SE5532AF

INTEGRATED CIRCUITS NE/SA/SE5532/5532A Internally-compensated dual low noise operational amplifier Product specification IC11 Data Handbook 1997 Sept 29 Philips Semiconductors Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A DESCRIPTION The 5532 is a dual high-performance low noise operational amplifier. Compared to most of the standard operational amplifiers, such as the 1458, it shows better noise performance, improved output drive capability and considerably higher small-signal and power bandwidths. This makes the device especially suitable for application in high-quality and professional audio equipment, instrumentation and control circuits, and telephone channel amplifiers. The op amp is internally compensated for gains equal to one. If very low noise is of prime importance, it is recommended that the 5532A version be used because it has guaranteed noise voltage specifications. PIN CONFIGURATIONS FE, N, D8 Packages OUTPUT A INVERTING INPUT A NON-INVERTING INPUT A V1 2 3 4 A B 8 V+ 7 OUTPUT B 6 INVERTING INPUT B 5 NON-INVERTING INPUT B TOP VIEW D Package1 –INA +INA NC –VCC NC NC +INB –INB 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 NC NC NC OUTA +VCC OUTB NC NC FEATURES • Small-signal bandwidth: 10MHz • Output drive capability: 600Ω, 10VRMS • Input noise voltage: 5nV Hz (typical) • DC voltage gain: 50000 • AC voltage gain: 2200 at 10kHz • Power bandwidth: 140kHz • Slew rate: 9V/µs • Large supply voltage range: ±3 to ±20V • Compensated for unity gain ORDERING INFORMATION DESCRIPTION 8-Pin Plastic Dual In-Line Package (DIP) 8-Pin Plastic Dual In-Line Package (DIP) 8-Pin Plastic Dual In-Line Package (DIP) 8-Pin Ceramic Dual In-Line Package (CERDIP) 8-Pin Plastic Dual In-Line Package (DIP) 8-Pin Ceramic Dual In-Line Package (CERDIP) 8-Pin Ceramic Dual In-Line Package (CERDIP) 8-Pin Ceramic Dual In-Line Package (CERDIP) 8-Pin Small Outline Package (SO) 8-Pin Small Outline Package (SO) 8-Pin Small Outline Package (SO) 8-Pin Small Outline Package (SO) 8-Pin Small Outline Package (SO) 8-Pin Small Outline Package (SO) 8-Pin Small Outline Package (SO) 8-Pin Small Outline Package (SO) 16-Pin Plastic Small Outline Large (SOL) Package 16-Pin Plastic Dual In-Line Package (DIP) TOP VIEW NOTE: 1. SOL and non-standard pinout. SL00332 Figure 1. Pin Configurations TEMPERATURE RANGE 0 to 70°C –40°C to +85°C –40°C to +85°C 0 to 70°C 0 to 70°C 0 to 70°C -55°C to +125°C -55°C to +125°C 0 to 70°C –40°C to 85°C –40°C to 85°C -55°C to +125°C 0 to 70°C –40°C to 85°C –40°C to 85°C -55°C to +125°C 0 to 70°C -55°C to +125°C ORDER CODE NE5532N SA5532N SA5532AN NE5532FE NE5532AN NE5532AF SE5532FE SE5532AF NE5532AD8 SA5532D8 SA5532AD8 SE5532AD8 NE5532D8 SA5532D8 SA5532AD8 SE5532D8 NE5532D SE5532N DWG # SOT97-1 SOT97-1 SOT97-1 0580A SOT97-1 0580A 0580A 0580A SOT96-1 SOT96-1 SOT96-1 SOT96-1 SOT96-1 SOT96-1 SOT96-1 SOT96-1 SOT162-1 SOT38-4 1997 Sept 29 2 853-0949 16639 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A EQUIVALENT SCHEMATIC (EACH AMPLIFIER) + _ SL00333 Figure 2. Equivalent Schematic (Each Amplifier) ABSOLUTE MAXIMUM RATINGS SYMBOL VS VIN VDIFF TA Supply voltage Input voltage Differential input voltage1 Operating temperature