BZX84J-C68

BZX84J series Single Zener diodes Rev. 01 — 1 March 2007 Product data sheet 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I Non-repetitive peak reverse power dissipation: ≤ 40 W I Total power dissipation: ≤ 550 mW I Two tolerance series: ±2 % and ±5 % I Wide working voltage range: nominal 2.4 V to 75 V (E24 range) I Low differential resistance I Small plastic package suitable for surface-mounted design 1.3 Applications I General regulation functions 1.4 Quick reference data Table 1. Symbol VF PZSM [1] [2] Quick reference data Parameter forward voltage non-repetitive peak reverse power dissipation Conditions IF = 100 mA [1] [2] Min - Typ - Max 1.1 40 Unit V W Pulse test: tp ≤ 300 µs; δ ≤ 0.02. tp = 100 µs; square wave; Tj = 25 °C prior to surge 2. Pinning information Table 2. Pin 1 2 Pinning Description cathode anode [1] Simplified outline 1 2 Symbol 1 2 006aaa152 [1] The marking bar indicates the cathode. NXP Semiconductors BZX84J series Single Zener diodes 3. Ordering information Table 3. Ordering information Package Name BZX84J-B2V4 to BZX84J-C75[1] [1] Type number Description plastic surface-mounted package; 2 leads Version SOD323F SC-90 The series consists of 74 types with nominal working voltages from 2.4 V to 75 V. 4. Marking Table 4. Marking codes Marking code SL SM ST SU SV SW SZ TA TD TE TH TK TM TN TP S8 S9 SA SB Type number BZX84J-B15 BZX84J-B16 BZX84J-B18 BZX84J-B20 BZX84J-B22 BZX84J-B24 BZX84J-B27 BZX84J-B30 BZX84J-B33 BZX84J-B36 BZX84J-B39 BZX84J-B43 BZX84J-B47 BZX84J-B51 BZX84J-B56 BZX84J-B62 BZX84J-B68 BZX84J-B75 Marking code SC SD SE SF SG SH SK SN SP SR SS SX SY TB TC TF TG TL Type number BZX84J-C2V4 BZX84J-C2V7 BZX84J-C3V0 BZX84J-C3V3 BZX84J-C3V6 BZX84J-C3V9 BZX84J-C4V3 BZX84J-C4V7 BZX84J-C5V1 BZX84J-C5V6 BZX84J-C6V2 BZX84J-C6V8 BZX84J-C7V5 BZX84J-C8V2 BZX84J-C9V1 BZX84J-C10 BZX84J-C11 BZX84J-C12 BZX84J-C13 Marking code U3 U4 U9 UA UB UC UF UG UL UM UR US UU UV UW TR TS TT TU Type number BZX84J-C15 BZX84J-C16 BZX84J-C18 BZX84J-C20 BZX84J-C22 BZX84J-C24 BZX84J-C27 BZX84J-C30 BZX84J-C33 BZX84J-C36 BZX84J-C39 BZX84J-C43 BZX84J-C47 BZX84J-C51 BZX84J-C56 BZX84J-C62 BZX84J-C68 BZX84J-C75 Marking code TV TW TX TY TZ U1 U2 U5 U6 U7 U8 UD UE UH UK UN UP UT Type number BZX84J-B2V4 BZX84J-B2V7 BZX84J-B3V0 BZX84J-B3V3 BZX84J-B3V6 BZX84J-B3V9 BZX84J-B4V3 BZX84J-B4V7 BZX84J-B5V1 BZX84J-B5V6 BZX84J-B6V2 BZX84J-B6V8 BZX84J-B7V5 BZX84J-B8V2 BZX84J-B9V1 BZX84J-B10 BZX84J-B11 BZX84J-B12 BZX84J-B13 BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 2 of 12 NXP Semiconductors BZX84J series Single Zener diodes 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol IF IZSM Parameter forward current non-repetitive peak reverse current non-repetitive peak reverse power dissipation total power dissipation junction temperature ambient temperature storage temperature tp = 100 µs; square wave; Tj = 25 °C prior to surge Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [1] Conditions Min - Max 250 see Table 8 and 9 40 550 150 +150 +150 Unit mA PZSM Ptot Tj Tamb Tstg [1] [2] [1] −65 −65 W mW °C °C °C Tamb ≤ 25 °C [2] 6. Thermal characteristics Table 6. Symbol Rth(j-a) Rth(j-sp) [1] [2] Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air [1] Min - Typ - Max 230 55 Unit K/W K/W [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Soldering point of cathode tab. 7. Characteristics Table 7. Characteristics Tj = 25 °C unless otherwise specified. Symbol VF Parameter forward voltage