P304

P304/P308/P310G002 family Smart eID Rev. 01 — 29 July 2008 Product short data sheet 1. General description 1.1 Smart eID family approach The Smart eID family members feature a modular set of devices with: • • • • 4 KB to 10 KB EEPROM Secured triple-DES coprocessor ISO/IEC 14443 type A Contactless Interface Unit (CIU) EEPROM with minimum 100 000 cycles endurance and minimum 20 years retention time • Pre-installed applications compliant to ICAO document 9303 • Command set compliant to ISO/IEC 7816-4 • Compliant to ISO/IEC 18013-3 (using BAP in configuration 1) 1.2 Smart eID family properties Smart eID is designed to complement general-purpose smart card controllers in the NXP Semiconductors range of identification products for eGovernment applications. It is an “all-in” functionality product supporting ISO/IEC 7816 data structures, including those defined in ICAO document 9303. Smart eID is designed for low-end configurations in identification cards, driving licences or other eGovernment applications. The learning curve for implementers is quick, as the product is based on well-known standards. By using Smart eID, applications can be developed and validated within days. The Smart eID family can be regarded as low-end products due to their limited memory size. Triple-DES symmetric cryptography and the ISO/IEC 14443 type A contactless interface are supported. The file system allows the creation of pre-configured applications that provide data groups within the application. Access to these data groups can be according to one of three modes: completely open (“LDS” – according to the Logical Data Structure defined in ICAO document 9303), protected with Basic Access Control and Secure Messaging (“BAC” – as defined in ICAO document 9303). A third configuration provides an additional mechanism to update data groups after issuing the electronic document to the holder as well as a feature to protect against cloning. These additional features make Smart eID particularly useful for ID cards, driving licences, and other eGovernment applications. Compliance to existing MRTD (Machine Readable Travel Document) inspection equipment can be obtained by configuration settings according to ICAO document 9303. For driving licence applications, it can be configured to comply with ISO/IEC 18013-3, using BAP (Basic Access Protocol) security in configuration 1. NXP Semiconductors P304/P308/P310G002 family Smart eID 1.3 Naming convention Table 1. xx zz Naming convention amount of non-volatile memory in KB, increasing count for further product options package type P3xxG002zz Smart eID platform 1.4 Architecture overview Every member of the Smart eID product family consists of hardware and software components. The overall deliverable is a module for integration into a contactless smart card or other contactless device. This module comes pre-configured with application software and is ready to be personalized by NXP Semiconductors direct or indirect customers. 1.4.1 Hardware platform Every member of the Smart eID product family uses a proven, NXP-developed smart card processor as the physical basis for its implementation. Chips are packaged in standard modules ready to be bonded to an antenna coil and embedded in contactless cards. NXP Semiconductors reserves the right to change aspects of manufacturing technology, including, but not limited to: silicon chip design, silicon die size, choice of silicon technology, silicon chip packaging. All aspects of the hardware platform relevant to NXP Semiconductors direct or indirect customers are documented in the full data sheet and other documents available for the Smart eID product family and its individual members. 2. Features 2.1 Standard family features I EEPROM: choice of 4 KB, 8 KB, 10 KB N Data retention time: 20 years minimum N Endurance: 100 000 cycles minimum I ISO/IEC 7816 LDS-compatible file system implementation supporting open access, BAC and BAC plus operating modes I Configurable authentication and security settings to match customer system requirements I Configurable access conditions for elementary files I Possible activation of the UPDATE BINARY command in BAC plus operating mode I Life cycle management system I ISO/IEC 7816-4 compliant subset of the commands for file manipulation I Proprietary commands for easier personalization and transport key exchange I Flexible support for one fixed functionality ID capable application I Flexible file system based on ICAO LDS structure P304_P308_P310G002_FAM_SDS_1 © NXP B.V. 2008. All rights reserved. Product short data sheet Rev. 01 — 29 July 2008 2 of 8 NXP Semiconductors P304/P308/P310G002 family Smart eID 2.2 Product-specific family features I P304G002 and P308G002: N 7-byte unique identifier (cascade level two according to ISO/IEC 14443-3) I P310G002: N 4-byte unique identifier N With MIFARE 4 KB emulation 2.3 Security features I I I I I I I Support for ICAO BAC and ISO/IEC 8013-3 in BAP configuration 1 Self-securing file system Data encryption on RF channel with replay attack protection Hardware DES using 112-bit keys, featuring key version Data authenticity by 8 bytes CMAC Authentication on application level Hardware exception sensors 2.4 RF interface: ISO/IEC 14443 type A I I I I I I I Contactless transmission of data and powered by the RF field (no battery needed) Operating distance: up to 100 mm (depending on antenna geometry) Operating