SSL2101
Dimmable GreenChip driver for LED lighting
Rev. 4.1 — 5 December 2011 Product data sheet
1. General description
The SSL2101 is a Switched Mode Power Supply (SMPS) driver IC that operates in combination with a phase cut dimmer directly from the rectified mains. It is designed to drive LED devices. The device includes a high-voltage power switch, a circuit to allow start-up directly from the rectified mains voltage and a high-voltage circuitry to supply the phase cut dimmer. For dimmer applications, an integrated dedicated circuitry optimizes the dimming curve.
• SSL2101: fully integrated LED driver for lamps up to 10 W • SSL2102: fully integrated LED driver for lamps up to 25 W • SSL2103: gives the application designer flexibility to:
– Use an external power switch to allow the IC to provide any power – Use external bleeder transistors to provide extended dimmer interoperability
2. Features and benefits
Easy migration to existing lighting control infrastructure Supports most available dimming solutions Optimized efficiency with valley switching managed by a built-in circuitry Demagnetization detection OverTemperature Protection (OTP) Short-Winding Protection (SWP) and OverCurrent Protection (OCP) Internal VCC generation allowing start-up from the rectified mains voltage Natural dimming curve by logarithmic correction, down to 1 % Limited external components required because of the high integration level Thermal enhanced SO16 wide body package Suitable for flyback and buck applications
3. Applications
SSL applications below 15 W Retro-fit lamps (for example, GU10, E27) LED modules such as LED spots, down-lights LED strings suitable for retail displays, etc.
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SSL2101
Dimmable Greenchip driver for LED lighting
4. Quick reference data
Table 1: RDSon Quick reference data Conditions power switch; ISOURCE = 0.50 A Tj = 25 C Isource = 0.20 A Tj = 125 C VCC fosc IDRAIN supply voltage oscillator frequency current on pin DRAIN VDRAIN > 60 V; no auxiliary supply VDRAIN > 60 V; with auxiliary supply VDRAIN min max Tamb voltage on pin DRAIN minimum duty factor maximum duty cycle ambient temperature f = 100 kHz 8.5 10 40 40 9.5 100 30 0 75 10 40 200 2.2 125 600 V kHz mA A V % % 4.5 6.5 7.5 Min Typ Max Unit drain-source on-state resistance Symbol Parameter
+100 C
5. Ordering information
Table 2: Ordering information Package Name SSL2101T SO16 Description plastic small outline package; 16 leads; body width 3.9 mm Version SOT109-1 Type number
SSL2101
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6. Block diagram
ISENSE SBLEED WBLEED
10
1
2
BLEEDER VCC 3 SUPPLY VALLEY 16 DRAIN
11 4, 5,13, 14, 15 LOGIC
100 mV
AUX
GND
Stop RC 8 OSCILLATOR 12 Low freq THERMAL SHUTDOWN POWER - UP RESET PROTECTION LOGIC Blank SOURCE
BRIGHTNESS RC2
6 7 FREQUENCY REDUCTION CIRCUIT
0.5 V
Overcurrent PWMLIMIT 9 PWM LIMIT CIRCUIT Short-winding protection
1.5 V
014aaa567
Fig 1.
Block diagram
SSL2101
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7. Pinning information
7.1 Pinning
SBLEED WBLEED VCC GND GND BRIGHTNESS RC2 RC
1 2 3 4
16 DRAIN 15 GND 14 GND 13 GND
SSL2101
5 6 7 8
014aaa568
12 SOURCE 11 AUX 10 ISENSE 9 PWMLIMIT
Fig 2.
Pin configuration SO16
7.2 Pin description
Table 3: Symbol SBLEED WBLEED VCC GND GND BRIGHTNESS RC2 RC PWMLIMIT ISENSE AUX SOURCE GND GND GND DRAIN Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Description drain of internal strong bleeder switch drain of internal weak bleeder switch supply voltage ground ground brightness input setting for frequency reduction frequency setting PWM limit input current sense input for WBLEED Input for voltage from auxiliary winding for timing (demagnetization) source of internal power switch ground ground ground drain of internal power switch; input for start-up current and valley sensing
SSL2101
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8. Functional description
The SSL2101 is an LED driver IC that operates directly from the rectified mains. The SSL2101 uses on-time mode control and frequency control to control the LED brightness. The BRIGHTNESS and PWMLIMIT input of the IC can be used to control the LED light output in combination with an external dimmer. The PWMLIMIT input can also be used for Thermal Lumen Management (TLM) and for precision LED current control.
