PCA9552
16-bit I2C-bus LED driver with programmable blink rates
Rev. 05 — 9 March 2006 Product data sheet
1. General description
The PCA9552 LED blinker blinks LEDs in I2C-bus and SMBus applications where it is necessary to limit bus traffic or free up the I2C-bus master's (MCU, MPU, DSP, chip set, etc.) timer. The uniqueness of this device is the internal oscillator with two programmable blink rates. To blink LEDs using normal I/O expanders like the PCF8574 or PCA9554, the bus master must send repeated commands to turn the LED on and off. This greatly increases the amount of traffic on the I2C-bus and uses up one of the master's timers. The PCA9552 LED blinker instead requires only the initial setup command to program BLINK RATE 1 and BLINK RATE 2 (that is, the frequency and duty cycle) for each individual output. From then on, only one command from the bus master is required to turn each individual open-drain output on, off, or to cycle at BLINK RATE 1 or BLINK RATE 2. Maximum output sink current is 25 mA per bit and 200 mA per package. Any bits not used for controlling the LEDs can be used for General Purpose Parallel Input/Output (GPIO) expansion. The active LOW hardware reset pin (RESET) and Power-On Reset (POR) initializes the registers to their default state, all zeroes, causing the bits to be set HIGH (LED off). Three hardware address pins on the PCA9552 allow eight devices to operate on the same bus.
2. Features
s 16 LED drivers (on, off, flashing at a programmable rate) s 2 selectable, fully programmable blink rates (frequency and duty cycle) between 0.172 Hz and 44 Hz (5.82 seconds and 0.023 seconds) s Input/outputs not used as LED drivers can be used as regular GPIOs s Internal oscillator requires no external components s I2C-bus interface logic compatible with SMBus s Internal power-on reset s Noise filter on SCL/SDA inputs s Active LOW reset input s 16 open-drain outputs directly drive LEDs to 25 mA s Edge rate control on outputs s No glitch on power-up s Supports hot insertion s Low standby current s Operating power supply voltage range of 2.3 V to 5.5 V s 0 Hz to 400 kHz clock frequency
Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
s ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101 s Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA s Packages offered: SO24, TSSOP24, HVQFN24
3. Ordering information
Table 1: Ordering information Tamb = −40 °C to +85 °C Type number PCA9552D PCA9552PW PCA9552BS Topside mark Package Name PCA9552D PCA9552 9552 SO24 TSSOP24 HVQFN24 Description plastic small outline package; 24 leads; body width 7.5 mm plastic thin shrink small outline package; 24 leads; body width 4.4 mm plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 × 4 × 0.85 mm Version SOT137-1 SOT355-1 SOT616-1
4. Block diagram
A0 A1 A2
PCA9552
INPUT REGISTER I2C-BUS CONTROL
SCL SDA
INPUT FILTERS
LED SELECT (LSn) REGISTER
1 VDD RESET 0 PRESCALER 0 REGISTER OSCILLATOR VSS
002aac168
POWER-ON RESET PWM0 REGISTER PWM1 REGISTER
LEDn
BLINK0 BLINK1
PRESCALER 1 REGISTER
Remark: Only one I/O shown for clarity.