frequency: 13.56 MHz Fast data transfer: 106 kbit/s, 212 kbit/s, 424 kbit/s High data integrity: 16-bit CRC, parity, bit coding, bit counting; CMAC; MAC True deterministic anticollision mechanism Compliant to ISO/IEC 14443-4 type A protocol 2.5 Supported command set I I I I I I I I I I I SELECT FILE READ BINARY UPDATE BINARY GET CHALLENGE MUTUAL AUTHENTICATE GET DATA INTERNAL AUTHENTICATE CREATE FILE ACTIVATE FILE LOAD IMAGE (proprietary) VERIFY IMAGE (proprietary) P304_P308_P310G002_FAM_SDS_1 © NXP B.V. 2008. All rights reserved. Product short data sheet Rev. 01 — 29 July 2008 3 of 8 NXP Semiconductors P304/P308/P310G002 family Smart eID 3. Applications I I I I I Driving licence eGovernment National identity card Corporate card Vehicle registration sticker 4. Quick reference data Table 2. Ciss Quick reference data Conditions measured on pads LA and LB; test frequency at 17.4 MHz; Tamb = 25 °C; VDD = 0 V measured on pads LA and LB; Tamb = 25 °C Min Typ 13.5 Max Unit pF input capacitance Symbol Parameter foper operating frequency - 13.56 - MHz 5. Ordering information Table 3. Ordering information Package[1] Name P304G002A4 P308G002A4 P310G002A4 [1] For further package options, please contact your local NXP sales representative or to the NXP Semiconductors sales department. To obtain NXP Semiconductors sales office addresses, please e-mail salesaddresses@nxp.com. This package is also known as MOB4. Type number Description plastic leadless module carrier package; 35 mm wide tape Version SOT500-2 PLLMC[2] [2] Table 4. Product type P304G002 P308G002 P310G002 Product types and features EEPROM MIFARE 4 KB Coprocessor (KB) emulation DES AES 4 8 10 no no yes yes yes yes no no no ISO/IEC 7816 IO pads 2 2 2 Interface option contactless interface contactless interface contactless interface P304_P308_P310G002_FAM_SDS_1 © NXP B.V. 2008. All rights reserved. Product short data sheet Rev. 01 — 29 July 2008 4 of 8 NXP Semiconductors P304/P308/P310G002 family Smart eID 6. Functional diagram Data stored in Smart eID EEPROM LA File system Applications - ICAO 9303 based LB Operating system Smart eID hardware loop antenna (size and proportions not to scale) Smart eID physical module Smart eID logical content 001aai433 Fig 1. Functional diagram of P304/P308/P310G002 family 7. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS (ground = 0 V). Symbol Parameter Vesd electrostatic discharge voltage total power dissipation storage temperature Conditions pads VDD, VSS, CLK, RST_N, IO1, IO2, IO3 pads LA, LB Ptot Tstg [1] [2] [3] [1] Min - Max ±4.0 ±2.0 1 - Unit kV kV W °C [1] [2] [3] MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 kΩ; Tamb = −25 °C to +85 °C. Depending on appropriate thermal resistance of the package. Depending on delivery type, refer to NXP Semiconductors General Specification for 8 inch Wafers and to NXP Semiconductors Contact & Dual Interface Chip Card Module Specification. P304_P308_P310G002_FAM_SDS_1 © NXP B.V. 2008. All rights reserved. Product short data sheet Rev. 01 — 29 July 2008 5 of 8 NXP Semiconductors P304/P308/P310G002 family Smart eID 8. Abbreviations Table 6. Acronym AES BAC BAP CMAC CRC DES eID EEPROM FFC ICAO IEC IO ISO KB LDS MAC RF Abbreviations Description Advanced Encryption Standard Basic Access Control Basic Access Protocol Cryptographic MAC Cyclic Redundancy Check Data Encryption Standard electronic Identity Document Electrically Erasable Programmable Read-Only Memory Film Frame Carrier International Civil Aviation Organization International Electrotechnical Commission Input Output International Standardization Organization 1024 bytes Logical Data Structure Message Authentication Code Radio Frequency 9. Revision history Table 7. Revision history Release date Data sheet status Product short data sheet Change notice Supersedes Document ID P304_P308_P310G002_FAM_SDS_1 20080729 P304_P308_P310G002_FAM_SDS_1 © NXP B.V. 2008. All rights reserved. Product short data sheet Rev. 01 — 29 July 2008 6 of 8 NXP Semiconductors P304/P308/P310G002 family Smart eID 10. Legal information 10.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. MIFARE — is a trademark of NXP B.V. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com P304_P308_P310G002_FAM_SDS_1 © NXP B.V. 2008. All rights reserved. Product short data sheet Rev. 01 — 29 July 2008 7 of 8 NXP Semiconductors P304/P308/P310G002 family Smart eID 12. Contents 1 1.1 1.2 1.3 1.4 1.4.1 2 2.1 2.2 2.3 2.4 2.5 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 General description . . . . . . . . . . . . . . . . . . . . . . Smart eID family approach . . . . . . . . . . . . . . . . Smart eID family properties . . . . . . . . . . . . . . . Naming convention . . . . . . . . . . . . . . . . . . . . . . Architecture overview . . . . . . . . . . . . . . . . . . . . Hardware platform . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Standard family features . . . . . . . . . . . . . . . . . . Product-specific family features . . . . . . . . . . . . Security features. . . . . . . . . . . . . . . . . . . . . . . . RF interface: ISO/IEC 14443 type A. . . . . . . . . Supported command set . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Functional diagram . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 2 2 2 2 2 3 3 3 3 4 4 4 5 5 6 6 7 7 7 7 7 7 8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 29 July 2008 Document identifier: P304_P308_P310G002_FAM_SDS_1