PCF8591

INTEGRATED CIRCUITS DATA SHEET PCF8591 8-bit A/D and D/A converter Product specification Supersedes data of 1997 Apr 02 File under Integrated Circuits, IC12 1998 Jul 02 Philips Semiconductors Product specification 8-bit A/D and D/A converter CONTENTS 1 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.5 7.6 8 8.1 8.2 8.3 8.4 8.5 9 10 11 12 13 14 15 16 17 17.1 17.2 17.2.1 17.2.2 17.3 17.3.1 17.3.2 17.3.3 18 19 20 FEATURES APPLICATIONS GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Addressing Control byte D/A conversion A/D conversion Reference voltage Oscillator CHARACTERISTICS OF THE I2C-BUS Bit transfer Start and stop conditions System configuration Acknowledge I2C-bus protocol LIMITING VALUES HANDLING DC CHARACTERISTICS D/A CHARACTERISTICS A/D CHARACTERISTICS AC CHARACTERISTICS APPLICATION INFORMATION PACKAGE OUTLINES SOLDERING Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS PCF8591 1998 Jul 02 2 Philips Semiconductors Product specification 8-bit A/D and D/A converter 1 FEATURES PCF8591 • Single power supply • Operating supply voltage 2.5 V to 6 V • Low standby current • Serial input/output via I2C-bus • Address by 3 hardware address pins • Sampling rate given by I2C-bus speed • 4 analog inputs programmable as single-ended or differential inputs • Auto-incremented channel selection • Analog voltage range from VSS to VDD • On-chip track and hold circuit • 8-bit successive approximation A/D conversion • Multiplying DAC with one analog output. 2 APPLICATIONS 3 GENERAL DESCRIPTION The PCF8591 is a single-chip, single-supply low power 8-bit CMOS data acquisition device with four analog inputs, one analog output and a serial I2C-bus interface. Three address pins A0, A1 and A2 are used for programming the hardware address, allowing the use of up to eight devices connected to the I2C-bus without additional hardware. Address, control and data to and from the device are transferred serially via the two-line bidirectional I2C-bus. The functions of the device include analog input multiplexing, on-chip track and hold function, 8-bit analog-to-digital conversion and an 8-bit digital-to-analog conversion. The maximum conversion rate is given by the maximum speed of the I2C-bus. • Closed loop control systems • Low power converter for remote data acquisition • Battery operated equipment • Acquisition of analog values in automotive, audio and TV applications. 4 ORDERING INFORMATION TYPE NUMBER PCA8591P PCA8591T PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 7.5 mm VERSION SOT38-1 SOT162-1 1998 Jul 02 3 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 1998 Jul 02 4 Product specification Fig.1 Block diagram. 5 Philips Semiconductors 8-bit A/D and D/A converter PCF8591 BLOCK DIAGRAM Philips Semiconductors Product specification 8-bit A/D and D/A converter 6 PINNING PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 negative supply voltage I2C-bus data input/output I2C-bus clock input oscillator input/output external/internal switch for oscillator input analog ground voltage reference input analog output (D/A converter) positive supply voltage Fig.2 Pinning diagram. hardware address analog inputs (A/D converter) DESCRIPTION PCF8591 SYMBOL AINO AIN1 AIN2 AIN3 A0 A1 A2 VSS SDA SCL OSC EXT AGND VREF AOUT VDD 1998 Jul 02 5 Philips Semiconductors Product specification 8-bit A/D and D/A converter 7 7.1 FUNCTIONAL DESCRIPTION Addressing 7.2 Control byte PCF8591 Each PCF8591 device in an I2C-bus system is activated by sending a valid address to the device. The address consists of a fixed part and a programmable part. The programmable part must be set according to the address pins A0, A1 and A2. The address always has to be sent as the first byte after the start condition in the I2C-bus protocol. The last bit of the address byte is the read/write-bit which sets the direction of the following data transfer (see Figs 3, 15 and 16). The second byte sent to a PCF8591 device will be stored in its control register and is required to control the device function. The upper nibble of the control register is used for