IF = 10 mA IF = 100 mA [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. Conditions [1] Min - Typ - Max 0.9 1.1 Unit V V BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 3 of 12 NXP Semiconductors BZX84J series Single Zener diodes Table 8. Characteristics per type; BZX84J-B2V4 to BZX84J-C24 Tj = 25 °C unless otherwise specified. BZX84J Sel -xxx Working voltage VZ (V) IZ = 5 mA Min 2V4 2V7 3V0 3V3 3V6 3V9 4V3 4V7 5V1 5V6 6V2 6V8 7V5 8V2 9V1 10 11 12 B C B C B C B C B C B C B C B C B C B C B C B C B C B C B C B C B C B C BZX84J_SER_1 Differential resistance rdif (Ω) IZ = 1 mA IZ = 5 mA Max 400 450 500 500 500 500 600 500 480 400 150 80 80 80 100 150 150 150 Max 100 100 95 95 90 90 90 80 60 40 10 15 10 10 10 10 10 10 Reverse current IR (µA) Temperature coefficient SZ (mV/K) IZ = 5 mA Diode Non-repetitive capacitance peak reverse current C (pF)[1] d IZSM (A)[2] Max 2.45 2.6 2.75 2.9 3.06 3.2 3.37 3.5 3.67 3.8 3.98 4.1 4.39 4.6 4.79 5 5.2 5.4 5.71 6 6.32 6.6 6.94 7.2 7.65 7.9 8.36 8.7 9.28 9.6 10.2 10.6 11.2 11.6 12.2 12.7 © NXP B.V. 2007. All rights reserved. Max 50 20 10 5 5 3 3 3 2 1 3 2 1 0.7 0.5 0.2 0.1 0.1 VR (V) Min 1 1 1 1 1 1 1 2 2 2 4 4 5 5 6 7 8 8 −3.5 −3.5 −3.5 −3.5 −3.5 −3.5 −3.5 −3.5 −2.7 −2 0.4 1.2 2.5 3.2 3.8 4.5 5.4 6 Max 0 0 0 0 0 0 0 0.2 1.2 2.5 3.7 4.5 5.3 6.2 7 8 9 10 Max 450 440 425 410 390 370 350 325 300 275 250 215 170 150 120 110 108 105 Max 12 12 12 12 12 12 12 12 12 12 12 12 4 4 3 3 2.5 2.5 2.35 2.2 2.65 2.5 2.94 2.8 3.23 3.1 3.53 3.4 3.82 3.7 4.21 4 4.61 4.4 5 4.8 5.49 5.2 6.08 5.8 6.66 6.4 7.35 7 8.04 7.7 8.92 8.5 9.8 9.4 10.8 10.4 11.8 11.4 Product data sheet Rev. 01 — 1 March 2007 4 of 12 NXP Semiconductors BZX84J series Single Zener diodes Table 8. Characteristics per type; BZX84J-B2V4 to BZX84J-C24 …continued Tj = 25 °C unless otherwise specified. BZX84J Sel -xxx Working voltage VZ (V) IZ = 5 mA Min 13 15 16 18 20 22 24 B C B C B C B C B C B C B C [1] [2] Differential resistance rdif (Ω) IZ = 1 mA IZ = 5 mA Max 170 200 200 225 225 250 250 Max 10 15 20 20 20 25 30 Reverse current IR (µA) Temperature coefficient SZ (mV/K) IZ = 5 mA Diode Non-repetitive capacitance peak reverse current C (pF)[1] d IZSM (A)[2] Max 13.3 14.1 15.3 15.6 16.3 17.1 18.4 19.1 20.4 21.2 22.4 23.3 24.5 25.6 0.05 16.8 18.4 22 80 1.25 0.05 15.4 16.4 20 84 1.25 0.05 14 14.4 18 88 1.5 0.05 12.6 12.4 16 93 1.5 0.05 11.2 10.4 14 97 1.5 0.05 10.5 9.2 13 99 2 Max 0.1 VR (V) Min 8 7 Max 11 Max 103 Max 2.5 12.7 12.4 14.7 13.8 15.7 15.3 17.6 16.8 19.6 18.8 21.6 20.8 23.5 22.8 f = 1 MHz; VR = 0 V tp = 100 µs; square wave; Tj = 25 °C prior to surge BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 5 of 12 NXP Semiconductors BZX84J series Single Zener diodes Table 9. Characteristics per type; BZX84J-B27 to BZX84J-C75 Tj = 25 °C unless otherwise specified. BZX84J- Sel xxx Working voltage VZ (V) IZ = 2 mA Min 27 30 33 36 39 43 47 51 56 62 68 75 B C B C B C B C B C B C B C B C B C B C B C B C [1] [2] Differential resistance rdif (Ω) IZ = 0.5 mA IZ = 2 mA Max 250 250 275 300 300 325 325 350 375 400 400 400 Max 40 40 40 60 75 80 90 110 120 140 160 175 Reverse current IR (µA) Temperature coefficient SZ (mV/K) IZ = 2 mA Diode Non-repetitive capacitance peak reverse current C (pF)[1] d IZSM (A)[2] Max 27.5 28.9 30.6 32 33.7 35 36.7 38 39.8 41 43.9 46 47.9 50 52 54 57.1 60 63.2 66 69.4 72 76.5 79 0.05 52.5 73.4 88.6 35 0.2 0.05 47.6 65.6 79.8 40 0.25 0.05 43.4 58.8 71.6 44 0.3 0.05 39.2 52.2 63.8 