Ω Ω Ω mV/K mV/K mV/K pF pF pF pF pF pF A A A 2003 Oct 20 4 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor BZA900AVL series handbook, halfpage 10 MLE001 102 handbook, halfpage MLE003 IZSM (A) PZSM (W) BZA956AVL BZA956AVL 1 10 BZA968AVL BZA962AVL/BZA968AVL BZA962AVL 10−1 10−2 10−1 1 tp (ms) 10 1 10−2 10−1 1 tp (ms) 10 Fig.3 Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time. Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). handbook, halfpage 26 Cd 22 MLE002 MGT586 handbook, halfpage 400 (pF) Ptot (mW) 300 18 200 BZA956AVL 14 BZA962AVL 100 10 BZA968AVL 6 0 1 2 3 4 VR (V) 5 0 0 50 100 Tamb (°C) 150 Tj = 25 °C; f = 1 MHz. Fig.4 Diode capacitance as a function of reverse voltage; typical values. Fig.5 Power derating curve. 2003 Oct 20 5 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor BZA900AVL series handbook, full pagewidth ESD TESTER RZ CZ 450 Ω RG 223/U 50 Ω coax 10 × ATTENUATOR note 1 DIGITIZING OSCILLOSCOPE 50 Ω IEC 1000-4-2 network CZ = 150 pF; RZ = 330 Ω 1/4 BZA900AVL Note 1: attenuator is only used for open socket high voltage measurements vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 5 V/div horizontal scale = 50 ns/div BZA968AVL GND3 BZA962AVL GND2 GND GND1 unclamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) BZA956AVL clamped +1 kV ESD voltage waveform (IEC 1000-4-2 network) GND GND vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 5 V/div horizontal scale = 50 ns/div unclamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) clamped −1 kV ESD voltage waveform (IEC 1000-4-2 network) MLE005 Fig.6 ESD clamping test set-up and waveforms. 2003 Oct 20 6 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor APPLICATION INFORMATION Typical common anode application BZA900AVL series A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs.7 and 8. handbook, full pagewidth keyboard, terminal, printer, etc. I/O A B C D FUNCTIONAL DECODER BZA900AVL GND MLE008 Fig.7 Computer interface protection. handbook, full pagewidth VDD address bus VGG RAM ROM I/O data bus CPU CLOCK control bus BZA900AVL GND MLE009 Fig.8 Microprocessor protection. 2003 Oct 20 7 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA900AVL is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point. BZA900AVL series 2003 Oct 20 8 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor PACKAGE OUTLINE Plastic surface mounted package; 5 leads BZA900AVL series SOT665 D A E X S YS HE 5 4 A 1 e1 e 2 bp 3 wMA Lp detail X c 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1 OUTLINE VERSION SOT665 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 01-01-04 01-08-27 2003 Oct 20 9 Philips Semiconductors Product specification Quadruple low capacitance ESD suppressor DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION BZA900AVL series This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes  Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2003 Oct 20 10 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2003 SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/03/pp11 Date of release: 2003 Oct 20 Document order number: 9397 750 11935