8.1 Start-up and UnderVoltage LockOut (UVLO)
Initially, the IC is self-supplying from the rectified mains voltage. The IC starts switching as soon as the voltage on pin VCC passes the VCC(startup) level. The supply can be taken over by the auxiliary winding of the transformer as soon as VCC is high enough and the supply from the line is stopped for high efficiency operation. Alternatively the IC can be supplied via a bleeder resistor connected to a high voltage. Note however the maximum VCC voltage rating of the IC. If for some reason the auxiliary supply is not sufficient, the high-voltage supply can also supply the IC. As soon as the voltage on pin VCC drops below the VCC(UVLO) level, the IC stops switching and will restart from the rectified mains voltage, if the internal current delivered is sufficient.
8.2 Oscillator
An internal oscillator inside the IC provides the timing for the switching converter logic. The frequency of the oscillator is set by the external resistors and the capacitor on pin RC and pin RC2. The external capacitor is charged rapidly to the VRC(max) level and, starting from a new primary stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost equal to the sensitivity at high duty factors. This results in a more constant gain over the duty factor range compared to Phase Width Modulated (PWM) systems with a linear sawtooth oscillator. Stable operation at low duty factors is easily realized. The frequency of the converter when VBRIGHTNESS is high can be estimated using Equation 1: 1 1 RC = ------ ------- – t ch arg e 3.5 f osc (1)
R equals the parallel resistance of both oscillator resistors. C is the capacitor connected at the RC pin (pin 8). The BRIGHTNESS input controls the frequency reduction mode. Figure 3 shows that the oscillator switches over from an RC curve with R1 in parallel with R2 to R1 only. A low BRIGHTNESS voltage will reduce the switching frequency.
SSL2101
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SSL2101
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5V 24 μA
STARplug OSCILLATOR
RC
BRIGHTNESS Comparator
R2 10 kΩ C1 330 pF
R1 220 kΩ
V
V
RC2 rc_threshold
014aaa574
Fig 3.
Brightness control block
A typical RC waveform is given in Figure 4. The RC switch-over threshold is controlled by the BRIGHTNESS pin. To ensure that the capacitor can be charged within the charge time, the value of the oscillator capacitor should be limited to 1 nF. Due to leakage current, the value of the resistor connected between the RC pin and the ground should be limited to a maximum of 220 k.
Voltage (mV) RC voltage
rc_threshhold 75 mV time
014aaa582
Fig 4.
Brightness timing waveform
8.3 Duty factor control
The duty factor is controlled by an internally regulated voltage and the oscillator signal on pin RC. The internal regulation voltage is set by the voltage on the PWMLIMIT pin. A low PWMLIMIT voltage will results in a low on-time for the internal power switch. The minimum duty factor of the switched mode power supply can be set to 0 %. The maximum duty factor is set to 75 %.
SSL2101
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8.4 Bleeder for dimming applications
The SSL2101 IC contains some circuitry intended for mains dimmer compatibility. This circuit contains two current sinks that are called bleeders. A strong bleeder is used for zero-cross reset of the dimmer and triac latching. A weak bleeder is added to maintain the hold current through the dimmer. The strong bleeder switch is switched on when the maximum voltage on pin WBLEED and SBLEED is below the Vth(SBLEED) level (52 V typically). The weak bleeder switch is switched on as soon as the voltage on pin ISENSE exceeds the Vth(high)(ISENSE) level (100 mV typically). The weak bleeder switch is switched off when the ISENSE voltage drops below the Vth(low)(ISENSE) level (250 mV typically). The weak bleeder switch is also switched off when the strong bleeder switch is switched on. See Figure 5.
WBLEED
D2 I1 20 μA D3
SBLEED
Integrated
B1
M2
LOW V DETECT Q SR
M1
−0.1 V −0.25 V
OR
ISENSE
GND
014aaa571
Fig 5.
Bleeder circuit
8.5 Valley switching
A new cycle is started when the primary switch is switched on (see Figure 6). After a time determined by the oscillator voltage, RC and the internal regulation level, the switch is turned off and the secondary stroke starts. The internal regulation level is determined by the voltage on pin PWMLIMIT. After the secondary stroke, the drain voltage shows an oscillation with a frequency of approximately: 1 --------------------------------------------2 Lp Cp where: Lp = primary self inductance Cp = parasitic capacitance on drain node (2)
SSL2101
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As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for a low drain voltage before starting a new primary stroke. Figure 6 shows the drain voltage together with the valley signal, the signal indicating the secondary stroke and the RC voltage. The primary stroke starts some time before the actual valley at low ringing frequencies, and some time after the actual valley at high ringing frequencies.
primary stroke
secondary stroke
secondary ringing
drain
valley
secondary stroke
A
RC oscillator
regulation level
B
014aaa572
A: Start of new cycle with valley switching. B: Start of new cycle in a classical PWM system.