Fig 1. Block diagram of PCA9552
PCA9552_5
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 9 March 2006
2 of 28
Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
5. Pinning information
5.1 Pinning
A0 A1 A2 LED0 LED1 LED2 LED3 LED4 LED5
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 RESET 20 LED15 19 LED14 18 LED13 17 LED12 16 LED11 15 LED10 14 LED9 13 LED8
002aac165
A0 A1 A2 LED0 LED1 LED2 LED3 LED4 LED5
1 2 3 4 5 6 7 8 9
24 VDD 23 SDA 22 SCL 21 RESET 20 LED15 19 LED14 18 LED13 17 LED12 16 LED11 15 LED10 14 LED9 13 LED8
002aac166
PCA9552D
PCA9552PW
LED6 10 LED7 11 VSS 12
LED6 10 LED7 11 VSS 12
Fig 2. Pin configuration for SO24
24 A2 23 A1 22 A0 terminal 1 index area LED0 LED1 LED2 LED3 LED4 LED5 1 2 3 4 5 6
Fig 3. Pin configuration for TSSOP24
20 SDA 19 SCL 18 RESET 17 LED15 16 LED14 15 LED13 14 LED12 13 LED11 LED8 10 LED9 11 LED10 12 7 8 9 VSS
002aac167
PCA9552BS
LED6
Transparent top view
Fig 4. Pin configuration for HVQFN24
PCA9552_5
LED7
21 VDD
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
5.2 Pin description
Table 2: Symbol A0 A1 A2 LED0 LED1 LED2 LED3 LED4 LED5 LED6 LED7 VSS LED8 LED9 LED10 LED11 LED12 LED13 LED14 LED15 RESET SCL SDA VDD
[1]
Pin description Pin SO24, TSSOP24 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 HVQFN24 22 23 24 1 2 3 4 5 6 7 8 9 [1] 10 11 12 13 14 15 16 17 18 19 20 21 address input 0 address input 1 address input 2 LED driver 0 LED driver 1 LED driver 2 LED driver 3 LED driver 4 LED driver 5 LED driver 6 LED driver 7 ground supply LED driver 8 LED driver 9 LED driver 10 LED driver 11 LED driver 12 LED driver 13 LED driver 14 LED driver 15 active LOW reset input serial clock line serial data line supply voltage Description
HVQFN package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the printed-circuit board in the thermal pad region.
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
6. Functional description
Refer to Figure 1 “Block diagram of PCA9552”.
6.1 Device address
Following a START condition, the bus master must output the address of the slave it is accessing. The address of the PCA9552 is shown in Figure 5. To conserve power, no internal pull-up resistors are incorporated on the hardware selectable address pins and they must be pulled HIGH or LOW.
slave address 1 1 0 0 A2 A1 A0 R/W
fixed
programmable
002aac169
Fig 5. PCA9552 address
The last bit of the address byte defines the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation.
6.2 Control Register
Following the successful acknowledgement of the slave address, the bus master will send a byte to the PCA9552, which will be stored in the Control Register. This register can be read and written via the I2C-bus.
0
0
0
AI
B3
B2
B1
B0
Auto-Increment flag
register address
002aac170
Reset state: 00h
Fig 6. Control Register
The lowest 3 bits are used as a pointer to determine which register will be accessed. If the Auto-Increment flag (AI) is set, the four low order bits of the Control Register are automatically incremented after a read or write. This allows the user to program the registers sequentially. The contents of these bits will rollover to ‘0000’ after the last register is accessed. When the Auto-Increment flag is set (AI = 1) and a read sequence is initiated, the sequence must start by reading a register different from ‘0' (B3 B2 B1 B0 ≠ 0000). Only the 4 least significant bits are affected by the AI flag. Unused bits must be programmed with zeroes.
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
6.2.1 Control Register definition
Table 3: B3 0 0 0 0 0 0 0 0 1 1 B2 0 0 0 0 1 1 1 1 0 0 Register summary B1 0 0 1 1 0 0 1 1 0 0 B0 0 1 0 1 0 1 0 1 0 1 Symbol INPUT0 INPUT1 PSC0 PWM0 PSC1 PWM1 LS0 LS1 LS2 LS3 Access read only read only read/write read/write read/write read/write read/write read/write read/write read/write Description input register 0 input register 1 frequency prescaler 0 PWM register 0 frequency prescaler 1 PWM register 1 LED0 to LED3 selector LED4 to LED7 selector LED8 to LED11 selector LED12 to LED15 selector
6.3 Register descriptions
6.3.1 INPUT0 - Input register 0
The Input register 0 reflects the state of the device pins (inputs LED0 to LED7). Writes to this register will be acknowledged but will have no effect.
Table 4: Bit Symbol Default INPUT0 - input register 0 description 7 LED7 X 6 LED6 X 5 LED5 X 4 LED4 X 3 LED3 X 2 LED2 X 1 LED1 X 0 LED0 X
Remark: The default value ‘X’ is determined by the externally applied logic level (normally logic 1) when used for directly driving LED with pull-up to VDD.