range SA5532/A NE5532/A SE5532/A Storage temperature Junction temperature Maximum power dissipation, TA=25°C (still-air)2 8 D8 package 8 N package 8 FE package 16 D package Lead soldering temperature (10sec max) PARAMETER RATING ±22 ±VSUPPLY ±0.5 –40 to +85 0 to 70 -55 to +125 -65 to +150 150 UNIT V V V °C °C °C °C °C TSTG TJ PD 780 1200 1000 1200 300 mW mW mW mW °C TSOLD NOTES: 1. Diodes protect the inputs against over-voltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6V. Maximum current should be limited to ±10mA. 2. Thermal resistances of the above packages are as follows: N package at 100°C/W F package at 135°C/W D package at 105°C/W D8 package at 160°C/W 1997 Sept 29 3 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A DC ELECTRICAL CHARACTERISTICS TA=25°C VS=±15V, unless otherwise specified. 1, 2, 3 SYMBOL VOS ∆VOS/∆T IOS ∆IOS/∆T IB ∆IB/∆T ICC VCM CMRR PSRR Supply current Over temperature Common-mode input range Common-mode rejection ratio Power supply rejection ratio RL≥2kΩ, VO=±10V Over temperature RL≥600Ω, VO=±10V Over temperature RL≥600Ω Over temperature RL≥600Ω, VS=±18V Over temperature RL≥2kΩ Over temperature 50 25 40 20 ±12 ±10 ±15 ±12 ±13 ±12 30 10 ±12 80 ±13 100 10 100 50 ±13 ±12 ±16 ±14 ±13.5 ±12.5 300 38 60 50 25 15 15 10 ±12 ±10 ±15 ±12 ±13 ±10 30 10 13 ±12 70 ±13 100 10 100 50 ±13 ±12 ±16 ±14 ±13.5 ±12.5 300 38 60 100 mA V dB µV/V V/mV V/mV V/mV V/mV Input current Over temperature 5 8 10.5 Offset current Over temperature 200 200 400 700 PARAMETER Offset voltage Over temperature 5 100 200 TEST CONDITIONS CONDITIONS SE/5532/5532A Min Typ 0.5 Max 2 3 NE/SA/5532/5532A Min Typ 0.5 5 10 200 200 5 8 16 800 1000 150 200 Max 4 5 UNIT mV mV µV/°C nA nA pA/°C nA nA nA/°C mA AVOL Large-signal voltage gain Large-signal voltage gain VOUT Output swing swing V RIN ISC Input resistance Output short circuit current kΩ mA NOTES: 1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6V. Maximum current should be limited to ±10mA. 2. For operation at elevated temperature, derate packages based on the package thermal resistance. 3. Output may be shorted to ground at VS=±15V, TA=25°C Temperature and/or supply voltages must be limited to ensure dissipation rating is not exceeded. AC ELECTRICAL CHARACTERISTICS TA=25°C VS=±15V, unless otherwise specified. SYMBOL ROUT PARAMETER Output resistance TEST CONDITIONS CONDITIONS AV=30dB Closed-loop f=10kHz, RL=600Ω Voltage-follower VIN=100mVP-P CL=100pF, RL=600Ω f=10kHz CL=100pF, RL=600Ω VOUT=±10V VOUT=±14V, RL=600Ω, VCC=±18V NE/SA/SE5532/5532A Min Typ 0.3 Max UNIT Ω Overshoot AV GBW SR Gain Gain bandwidth product Slew rate Power bandwidth 10 2.2 10 9 140 100 % V/mV MHz V/µs kHz kHz 1997 Sept 29 4 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A ELECTRICAL CHARACTERISTICS TA=25°C VS=±15V, unless otherwise specified. SYMBOL VNOISE INOISE PARAMETER Input noise voltage Input noise current Channel separation TEST CONDITIONS CONDITIONS fO=30Hz fO=1kHz fO=30Hz fO=1kHz f=1kHz, RS=5kΩ NE/SE5532 Min Typ 8 5 2.7 0.7 110 Max NE/SA/SE5532A Min Typ 8 5 2.7 0.7 110 Max 12 6 UNIT nV/√Hz nV/√Hz pA/√Hz pA/√Hz dB TYPICAL PERFORMANCE CHARACTERISTICS Open-Loop Frequency Response 120 TYPICAL VALUES