enabling the analog output, and for programming the analog inputs as single-ended or differential inputs. The lower nibble selects one of the analog input channels defined by the upper nibble (see Fig.4). If the auto-increment flag is set the channel number is incremented automatically after each A/D conversion. If the auto-increment mode is desired in applications where the internal oscillator is used, the analog output enable flag in the control byte (bit 6) should be set. This allows the internal oscillator to run continuously, thereby preventing conversion errors resulting from oscillator start-up delay. The analog output enable flag may be reset at other times to reduce quiescent power consumption. Fig.3 Address byte. The selection of a non-existing input channel results in the highest available channel number being allocated. Therefore, if the auto-increment flag is set, the next selected channel will be always channel 0. The most significant bits of both nibbles are reserved for future functions and have to be set to 0. After a Power-on reset condition all bits of the control register are reset to 0. The D/A converter and the oscillator are disabled for power saving. The analog output is switched to a high-impedance state. 1998 Jul 02 6 Philips Semiconductors Product specification 8-bit A/D and D/A converter PCF8591 Fig.4 Control byte. 1998 Jul 02 7 Philips Semiconductors Product specification 8-bit A/D and D/A converter 7.3 D/A conversion PCF8591 The on-chip D/A converter is also used for successive approximation A/D conversion. In order to release the DAC for an A/D conversion cycle the unity gain amplifier is equipped with a track and hold circuit. This circuit holds the output voltage while executing the A/D conversion. The output voltage supplied to the analog output AOUT is given by the formula shown in Fig.6. The waveforms of a D/A conversion sequence are shown in Fig.7. The third byte sent to a PCF8591 device is stored in the DAC data register and is converted to the corresponding analog voltage using the on-chip D/A converter. This D/A converter consists of a resistor divider chain connected to the external reference voltage with 256 taps and selection switches. The tap-decoder switches one of these taps to the DAC output line (see Fig.5). The analog output voltage is buffered by an auto-zeroed unity gain amplifier. This buffer amplifier may be switched on or off by setting the analog output enable flag of the control register. In the active state the output voltage is held until a further data byte is sent. Fig.5 DAC resistor divider chain. 1998 Jul 02 8 Philips Semiconductors Product specification 8-bit A/D and D/A converter PCF8591 Fig.6 DAC data and DC conversion characteristics. Fig.7 D/A conversion sequence. 1998 Jul 02 9 Philips Semiconductors Product specification 8-bit A/D and D/A converter 7.4 A/D conversion PCF8591 The conversion result is stored in the ADC data register and awaits transmission. If the auto-increment flag is set the next channel is selected. The first byte transmitted in a read cycle contains the conversion result code of the previous read cycle. After a Power-on reset condition the first byte read is a hexadecimal 80. The protocol of an I2C-bus read cycle is shown in Chapter 8, Figs 15 and 16. The maximum A/D conversion rate is given by the actual speed of the I2C-bus. The A/D converter makes use of the successive approximation conversion technique. The on-chip D/A converter and a high-gain comparator are used temporarily during an A/D conversion cycle. An A/D conversion cycle is always started after sending a valid read mode address to a PCF8591 device. The A/D conversion cycle is triggered at the trailing edge of the acknowledge clock pulse and is executed while transmitting the result of the previous conversion (see Fig.8). Once a conversion cycle is triggered an input voltage sample of the selected channel is stored on the chip and is converted to the corresponding 8-bit binary code. Samples picked up from differential inputs are converted to an 8-bit two’s complement code (see Figs 9 and 10). Fig.8 A/D conversion sequence. 