6.3.2 INPUT1 - Input register 1
The Input register 1 reflects the state of the device pins (inputs LED8 to LED15). Writes to this register will be acknowledged but will have no effect.
Table 5: Bit Symbol Default INPUT1 - input register 1 description 7 LED15 X 6 LED14 X 5 LED13 X 4 LED12 X 3 LED11 X 2 LED10 X 1 LED9 X 0 LED8 X
Remark: The default value ‘X’ is determined by the externally applied logic level (normally logic 1) when used for directly driving LED with pull-up to VDD.
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
6.3.3 PCS0 - Frequency Prescaler 0
PSC0 is used to program the period of the PWM output. The period of BLINK0 = (PSC0 + 1) / 44.
Table 6: Bit Symbol Default PSC0 - Frequency Prescaler 0 register description 7 PSC0[7] 1 6 PSC0[6] 1 5 PSC0[5] 1 4 PSC0[4] 1 3 PSC0[3] 1 2 PSC0[2] 1 1 PSC0[1] 1 0 PSC0[0] 1
6.3.4 PWM0 - Pulse Width Modulation 0
The PWM0 register determines the duty cycle of BLINK0. The outputs are LOW (LED off) when the count is less than the value in PWM0 and HIGH when it is greater. If PWM0 is programmed with 00h, then the PWM0 output is always LOW. The duty cycle of BLINK0 = (256 − PWM0) / 256.
Table 7: Bit Symbol Default PWM0 - Pulse Width Modulation 0 register description 7 PWM0 [7] 1 6 PWM0 [6] 0 5 PWM0 [5] 0 4 PWM0 [4] 0 3 PWM0 [3] 0 2 PWM0 [2] 0 1 PWM0 [1] 0 0 PWM0 [0] 0
6.3.5 PCS1 - Frequency Prescaler 1
PSC1 is used to program the period of the PWM output. The period of BLINK1 = (PSC1 + 1) / 44.
Table 8: Bit Symbol Default PSC1 - Frequency Prescaler 1 register description 7 PSC1[7] 1 6 PSC1[6] 1 5 PSC1[5] 1 4 PSC1[4] 1 3 PSC1[3] 1 2 PSC1[2] 1 1 PSC1[1] 1 0 PSC1[0] 1
6.3.6 PWM1 - Pulse Width Modulation 1
The PWM1 register determines the duty cycle of BLINK1. The outputs are LOW (LED off) when the count is less than the value in PWM1 and HIGH when it is greater. If PWM1 is programmed with 00h, then the PWM1 output is always LOW. The duty cycle of BLINK1 = (256 − PWM1) / 256.
Table 9: Bit Symbol Default PWM1 - Pulse Width Modulation 1 register description 7 PWM1 [7] 1 6 PWM1 [6] 0 5 PWM1 [5] 0 4 PWM1 [4] 0 3 PWM1 [3] 0 2 PWM1 [2] 0 1 PWM1 [1] 0 0 PWM1 [0] 0
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
6.3.7 LS0 to LS3 - LED selector registers
The LSn LED select registers determine the source of the LED data. 00 = output is set LOW (LED on) 01 = output is set high-impedance (LED off; default) 10 = output blinks at PWM0 rate 11 = output blinks at PWM1 rate
Table 10: LS0 to LS3 - LED selector registers bit description Legend: * default value Register LS0 Bit 7:6 5:4 3:2 1:0 LS1 7:6 5:4 3:2 1:0 LS2 7:6 5:4 3:2 1:0 LS3 7:6 5:4 3:2 1:0 Value 01* 01* 01* 01* 01* 01* 01* 01* 01* 01* 01* 01* 01* 01* 01* 01* Description LED3 selected LED2 selected LED1 selected LED0 selected LED7 selected LED6 selected LED5 selected LED4 selected LED11 selected LED10 selected LED9 selected LED8 selected LED15 selected LED14 selected LED13 selected LED12 selected LS0 - LED0 to LED3 selector
LS1 - LED4 to LED7 selector
LS2 - LED8 to LED11 selector
LS3 - LED12 to LED15 selector
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
6.4 Pins used as GPIOs
LED pins not used to control LEDs can be used as general purpose I/Os (GPIOs). For use as input, set LEDn to high-impedance (01) and then read the pin state via the input register. For use as output, connect external pull-up resistor to the pin and size it according to the DC recommended operating characteristics. LED output pin is HIGH when the output is programmed as high-impedance, and LOW when the output is programmed LOW through the ‘LED selector’ register. The output can be pulse-width controlled when PWM0 or PWM1 are used.