Fig 6.
Signals for valley switching, flyback configuration
Figure 7 shows a typical curve for a reflected output voltage N at an output voltage of 80 V. This voltage is the output voltage transferred to the primary side of the transformer with the factor N (determined by the turns ratio of the transformer). It shows that the system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is started at 33 before the valley. The switch-on losses are still reduced significantly.
SSL2101
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40 phase (°) 20
014aaa573
0
−20
−40
0
200
400
600 f (kHz)
800
Fig 7.
Typical phase of drain ringing at switch-on (at N Vo = 80 V)
8.6 Demagnetization
The system operates in discontinuous conduction mode if the AUX pin is connected. As long as the secondary stroke has not ended, the oscillator will not start a new primary stroke. During the first tsup(xfmr_ring) seconds, demagnetization recognition is suppressed. This suppression may be necessary in applications where the transformer has a large leakage inductance and at low output voltages.
8.7 Overcurrent protection
The cycle-by-cycle peak drain current limit circuit uses the external source resistor RSENSE to measure the current. The circuit is activated after the leading edge blanking time tleb. The protection circuit limits the source voltage over the RSENSE1 resistor to Vth(ocp)SOURCE, and thus limits the primary peak current.
8.8 Short-winding protection
The short-winding protection circuit is also activated after the leading edge blanking time. If the source voltage exceeds the short-winding protection threshold voltage Vth(swp)SOURCE, the IC stops switching. Only a power-on reset will restart normal operation. The short-winding protection also protects in case of a secondary diode short circuit.
8.9 Overtemperature protection
Accurate temperature protection is provided in the device. When the junction temperature exceeds the thermal shut-down temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The IC continues normal operation as soon as the overtemperature situation has disappeared.
1.
RSENSE is the resistor between the SOURCE pin and GND
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9. Limiting values
Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins VCC and RC cannot be current driven. Pins ISENSE and AUX cannot be voltage driven. Symbol Voltages VCC VRC VRC2 VPWMLIMIT VSOURCE VDRAIN supply voltage voltage on pin RC voltage on pin RC2 voltage on pin PWMLIMIT voltage on pin SOURCE voltage on pin DRAIN DMOS power transistor; Tamb = 25 C off-state; Tj = 125 C on-state; VVCC > 8.5 V; Tj < 125 C VWBLEED voltage on pin WBLEED off-state; Tj < 125 C on-state; VVCC > 8.5 V; Tj < 125 C Currents IISENSE IAUX ISOURCE IDRAIN General Ptot Tstg Tamb Tj total power dissipation storage temperature ambient temperature junction temperature Tamb = 70 C 55 40 40 1 +150 +100 +150 W C C C current on pin ISENSE current on pin AUX current on pin SOURCE current on pin DRAIN 20 10 2 2 +5 +5 +2 +2 mA mA A A continuous 0.4 0.4 0.4 0.4 0.4 0.4 0.4 +40 +3 +3 +5 +5 +5 +600 V V V V V V V Parameter Conditions Min Max Unit
VBRIGHTNESS voltage on pin BRIGHTNESS
VSBLEED
voltage on pin SBLEED
0.4 0.4
+600 +16
V V
0.4 0.4
+600 +12
V V
SSL2101
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Table 4: Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins VCC and RC cannot be current driven. Pins ISENSE and AUX cannot be voltage driven. Symbol VESD Parameter electrostatic discharge voltage Conditions human body model; Pins 16, 1, 2 All other pins machine model charged device model
[1] [2] [3]
[2] [3] [1]
Min
Max
Unit
1000 2000 200 500
+1000 +2000 +200 +500
V V V V
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 series resistor. Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each pin down to 0 V over a 1 resistor.