RF = 10kΩ; RE = 100Ω 80 GAIN (dB) GAIN (dB) 40 30 60 TYPICAL VALUES Closed-Loop Frequency Response 40 Large-Signal Frequency Response VS = +15V TYPICAL VALUES 40 20 RF = 9kΩ; RE = 1kΩ (V) Vo(p-p) 20 0 RF = 1kΩ; RE = ∞ 0 10 -40 10 102 103 104 105 106 107 f (Hz) -20 103 104 105 106 107 f (Hz) 108 0 102 103 104 105 106 107 f (Hz) Output Short-Circuit Current 80 VS = +15V 60 1,2 1,4 Input Bias Current 30 VS = +15V Input Commom-Mode Voltage Range TYPICAL VALUES 20 IO 40 (mA) TYP II (mA) 0,8 VIN (V) 10 20 0,4 0 -55 -25 0 0 25 50 TA (oC) 75 100 +125 -55 -25 0 25 50 75 100 +125 TA (oC) 0 0 10 Vp; -VN (V) 20 Supply Current 6 IO = 0 TYP 10 10–2 Input Noise Voltage Density 4 IP IN TYP 1 (nV 2 H z) (mA) 10–1 0 0 10 20 Vp; -VN (V) 10–2 10 102 103 104 f (Hz) SL00334 Figure 3. Typical Performance Characteristics 1997 Sept 29 5 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A TEST CIRCUITS + 5532 (1/2) RS 25Ω – VIN RF 1k – + V+ 5532 VOUT VI 100pF V– RE 100pF 800Ω 600Ω Voltage-Follower Closed-Loop Frequency Response SL00335 Figure 4. Test Circuits 1997 Sept 29 6 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 1997 Sept 29 7 0580A 1997 Sept 29 0.055 (1.40) 0.030 (0.76) Philips Semiconductors 853–0580A 006688 0.055 (1.40) 0.030 (0.76) NOTES: 1. Controlling dimension: Inches. Millimeters are shown in parentheses. –E– 0.303 (7.70) 0.245 (6.22) 2. Dimension and tolerancing per ANSI Y14. 5M-1982. 3. “T”, “D”, and “E” are reference datums on the body and include allowance for glass overrun and meniscus on the seal line, and lid to base mismatch. 4. These dimensions measured with the leads constrained to be perpendicular to plane T. 5. Pin numbers start with Pin #1 and continue counterclockwise to Pin #8 when viewed from the top. PIN # 1 0.100 (2.54) BSC 0.408 (10.36) 0.376 (9.55) –D– Internally-compensated dual low noise operational amplifier 8-PIN (300 mils wide) CERAMIC DUAL IN-LINE (F) PACKAGE 8 0.200 (5.08) 0.165 (4.19) 0.175 (4.45) 0.145 (3.68) 0.165 (4.19) 0.125 (3.18) 0.035 (0.89) 0.020 (0.51) 0.023 (0.58) 0.015 (0.38) T ED 0.010 (0.254) 0.015 (0.38) 0.010 (0.25) 0.070 (1.78) 0.050 (1.27) 0.320 (8.13) 0.290 (7.37) (NOTE 4) –T– SEATING PLANE BSC 0.300 (7.62) (NOTE 4) NE/SA/SE5532/5532A 0.395 (10.03) 0.300 (7.62) Product specification Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A SO8: plastic small outline package; 8 leads; body width 3.9mm SOT96-1 1997 Sept 29 9 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 1997 Sept 29 10 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 1997 Sept 29 11 Philips Semiconductors Product specification Internally-compensated dual low noise operational amplifier NE/SA/SE5532/5532A DEFINITIONS Data Sheet Identification Objective Specification Product Status Formative or in Design Definition This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Preliminary Specification Preproduction Product Product Specification Full Production Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 © Copyright Philips Electronics North America Corporation 1997 All rights reserved. Printed in U.S.A. print code Document order number: Date of release: 04–96 9397 750 01699 Philips Semiconductors 1997 Sept 29 12