6.5 Power-on reset
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9552 in a reset condition until VDD has reached VPOR. At that point, the reset condition is released and the PCA9552 registers are initialized to their default states. Thereafter, VDD must be lowered below 0.2 V to reset the device.
6.6 External RESET
A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The PCA9552 registers and I2C-bus state machine will be held in their default states until the RESET input is once again HIGH. This input requires a pull-up resistor to VDD if no active connection is used.
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Figure 7).
SDA
SCL data line stable; data valid change of data allowed
mba607
Fig 7. Bit transfer
7.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P) (see Figure 8.)
SDA
SDA
SCL S START condition P STOP condition
SCL
mba608
Fig 8. Definition of START and STOP conditions
7.2 System configuration
A device generating a message is a ‘transmitter'; a device receiving is the ‘receiver'. The device that controls the message is the ‘master' and the devices which are controlled by the master are the ‘slaves' (see Figure 9).
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Product data sheet
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
SDA SCL MASTER TRANSMITTER/ RECEIVER SLAVE RECEIVER SLAVE TRANSMITTER/ RECEIVER MASTER TRANSMITTER MASTER TRANSMITTER/ RECEIVER I2C-BUS MULTIPLEXER
SLAVE
002aaa966
Fig 9. System configuration
7.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master to generate a STOP condition.
data output by transmitter not acknowledge data output by receiver acknowledge SCL from master S START condition 1 2 8 clock pulse for acknowledgement
002aaa987
9
Fig 10. Acknowledgement on the I2C-bus
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
7.4 Bus transactions
SCL
1
2
3
4
5
6
7
8
9 command byte A 0 0 0 AI B3 B2 B1 B0 A acknowledge from slave data to register DATA 1 A acknowledge from slave
slave address SDA S 1 1 0 0 A2 A1 A0 0 R/W
START condition write to register
acknowledge from slave
tv(Q) data out from port DATA 1 VALID
002aac185
Fig 11. Write to register
slave address SDA S 1 1 0 0 A2 A1 A0 0 R/W A 0 0
command byte 0 AI B3 B2 B1 B0 A acknowledge from slave data from register A DATA (first byte) Auto-Increment register address if AI = 1 A acknowledge from master data from register DATA (last byte) NA P STOP condition (cont.)
START condition
acknowledge from slave slave address (cont.) S 1 1 0 0 A2 A1 A0 1 R/W acknowledge from slave
(repeated) START condition
no acknowledge from master
at this moment master-transmitter becomes master-receiver and slave-receiver becomes slave-transmitter
002aac186
Fig 12. Read from register
no acknowledge from master slave address SDA S 1 1 0 0 A2 A1 A0 1 R/W A acknowledge from slave data from port DATA 1 A acknowledge from master data from port DATA 4 NA P STOP condition
START condition
read from port th(D) data into port DATA 2 DATA 3 tsu(D) DATA 4
002aac187
Remark: This figure assumes the command byte has previously been programmed with 00h.
Fig 13. Read Input Port register
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
8. Application design-in information
5V 5V
I2C-BUS/SMBus MASTER SDA SCL
10 kΩ (3×)
VDD SDA SCL LED0 LED1 LED2 RESET LED3 LED4 LED5 LED6
PCA9552 LED7
LED8 LED9 LED10 A2 A1 A0 VSS LED11 LED12 LED13 LED14 LED15
002aac188
GPIOs
LED0 to LED12 are used as LED drivers. LED13 to LED15 are used as regular GPIOs.