1998 Jul 02 10 Philips Semiconductors Product specification 8-bit A/D and D/A converter PCF8591 Fig.9 A/D conversion characteristics of single-ended inputs. Fig.10 A/D conversion characteristics of differential inputs. 1998 Jul 02 11 Philips Semiconductors Product specification 8-bit A/D and D/A converter 7.5 Reference voltage 7.6 Oscillator PCF8591 For the D/A and A/D conversion either a stable external voltage reference or the supply voltage has to be applied to the resistor divider chain (pins VREF and AGND). The AGND pin has to be connected to the system analog ground and may have a DC off-set with reference to VSS. A low frequency may be applied to the VREF and AGND pins. This allows the use of the D/A converter as a one-quadrant multiplier; see Chapter 15 and Fig.6. The A/D converter may also be used as a one or two quadrant analog divider. The analog input voltage is divided by the reference voltage. The result is converted to a binary code. In this application the user has to keep the reference voltage stable during the conversion cycle. An on-chip oscillator generates the clock signal required for the A/D conversion cycle and for refreshing the auto-zeroed buffer amplifier. When using this oscillator the EXT pin has to be connected to VSS. At the OSC pin the oscillator frequency is available. If the EXT pin is connected to VDD the oscillator output OSC is switched to a high-impedance state allowing the user to feed an external clock signal to OSC. 1998 Jul 02 12 Philips Semiconductors Product specification 8-bit A/D and D/A converter 8 CHARACTERISTICS OF THE I2C-BUS PCF8591 The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only when the bus is not busy. 8.1 Bit transfer One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal. handbook, full pagewidth SDA SCL data line stable; data valid change of data allowed MBC621 Fig.11 Bit transfer. 8.2 Start and stop conditions Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH, is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH, is defined as the stop condition (P). handbook, full pagewidth SDA SDA SCL S START condition P STOP condition SCL MBC622 Fig.12 Definition of START and STOP condition. 1998 Jul 02 13 Philips Semiconductors Product specification 8-bit A/D and D/A converter 8.3 System configuration PCF8591 A device generating a message is a ‘transmitter’, a device receiving a message is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’. SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER MBA605 SLAVE RECEIVER MASTER TRANSMITTER Fig.13 System configuration. 8.4 Acknowledge The number of data bytes transferred between the start and stop conditions from transmitter to receiver is not limited. Each data byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter whereas the master also generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a stop condition. handbook, full pagewidth DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL FROM MASTER S START condition clock pulse for acknowledgement MBC602 1 2 8 9 Fig.14 Acknowledgement on the I2C-bus. 1998 Jul 02 14 Philips Semiconductors Product specification 8-bit A/D and D/A converter 8.5 I2C-bus protocol PCF8591 After a start condition a valid hardware address has to be sent to a PCF8591 device. The read/write bit defines the direction of the following single or multiple byte data transfer. For the format and the timing of the start condition (S), the stop condition (P) and the acknowledge bit (A) refer to the I2C-bus characteristics. In the write mode a data transfer is terminated by sending either a stop condition or the start condition of the next data transfer. Fig.15 Bus protocol for write mode, D/A conversion. Fig.16 Bus protocol for read mode, A/D conversion. 