PBYR235-40CT

Philips Semiconductors Product specification Rectifier diodes Schottky barrier FEATURES • Low forward volt drop • Fast switching • Reverse surge capability • High thermal cycling performance • low profile surface mounting package PBYR245CT series SYMBOL QUICK REFERENCE DATA VR = 40 V/ 45 V IO(AV) = 2 A VF ≤ 0.45V SOT223 DESCRIPTION a1 1 k2 a2 3 GENERAL DESCRIPTION Dual, common cathode schottky rectifier diodes in a plastic envelope. Intended for use as output rectifiers in low voltage, high frequency switched mode power supplies. The PBYR245CT series is supplied in the surface mounting SOT223 package. PINNING PIN 1 2 3 tab anode 1 cathode anode 2 cathode 4 1 2 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER VRRM VRWM VR IO(AV) IFRM IFSM Peak repetitive reverse voltage Working peak reverse voltage Continuous reverse voltage Average rectified output current (both diodes conducting) Repetitive peak forward current per diode Non-repetitive peak forward current per diode Peak repetitive reverse surge current per diode Operating junction temperature Storage temperature CONDITIONS PBYR2 Tsp ≤ 74 ˚C square wave; δ = 0.5; Tsp ≤ 119 ˚C square wave; δ = 0.5; Tsp ≤ 119 ˚C t = 10 ms t = 8.3 ms sinusoidal; Tj = 125 ˚C prior to surge; with reapplied VRRM(max) pulse width and repetition rate limited by Tj max - 40 MIN. MAX. 40CT 40 40 40 2 2 6 6.6 1 150 150 45CT 45 45 45 UNIT V V V A A A A A ˚C ˚C IRRM Tj Tstg THERMAL RESISTANCES SYMBOL PARAMETER Rth j-a Thermal resistance junction to ambient CONDITIONS pcb mounted, minimum footprint pcb mounted, pad area as in fig:1 MIN. TYP. MAX. UNIT 156 70 K/W K/W July 1998 1 Rev 1.400 Philips Semiconductors Product specification Rectifier diodes Schottky barrier ELECTRICAL CHARACTERISTICS Tj = 25 ˚C unless otherwise specified SYMBOL PARAMETER VF IR Cd Forward voltage Reverse current Junction capacitance CONDITIONS IF = 1 A; Tj = 125˚C IF = 2 A VR = VRWM VR = VRWM; Tj = 100˚C VR = 5 V; f = 1 MHz, Tj = 25˚C to 125˚C PBYR245CT series MIN. - TYP. MAX. UNIT 0.41 0.58 0.03 1.5 60 0.45 0.7 0.2 10 V V mA mA pF PRINTED CIRCUIT BOARD Dimensions in mm. 36 18 60 9 4.6 4.5 10 7 15 50 Fig.1. PCB for thermal resistance and power rating for SOT223. PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick). July 1998 2 Rev 1.400 Philips Semiconductors Product specification Rectifier diodes Schottky barrier PBYR245CT series 1 Forward dissipation, PF (W) Vo = 0.27 V Rs = 0.183 Ohms PBYR245CT 10 Reverse current, IR (mA) PBYR245CT 0.8 0.5 0.6 0.1 0.4 I tp D = 1.0 0.2 125 C 1 100 C 0.1 tp T t 75 C 50 C D= 0.2 0 T 0.01 Tj = 25 C 0.001 0 25 Reverse voltage, VR (V) 50 0 0.5 1 Average forward current, IF(AV) (A) 1.5 Fig.2. Maximum forward dissipation PF = f(IF(AV)) per diode; square current waveform where IF(AV) =IF(RMS) x √D. Forward dissipation, PF (W) PBYR245CT Vo = 0.27 V Rs = 0.183 Ohms Fig.5. Typical reverse leakage current per diode; IR = f(VR); parameter Tj 1 0.8 0.6 Cd / pF 1000 PBYR245CT 4 0.4 0.2 0 2.8 2.2 1.9 a = 1.57 100 10 0 0.2 0.4 0.6 0.8 Average forward current, IF(AV) (A) 1 1 10 VR / V 100 Fig.3. Maximum forward dissipation PF = f(IF(AV)) per diode; sinusoidal current waveform where a = form factor = IF(RMS) / IF(AV). Forward current, IF (A) Tj = 25 C Tj = 125 C 2.5 PBYR245CT Fig.6. Typical junction capacitance per diode; Cd = f(VR); f = 1 MHz; Tj = 25˚C to 125 ˚C. 3 100 Transient thermal impedance, Zth j-sp (K/W) 10 2 typ 1.5 1 0.1 P D tp D= tp T t 1s 10s 1 max 0.5 0 0.01 1us T 10us 100us 1ms 10ms pulse width, tp (s) 100ms 0 0.2 0.4 0.6 0.8 1 Forward voltage, VF (V) 1.2 1.4 PBYR245CT Fig.4. Typical and maximum forward characteristic IF = f(VF); parameter Tj Fig.7. Transient thermal impedance; per diode; Zth j-sp = f(tp). July 1998 3 Rev 1.400 Philips Semiconductors Product specification Rectifier diodes Schottky barrier MECHANICAL DATA Dimensions in mm Net Mass: 0.11 g 0.32 0.24 6.7 6.3 3.1 2.9 PBYR245CT series B 0.2 M A 4 A 0.10 0.02 3.7 3.3 13 7.3 6.7 16 max 1 10 max 1.8 max 1.05 0.85 4.6 2.3 2 0.80 0.60 3 0.1 M (4x) B Fig.8. SOT223 surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0 at 1/8". July 1998 4 Rev 1.400 Philips Semiconductors Product specification Rectifier diodes Schottky barrier DEFINITIONS Data sheet status Objective specification Product specification Limiting values PBYR245CT series This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. © Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July 1998 5 Rev 1.400