Fig 14. Typical application
8.1 Minimizing IDD when the I/O is used to control LEDs
When the I/Os are used to control LEDs, they are normally connected to VDD through a resistor as shown in Figure 15. Since the LED acts as a diode, when the LED is off the I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes lower than VDD and is specified as ∆Istb in Table 13 “Static characteristics”. Designs needing to minimize current consumption, such as battery power applications, should consider maintaining the I/O pins greater than or equal to VDD when the LED is off. Figure 15 shows a high value resistor in parallel with the LED. Figure 16 shows VDD less than the LED supply voltage by at least 1.2 V. Both of these methods maintain the input/output VI at or above VDD and prevents additional supply current consumption when the LED is off.
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
VDD
3.3 V
5V
VDD
LED
100 kΩ
VDD
LED
LEDn
LEDn
002aac189
002aac190
Fig 15. High value resistor in parallel with the LED
Fig 16. Device supplied by a lower voltage
8.2 Programming example
The following example will show how to set LED0 to LED3 on. It will then set LED4 and LED5 to blink at 1 Hz at a 50 % duty cycle. LED6 and LED7 will be set to blink at 4 Hz and at a 25 % duty cycle. LED8 to LED15 will be set to off.
Table 11: START PCA9552 address with A0 to A2 = LOW PSC0 subaddress + Auto-Increment Set prescaler PSC0 to achieve a period of 1 second: PSC0 + 1 Blink period = 1 = ---------------------44 PSC0 = 43 Set PWM0 duty cycle to 50 %: 256 – PWM0 ------------------------------- = 0.5 256 PWM0 = 128 Set prescaler PCS1 to achieve a period of 0.25 seconds: PSC1 + 1 Blink period = 0.25 = ---------------------44 PSC1 = 10 Set PWM1 output duty cycle to 25 %: 256 – PWM1 ------------------------------- = 0.25 256 PWM1 = 192 Set LED0 to LED3 on Set LED4 and LED5 to PWM0, and LED6 or LED7 to PWM1 Set LED8 to LED11 off Set LED12 to LED15 off STOP 00h FAh 55h 55h P C0h 0Ah 80h Programming PCA9552 I2C-bus S C0h 12h 2Bh
Program sequence
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
9. Limiting values
Table 12: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD VI/O IO(LEDn) ISS Ptot Tstg Tamb Parameter supply voltage voltage on an input/output pin output current on pin LEDn ground supply current total power dissipation storage temperature ambient temperature operating LEDn used as an I/O LEDn used as an I/O Conditions Min −0.5 VSS − 0.5 −65 −40 Max +6.0 5.5 ±25 200 400 +150 +85 Unit V V mA mA mW °C °C
10. Static characteristics
Table 13: Static characteristics VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Supply VDD IDD Istb ∆Istb supply voltage supply current standby current additional standby current Operating mode; VDD = 5.5 V; no load; VI = VDD or VSS; fSCL = 100 kHz Standby mode; VDD = 5.5 V; no load; VI = VDD or VSS; fSCL = 0 kHz Standby mode; VDD = 5.5 V; every LED I/O at VI = 4.3 V; fSCL = 0 kHz VDD = 3.3 V; no load; VI = VDD or VSS 2.3 350 2.1 5.5 550 5.0 2 V µA µA mA Parameter Conditions Min Typ [1] Max Unit
VPOR VIL VIH IOL IL Ci I/Os VIL VIH IOL
power-on reset voltage [2] LOW-level input voltage HIGH-level input voltage LOW-level output current leakage current input capacitance LOW-level input voltage HIGH-level input voltage LOW-level output current
−0.5 0.7VDD
1.7 6.5 4.4 2.6
2.2 0.3VDD 5.5 +1 5 0.8 5.5 +1 5
V V V mA µA pF V V mA mA mA mA mA mA µA pF
15 of 28
Input SCL; input/output SDA
VOL = 0.4 V VI = VDD = VSS VI = VSS
3 −1 −0.5 2.0
VOL = 0.4 V; VDD = 2.3 V VOL = 0.4 V; VDD = 3.0 V VOL = 0.4 V; VDD = 5.0 V VOL = 0.7 V; VDD = 2.3 V VOL = 0.7 V; VDD = 3.0 V VOL = 0.7 V; VDD = 5.0 V
[3] [3] [3] [3] [3] [3]
9 12 15 15 20 25 −1 -
ILI Cio
PCA9552_5
input leakage current input/output capacitance
VDD = 3.6 V; VI = 0 V or VDD
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 9 March 2006
Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
Table 13: Static characteristics …continued VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol VIL VIH ILI Ci
[1] [2] [3]
Parameter LOW-level input voltage HIGH-level input voltage input leakage current input capacitance
Conditions
Min −0.5 2.0 −1
Typ [1] 2.3
Max 0.8 5.5 +1 5
Unit V V µA pF
Select inputs A0, A1, A2; RESET
VI = VSS
-
All typical values at 3.3 V and 25 °C. VDD must be lowered to 0.2 V in order to reset part. Each I/O must be externally limited to a maximum of 25 mA and each octal ([LED0 to LED7] and [LED8 to LED15]) must be limited to a maximum current of 100 mA for a device total of 200 mA.