1998 Jul 02 15 Philips Semiconductors Product specification 8-bit A/D and D/A converter 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI II IO IDD, ISS Ptot PO Tamb Tstg 10 HANDLING PARAMETER supply voltage (pin 16) input voltage (any input) DC input current DC output current VDD or VSS current total power dissipation per package power dissipation per output operating ambient temperature storage temperature MIN. −0.5 −0.5 − − − − − −40 −65 +8.0 VDD + 0.5 ±10 ±20 ±50 300 100 +85 +150 MAX. PCF8591 UNIT V V mA mA mA mW mW °C °C Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under “Handling MOS Devices”. 1998 Jul 02 16 Philips Semiconductors Product specification 8-bit A/D and D/A converter 11 DC CHARACTERISTICS VDD = 2.5 V to 6 V; VSS = 0 V; Tamb = −40 °C to +85 °C unless otherwise specified. SYMBOL Supply VDD IDD supply voltage (operating) supply current standby operating, AOUT off operating, AOUT active VPOR VIL VIH IL Power-on reset level VI = VSS or VDD; no load fSCL = 100 kHz fSCL = 100 kHz note 1 − − − 0.8 1 125 0.45 − − − − − − − − − − 100 − − 15 2.5 − PARAMETER CONDITIONS MIN. TYP. PCF8591 MAX. UNIT 6.0 V µA µA mA V 250 1.0 2.0 0.3 × VDD VDD +250 +1 5 − Digital inputs/output: SCL, SDA, A0, A1, A2 LOW level input voltage HIGH level input voltage leakage current A0, A1, A2 SCL, SDA Ci IOL VREF VAGND ILI RREF ILI fOSC Notes 1. The power on reset circuit resets the I2C-bus logic when VDD is less than VPOR. 2. A further extension of the range is possible, if the following conditions are fulfilled: V REF + V AGND V REF + V AGND ------------------------------------- ≥ 0.8V, V DD – ------------------------------------- ≥ 0.4V 2 2 input capacitance LOW level SDA output current VOL = 0.4 V reference voltage analog ground voltage input leakage current input resistance pins VREF and AGND VREF > VAGND; note 2 VREF > VAGND; note 2 VI = VSS to VDD VI = VSS to VDD −250 −1 − 3.0 nA µA pF mA 0 0.7 × VDD V V Reference voltage inputs VSS + 1.6 VSS −250 − − 0.75 VDD +250 − V nA kΩ VDD − 0.8 V Oscillator: OSC, EXT input leakage current oscillator frequency 250 1.25 nA MHz 1998 Jul 02 17 Philips Semiconductors Product specification 8-bit A/D and D/A converter PCF8591 12 D/A CHARACTERISTICS VDD = 5.0 V; VSS = 0 V; VREF = 5.0 V; VAGND = 0 V; RL = 10 kΩ; CL = 100 pF; Tamb = −40 °C to +85 °C unless otherwise specified. SYMBOL Analog output VOA ILO Accuracy OSe Le Ge tDAC fDAC SNRR offset error linearity error gain error settling time conversion rate supply noise rejection ratio f = 100 Hz; VDDN = 0.1 × VPP no resistive load to 1⁄2 LSB full scale step Tamb = 25 °C − − − − − − − − − − − 40 50 ±1.5 1 90 11.1 − mV LSB % µs kHz dB output voltage output leakage current no resistive load RL = 10 kΩ AOUT disabled VSS VSS − − − − VDD 0.9 × VDD 250 V V nA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 13 A/D CHARACTERISTICS VDD = 5.0 V; VSS = 0 V; VREF = 5.0 V; VAGND = 0 V; RS = 10 kΩ; Tamb = −40 °C to +85 °C unless otherwise specified. SYMBOL Analog inputs VIA ILIA CIA CID VIS VID analog input voltage analog input leakage current analog input capacitance differential input capacitance single-ended voltage differential voltage measuring range measuring range; VFS = VREF − VAGND VSS − − − VAGND – V FS -----------2 − − − ∆Vi = 16 LSB − − f = 100 Hz; VDDN = 0.1 × VPP − − − − − 10 10 − − VDD 100 − − VREF +V FS ------------2 V nA pF pF V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Accuracy OSe Le Ge GSe CMRR SNRR tADC fADC offset error linearity error gain error small-signal gain error common-mode rejection ratio supply noise rejection ratio conversion time sampling/conversion rate Tamb = 25 °C − − − − 60 40 − − 20 ±1.5 1 5 − − 90 11.1 mV LSB % % dB dB µs kHz 1998 Jul 02 18 Philips Semiconductors Product specification 8-bit A/D and D/A converter PCF8591 (a) Internal oscillator; Tamb = +27 °C. (b) External oscillator. Fig.17 Operating supply current as a function of supply voltage (analog output disabled). (a) Output impedance near negative power rail; Tamb = +27 °C. The x-axis represents the hex input-code equivalent of the output voltage. (b) Output impedance near positive power rail; Tamb = +27 °C. Fig.18 Output impedance of analog output buffer (near power rails). 