10. Thermal characteristics
The heat sink in the application with the SSL2101 is made with the copper on the Printed-Circuit Board (PCB). The SSL2101 uses thermal leads (pins 4, 5, 13, 14 and 15) for heat transfer from die to PCB. Enhanced thermal lead connection may drastically reduce thermal resistance. The following equation shows the relationship between the maximum allowable power dissipation P and the thermal resistance from junction to ambient. R th j – a = T j max – T amb P Where: Rth(j-a) = thermal resistance from junction to ambient Tj(max) = maximum junction temperature Tamb = ambient temperature P = power dissipation The thermal resistance as a function of the PCB area (Board: 0.8 mm thickness, 2 layers, Bottom Cu coverage 90 %, Cu thickness 70 m (390 W/mK), Core material conductivity: 0.5 W/mK, 10 vias dia 0.3 mm) is shown in Figure 8
SSL2101
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Dimmable Greenchip driver for LED lighting
120 Rth(j-a) (°C/W) 100
014aaa811
80
60
(1)
40
(2)
(3)
20 0 2000 4000 6000 8000 10000 PCB area (mm2)
(1) Top Cu coverage 20 % (2) Top Cu coverage 50 % (3) Top Cu coverage 100 %
Fig 8. Table 5: Symbol Rth(j-a)
[1]
SSL2101 core material conductivity Thermal characteristics Parameter thermal resistance from junction to ambient Conditions
[1]
Typ 90
Unit KW
Measured on a JEDEC test board (standard EIA/JESD 51-3) in free air with natural convection.
11. Characteristics
Table 6: Characteristics Tamb = 25 C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless otherwise specified. Typical frequency 100 kHz. Symbol Supply ICC supply current normal operation; VDRAIN = 60 V; VCC = 20 V VDRAIN > 60 V; VCC = 0 V 1.7 2 mA Parameter Conditions Min Typ Max Unit
ICC(ch) VCC VCC(startup) VCC(UVLO)
charge supply current supply voltage start-up supply voltage undervoltage lockout supply voltage
-6 8.5 9.75
4.5 10.25 8.2
40 10.75 8.5
mA V V V
L
7.9
SSL2101
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Table 6: Characteristics …continued Tamb = 25 C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless otherwise specified. Typical frequency 100 kHz. Symbol IDRAIN Parameter current on pin DRAIN Conditions VDRAIN > 60 V; no auxiliary supply VDRAIN > 60 V; with auxiliary supply VDRAIN voltage on pin DRAIN minimum duty factor maximum duty cycle demagnetization detection voltage transformer ringing suppression time minimum voltage on pin RC maximum voltage on pin RC charge time on pin RC voltage on pin BRIGHTNESS 2.5 V RC2 trip level 180 mV RC2 trip level 75 mV RC2 trip level fosc IBRIGHTNESS Bleeder Vth(SBLEED) Vth(low)ISENSE threshold voltage on pin SBLEED low threshold voltage on pin ISENSE high threshold voltage on pin ISENSE drain-source on-state resistance on pin SBLEED ISBLEED = 25 mA Tj = 25 C Tj = 125 C 140 220 170 270 200 320 46 52 250 56 V mV oscillator frequency current on pin BRIGHTNESS VBRIGHTNESS = 0 V at start of secondary stroke f = 100 kHz Min 40 Typ 30 Max 2.2 125 600 Unit mA A V
Pulse width modulator min max SOPS Vdet(demag) tsup(xfmr_ring) 50 1.0 100 1.5 150 2.0 mV s 0 75 % %
RC oscillator VRC(min) VRC(max) tch(RC) VBRIGHTNESS 60 2.4 10 20 75 2.5 1 0.5 1.25 2.3 100 24 90 2.6 200 28 mV V s V V V kHz A
Vth(high)ISENSE
-
100
-
mV
RDSon(SBLEED)
SSL2101
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Table 6: Characteristics …continued Tamb = 25 C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless otherwise specified. Typical frequency 100 kHz. Symbol RDSon(WBLEED) Parameter drain-source on-state resistance on pin WBLEED current on pin PWMLIMIT voltage on pin PWMLIMIT maximum duty cycle = 3V minimum duty factor threshold Valley switching (V/t)vrec valley recognition voltage change with time ringing frequency valley recognition to switch-on delay time overcurrent protection threshold voltage on pin SOURCE short-winding protection threshold voltage on pin SOURCE delay time from overcurrent protection to switch-off leading edge blanking time leakage current on VDRAIN = 600 V pin DRAIN breakdown voltage on pin DRAIN drain-source on-state resistance Tamb = 25 C dV/dt = 0.1 V/s minimum absolute value N VO = 100 V
[1]
Conditions IWBLEED = 10 mA Tj = 25 C Tj = 125 C
Min 250 400 25 -
Typ 310 500
Max 350 600 18 -
Unit A V V
Duty factor regulator: pin PWMLIMIT IPWMLIMIT VPWMLIMIT 3 0.45
-
100
-
V/s
fring td(vrec-swon)
200 -
550 150
800 -
kHz ns
Current and short circuit winding protection Vth(ocp)SOURCE 0.47 0.50 0.53 V
Vth(swp)SOURCE
dV/dt = 0.1 V/s
-
1.5
-
V
td(ocp-swoff)
dV/dt = 0.5 V/s
-
160
185
ns
tleb
250
350
450
ns
FET output stage IL(DRAIN) VBR(DRAIN) 600 125 A V
RDSon
power switch; ISOURCE = 0.50 A Tj = 25 C ISOURCE = 0.20 A Tj = 125 C 9.5 10 4.50 6.5 7.5
SSL2101
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Table 6: Characteristics …continued Tamb = 25 C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC and PWMLIMIT and BRIGHTNESS pins are disconnected unless otherwise specified. Typical frequency 100 kHz. Symbol tf(DRAIN) Parameter fall time on pin DRAIN Conditions input voltage: 300 V; no external capacitor at drain junction temperature junction temperature Min Typ 75 Max Unit ns
Temperature protection Totp Totp(hys) overtemperature protection trip overtemperature protection trip hysteresis 150 160 2 170 C C
[1]
Voltage change in time for valley recognition.