20 % percent variation 0%
002aac191
(1)
20 % percent variation 0%
002aac192
(1)
(2)
(2)
−20 %
(3)
−20 %
(3)
−40 % −40
−20
0
20
40
60
100 Tamb (°C) 80
−40 % −40
−20
0
20
40
60
100 80 Tamb (°C)
(1) maximum (2) average (3) minimum
(1) maximum (2) average (3) minimum
Fig 17. Typical frequency variation over process at VDD = 2.3 V to 3.0 V
Fig 18. Typical frequency variation over process at VDD = 3.0 V to 5.5 V
PCA9552_5
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Product data sheet
Rev. 05 — 9 March 2006
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Philips Semiconductors
PCA9552
16-bit I2C-bus LED driver with programmable blink rates
11. Dynamic characteristics
Table 14: Symbol Dynamic characteristics Parameter Conditions Standard mode I2C-bus Min fSCL tBUF tHD;STA tSU;STA tSU;STO tHD;DAT tVD;ACK tVD;DAT tSU;DAT tLOW tHIGH tf tr tSP SCL clock frequency bus free time between a STOP and START condition hold time (repeated) START condition set-up time for a repeated START condition set-up time for STOP condition data hold time data valid acknowledge time data valid time data set-up time LOW period of the SCL clock HIGH period of the SCL clock fall time of both SDA and SCL signals rise time of both SDA and SCL signals pulse width of spikes that must be suppressed by the input filter data output valid time data input setup time data input hold time reset pulse width reset recovery time reset time
[4] [5] [1]
Fast mode I2C-bus Min 0 1.3 0.6 0.6 0.6 0 100 1.3 0.6 20 + 0.1Cb 20 + 0.1Cb [3] [3]
Unit
Max 100 600 600 1500 300 1000 50
Max 400 600 600 600 300 300 50 kHz µs µs µs µs ns ns ns ns ns µs µs ns ns ns
0 4.7 4.0 4.7 4.0 0 250 4.7 4.0 LOW-level HIGH-level
[2] [2]
Port timing tv(Q) tsu(D) th(D) Reset tw(rst) trec(rst) trst
[1] [2] [3] [4] [5]
100 1 10 0 400
250 -
100 1 10 0 400
250 -
ns ns µs ns ns ns
tVD;ACK = time for Acknowledgement signal from SCL LOW to SDA (out) LOW. tVD;DAT = minimum time for SDA data out to be valid following SCL LOW. Cb = total capacitance of one bus line in pF. Resetting the device while actively communicating on the bus may cause glitches or errant STOP conditions. Upon reset, the full delay will be the sum of trst and the RC time constant of the SDA bus.
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16-bit I2C-bus LED driver with programmable blink rates
SDA tBUF tLOW SCL tr tf tHD;STA tSP
tHD;STA P S tHD;DAT tHIGH tSU;DAT Sr
tSU;STA
tSU;STO P
002aaa986
Fig 19. Definition of timing on the I2C-bus
protocol
START condition (S) tSU;STA
bit 7 MSB (A7) tLOW tHIGH
bit 6 (A6)
bit 0 (R/W)
acknowledge (A)
STOP condition (P)
1/f
SCL
SCL tBUF tr tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab175
Rise and fall times refer to VIL and VIH.