1998 Jul 02 19 Philips Semiconductors Product specification 8-bit A/D and D/A converter PCF8591 14 AC CHARACTERISTICS All timing values are valid within the operating supply voltage and ambient temperature range and reference to VIL and VIH with an input voltage swing of VSS to VDD. SYMBOL I2C-bus timing (see Fig.19; note 1) fSCL tSP tBUF tSU;STA tHD;STA tLOW tHIGH tr tf tSU;DAT tHD;DAT tVD;DAT tSU;STO Note 1. A detailed description of the I2C-bus specification, with applications, is given in brochure “The I2C-bus and how to use it”. This brochure may be ordered using the code 9398 393 40011. SCL clock frequency tolerable spike width on bus bus free time START condition set-up time START condition hold time SCL LOW time SCL HIGH time SCL and SDA rise time SCL and SDA fall time data set-up time data hold time SCL LOW-to-data out valid STOP condition set-up time − − 4.7 4.7 4.0 4.7 4.0 − − 250 0 − 4.0 − − − − − − − − − − − − − 100 100 − − − − − 1.0 0.3 − − 3.4 − kHz ns µs µs µs µs µs µs µs ns ns µs µs PARAMETER MIN. TYP. MAX. UNIT handbook, full pagewidth PROTOCOL START CONDITION (S) BIT 7 MSB (A7) BIT 6 (A6) BIT 0 LSB (R/W) ACKNOWLEDGE (A) STOP CONDITION (P) t SU;STA t LOW t HIGH 1 / f SCL SCL t BUF tr t f SDA t HD;STA t SU;DAT t HD;DAT t VD;DAT MBD820 t SU;STO Fig.19 I2C-bus timing diagram; rise and fall times refer to VIL and VIH. 1998 Jul 02 20 Philips Semiconductors Product specification 8-bit A/D and D/A converter 15 APPLICATION INFORMATION PCF8591 Inputs must be connected to VSS or VDD when not in use. Analog inputs may also be connected to AGND or VREF. In order to prevent excessive ground and supply noise and to minimize cross-talk of the digital to analog signal paths the user has to design the printed-circuit board layout very carefully. Supply lines common to a PCF8591 device and noisy digital circuits and ground loops should be avoided. Decoupling capacitors (>10 µF) are recommended for power supply and reference voltage inputs. Fig.20 Application diagram. 1998 Jul 02 21 Philips Semiconductors Product specification 8-bit A/D and D/A converter 16 PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body PCF8591 SOT38-1 D seating plane ME A2 A L A1 c Z e b1 b 16 9 MH wM (e 1) pin 1 index E 1 8 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 1998 Jul 02 22 Philips Semiconductors Product specification 8-bit A/D and D/A converter PCF8591 SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c y HE vMA Z 16 9 Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) θ A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) θ 0.9 0.4 0.035 0.016 0.012 0.096 0.004 0.089 0.019 0.013 0.014 0.009 0.419 0.043 0.055 0.394 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 1998 Jul 02 23 Philips Semiconductors Product specification 8-bit A/D and D/A converter 17 SOLDERING 17.1 Introduction PCF8591 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 17.3.2 WAVE SOLDERING There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (order code 9398 652 90011). 17.2 17.2.1 DIP SOLDERING BY DIPPING OR BY WAVE Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 17.3.3 REPAIRING SOLDERED JOINTS The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.2.2 REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 17.3 17.3.1 SO REFLOW SOLDERING Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1998 Jul 02 24 Philips Semiconductors Product specification 8-bit A/D and D/A converter 18 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values PCF8591 This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 19 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 20 PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1998 Jul 02 25 Philips Semiconductors Product specification 8-bit A/D and D/A converter NOTES PCF8591 1998 Jul 02 26 Philips Semiconductors Product specification 8-bit A/D and D/A converter NOTES PCF8591 1998 Jul 02 27 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Internet: http://www.semiconductors.philips.com For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 © Philips Electronics N.V. 1998 SCA60 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 415106/1200/04/pp28 Date of release: 1998 Jul 02 Document order number: 9397 750 04058