100 fmax 80
60 fosc (kHz) 40
20 fmin 0 0 1 2 VBRIGHTNESS (V)
014aaa664
3
Fig 9.
Typical frequency as a function of voltage on pin BRIGHTNESS
SSL2101
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12 ton (μs)
8
4
0 0 1 2 VPWMLIMIT (V) 3
014aaa665
VBRIGHTNESS = 3 V
Fig 10. Turn-on time as a function of voltage on pin PWMLIMIT
120 ton (μs)
80
40
0 0 1 2 VPWMLIMIT (V) 3
014aaa666
VBRIGHTNESS = 1 V
Fig 11. Turn-on time as a function of voltage on pin PWMLIMIT
SSL2101
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12. Application information
MAINS
VCC VCC WBLEED VCC GND RC RC2 BRIGHTNESS PWMLIMIT SBLEED DRAIN SRC TLM VCC
SSL2101 AUX
ISENSE
Dim range
014aaa569
Fig 12. Buck configuration for SSL2101
SSL2101
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Mains
WBLEED VCC GND RC RC2 BRIGHTNESS PWMLIMIT
SBLEED DRAIN SRC
SSL2101 AUX
ISENSE
Precision current
014aaa570
Fig 13. Flyback configuration for SSL2101
Further application information can be found in the SSL2101 application notes.
SSL2101
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13. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D
E
A X
c y HE vMA
Z
16 9
Q A2 A1 pin 1 index θ Lp
1 8
(A 3)
A
L wM detail X
e
bp
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 θ 8o o 0
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
0.028 0.004 0.012
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 14. Package outline SOT109-1 (SO16)
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14. Revision history
Table 7: Revision history Release date 20111205 Data sheet status Product data sheet Change notice Supersedes SSL2101 v.4 Document ID SSL2101 v.4.1 Modifications:
• • • •
GreenChip trademark has been added. Section 1 “General description” has been updated. Section 2 “Features and benefits” has been updated. Section 3 “Applications” has been updated. Product data sheet Product data sheet Preliminary data sheet Preliminary data sheet SSL2101 v.3 SSL2101 v.2 SSL2101 v.1 -
SSL2101 v.4 SSL2101 v.3 SSL2101 v.2 SSL2101 v.1
20090828 20090525 20090511 20090109
SSL2101
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15. Legal information
15.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.
© NXP B.V. 2011. All rights reserved.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
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All information provided in this document is subject to legal disclaimers.
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Dimmable Greenchip driver for LED lighting
whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b)
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. GreenChip — is a trademark of NXP B.V.
16. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
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All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 4.1 — 5 December 2011
22 of 23
NXP Semiconductors
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Dimmable Greenchip driver for LED lighting
17. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Start-up and UnderVoltage LockOut (UVLO) . . 5 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Duty factor control . . . . . . . . . . . . . . . . . . . . . . 6 Bleeder for dimming applications . . . . . . . . . . . 7 Valley switching . . . . . . . . . . . . . . . . . . . . . . . . 7 Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 9 Overcurrent protection . . . . . . . . . . . . . . . . . . . 9 Short-winding protection . . . . . . . . . . . . . . . . . . 9 Overtemperature protection . . . . . . . . . . . . . . . 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10 Thermal characteristics . . . . . . . . . . . . . . . . . 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application information. . . . . . . . . . . . . . . . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Contact information. . . . . . . . . . . . . . . . . . . . . 22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 December 2011 Document identifier: SSL2101