Fig 20. I2C-bus timing diagram
START SCL
ACK or read cycle
SDA 30 % trst
RESET
50 % trec(rst)
50 % tw(rst)
50 %
trst LEDn 50 % LED off
002aac193
Fig 21. Reset timing
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PCA9552
16-bit I2C-bus LED driver with programmable blink rates
12. Test information
VDD open GND
VDD PULSE GENERATOR VI D.U.T.
RT
VO
RL 500 Ω
CL 50 pF
002aab284
RL = load resistor for LEDn. RL for SDA and SCL > 1 kΩ (3 mA or less current) CL = load capacitance includes jig and probe capacitance RT = termination resistance should be equal to the output impedance Zo of the pulse generators.
Fig 22. Test circuitry for switching times
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Product data sheet
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16-bit I2C-bus LED driver with programmable blink rates
13. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) θ A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
θ
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 23. Package outline SOT137-1 (SO24)
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PCA9552
16-bit I2C-bus LED driver with programmable blink rates
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
E
A
X
c y HE vMA
Z
24
13
Q A2 pin 1 index A1 (A 3) A
θ Lp L
1
e bp
12
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 7.9 7.7 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 θ 8o 0o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 24. Package outline SOT355-1 (TSSOP24)
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Product data sheet
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PCA9552
16-bit I2C-bus LED driver with programmable blink rates
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm
SOT616-1
D
B
A
terminal 1 index area A A1 E c
detail X
e1
1/2 e
C b 12 vMCAB wMC 13 e y1 C y
e 7 L 6
Eh
1/2 e
e2
1
18
terminal 1 index area
24 Dh 0
19 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 4.1 3.9 Dh 2.25 1.95 E (1) 4.1 3.9 Eh 2.25 1.95 e 0.5 e1 2.5 e2 2.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT616-1 REFERENCES IEC --JEDEC MO-220 JEITA --EUROPEAN PROJECTION ISSUE DATE 01-08-08 02-10-22
Fig 25. Package outline SOT616-1 (HVQFN24)
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16-bit I2C-bus LED driver with programmable blink rates
14. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe you must take normal precautions appropriate to handling integrated circuits.
15. Soldering
15.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
15.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
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16-bit I2C-bus LED driver with programmable blink rates
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
15.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C.
15.5 Package related soldering information
Table 15: Package [1] BGA, LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8],
[1]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave Reflow [2] suitable suitable not suitable not suitable [4]
HTSSON..T [3],
suitable not WQCCN..L [8] recommended [5] [6] not recommended [7] not suitable
suitable suitable suitable not suitable
PMFP [9],
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office.
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PCA9552
16-bit I2C-bus LED driver with programmable blink rates
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[3]
[4]
[5] [6] [7] [8]
[9]
16. Abbreviations
Table 16: Acronym CDM DSP ESD HBM GPIO IC I2C-bus LED MCU MM MPU POR PWM SMBus Abbreviations Description Charged Device Model Digital Signal Processor ElectroStatic Discharge Human Body Model General Purpose Input/Output Integrated Circuit Inter IC bus Light Emitting Diode Microcontroller Machine Model Microprocessor Power-On Reset Pulse Width Modulation System Management Bus
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16-bit I2C-bus LED driver with programmable blink rates
17. Revision history
Table 17: Revision history Release date 20060309 Data sheet status Product data sheet Change notice Doc. number Supersedes PCA9552_4 Document ID PCA9552_5 Modifications:
• • • • • • •