49 0.3 0.05 35.7 46.6 57.2 52 0.4 0.05 32.9 42 51.8 55 0.5 0.05 30.1 37.6 46.6 56 0.6 0.05 27.3 33.4 41.2 58 0.7 0.05 25.2 30.4 37.4 59 0.8 0.05 23.1 27.4 33.4 60 0.9 0.05 21 24.4 29.4 66 1 Max 0.05 VR (V) Min 18.9 21.4 Max 25.3 Max 73 Max 1 26.5 25.1 29.4 28 32.3 31 35.3 34 38.2 37 42.1 40 46.1 44 50 48 54.9 52 60.8 58 66.6 64 73.5 70 f = 1 MHz; VR = 0 V tp = 100 µs; square wave; Tj = 25 °C prior to surge BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 6 of 12 NXP Semiconductors BZX84J series Single Zener diodes 103 PZSM (W) mbg801 300 IF (mA) 200 mbg781 102 (1) 10 (2) 100 1 10−1 1 tp (ms) 10 0 0.6 0.8 VF (V) 1 (1) Tj = 25 °C (prior to surge) (2) Tj = 150 °C (prior to surge) Tj = 25 °C Fig 1. Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values 0.5 SZ (mV/K) 0 4V7 mld444 Fig 2. Forward current as a function of forward voltage; typical values 12 SZ (mV/K) 8 15 mld445 4V3 −0.5 2V4 2V7 −1 3V9 4 13 12 11 10 9V1 8V2 7V5 6V8 6V2 5V6 5V1 −1.5 3V6 3V3 3V0 0 −2 10−1 1 10 IZ (mA) 102 −4 10−1 1 10 IZ (mA) 102 BZX84J-B/C2V4 to BZX84J-B/C4V7 Tj = 25 °C to 150 °C BZX84J-B/C5V1 to BZX84J-B/C15 Tj = 25 °C to 150 °C Fig 3. Temperature coefficient as a function of working current; typical values Fig 4. Temperature coefficient as a function of working current; typical values BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 7 of 12 NXP Semiconductors BZX84J series Single Zener diodes 50 IZ (mA) 40 006aaa996 VZ(nom) (V) = 2.7 3.3 3.9 4.7 5.6 6.8 8.2 30 VZ(nom) (V) = 10 IZ (mA) 25 12 006aaa997 20 30 15 15 20 10 10 18 5 22 27 33 36 0 0 2 4 6 8 VZ (V) 10 0 0 10 20 30 VZ (V) 40 Tj = 25 °C BZX84J-B/C2V7 to BZX84J-B/C8V2 All curves have a test current IZ = 5 mA. Tj = 25 °C BZX84J-B/C10 to BZX84J-B/C36 For the curves VZ(nom) = (10, 12, 15, 18, 22) V the test current IZ = 5 mA. For the curves VZ(nom) = (27, 33, 36) V the test current IZ = 2 mA. Fig 5. Working current as a function of working voltage; typical values Fig 6. Working current as a function of working voltage; typical values BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 8 of 12 NXP Semiconductors BZX84J series Single Zener diodes 8. Package outline 1.35 1.15 1 0.5 0.3 0.80 0.65 2.7 2.3 1.8 1.6 2 0.40 0.25 Dimensions in mm 0.25 0.10 04-09-13 Fig 7. Package outline SOD323F (SC-90) 9. Packing information Table 10. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 BZX84J-B2V4 to SOD323F BZX84J-C75 [1] 10000 -135 -115 For further information and the availability of packing methods, see Section 13. 10. Soldering 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2×) msa433 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 8. Reflow soldering footprint SOD323F (SC-90) BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 9 of 12 NXP Semiconductors BZX84J series Single Zener diodes 11. Revision history Table 11. Revision history Release date 20070301 Data sheet status Product data sheet Change notice Supersedes Document ID BZX84J_SER_1 BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 10 of 12 NXP Semiconductors BZX84J series Single Zener diodes 12. Legal information 12.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com BZX84J_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 1 March 2007 11 of 12 NXP Semiconductors BZX84J series Single Zener diodes 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information. . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 1 March 2007 Document identifier: BZX84J_SER_1