The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Table 1 “Ordering information”: changed Topside mark of TSSOP24 package from ‘PCA9552PW’ to ‘PCA9552’ Table 2 “Pin description”: added Table note 1 regarding VSS pin on HVQFN24 package Section 6.6 “External RESET”: changed symbol “tW” to “tw(rst)” Figure 11: changed symbol “tpv” to “tv(Q)” Figure 13: changed symbol “tph” to “th(D)”; changed symbol “tps” to “tsu(D)” Section 8.1 “Minimizing IDD when the I/O is used to control LEDs”: – 1st paragraph, 3rd sentence: changed symbol “∆IDD” to “∆Istb” – 2nd paragraph, 4th sentence: changed symbol “VIN” to “VI”
•
Table 12 “Limiting values”: – changed parameter description of VI/O from “DC voltage on an I/O” to “voltage on an input/output pin” – changed symbol “II/O (DC output current on an I/O)” to ‘IO(LEDn) (output current on pin LEDn)
•
Table 13 “Static characteristics”: – moved second sentence of description below title to (new)Table note 1 and added its reference at column “Typ” – changed symbol “∆IDD” to “∆Istb” – under subsection “I/Os”, changed symbol “IL” to “ILI”
•
Table 14 “Dynamic characteristics”: – updated parameter descriptions – under subsection “Port timing”: changed symbol “tPV” to “tv(Q)”; changed symbol “tPS” to “tsu(D)”; changed symbol “tPH” to “th(D)” – under subsection “Reset”: changed symbol “tW” to “tw(rst)”; changed symbol “tREC” to “trec(rst)”; changed symbol “tRESET” to “trst” (also in Table note 5)
•
PCA9552_4 PCA9552_3 PCA9552_2 PCA9552_1
Figure 21 “Reset timing” modified to harmonize letter symbols Product data sheet Product data Product data Product data 853-2374 29857 of 2003 Apr 24 853-2374 29331 of 2002 Dec 20 853-2374 28878 of 2002 Sep 09 9397 750 13727 9397 750 11463 9397 750 11156 9397 750 10329 PCA9552_3 PCA9552_2 PCA9552_1 -
20041001 20030502 20030224 20020927
PCA9552_5
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16-bit I2C-bus LED driver with programmable blink rates
18. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
21. Trademarks
Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.
20. Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
22. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
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16-bit I2C-bus LED driver with programmable blink rates
23. Contents
1 2 3 4 5 5.1 5.2 6 6.1 6.2 6.2.1 6.3 6.3.1 6.3.2 6.3.3 6.3.4 6.3.5 6.3.6 6.3.7 6.4 6.5 6.6 7 7.1 7.1.1 7.2 7.3 7.4 8 8.1 8.2 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 15.5 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Device address . . . . . . . . . . . . . . . . . . . . . . . . . 5 Control Register . . . . . . . . . . . . . . . . . . . . . . . . 5 Control Register definition . . . . . . . . . . . . . . . . 6 Register descriptions . . . . . . . . . . . . . . . . . . . . 6 INPUT0 - Input register 0 . . . . . . . . . . . . . . . . . 6 INPUT1 - Input register 1 . . . . . . . . . . . . . . . . . 6 PCS0 - Frequency Prescaler 0 . . . . . . . . . . . . . 7 PWM0 - Pulse Width Modulation 0 . . . . . . . . . . 7 PCS1 - Frequency Prescaler 1 . . . . . . . . . . . . . 7 PWM1 - Pulse Width Modulation 1 . . . . . . . . . . 7 LS0 to LS3 - LED selector registers . . . . . . . . . 8 Pins used as GPIOs . . . . . . . . . . . . . . . . . . . . . 9 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9 External RESET . . . . . . . . . . . . . . . . . . . . . . . . 9 Characteristics of the I2C-bus. . . . . . . . . . . . . 10 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 START and STOP conditions . . . . . . . . . . . . . 10 System configuration . . . . . . . . . . . . . . . . . . . 10 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 11 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 12 Application design-in information . . . . . . . . . 13 Minimizing IDD when the I/O is used to control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Programming example . . . . . . . . . . . . . . . . . . 14 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15 Static characteristics. . . . . . . . . . . . . . . . . . . . 15 Dynamic characteristics . . . . . . . . . . . . . . . . . 17 Test information . . . . . . . . . . . . . . . . . . . . . . . . 19 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 Handling information. . . . . . . . . . . . . . . . . . . . 23 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 24 Package related soldering information . . . . . . 24 16 17 18 19 20 21 22 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Data sheet status. . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . 25 26 27 27 27 27 27
© Koninklijke Philips Electronics N.V. 2006
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 9 March 2006 Document number: PCA9552_5
Published in The Netherlands