INTEGRATED CIRCUITS
DATA SHEET
TZA3019 2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
Preliminary specification File under Integrated Circuits, IC19 2000 Apr 10
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
FEATURES • Dual postamplifier • Single 3.3 V power supply • Wideband operation from 50 kHz to 2.5 GHz (typical value) • Fully differential • Channels are delay matched • On-chip DC-offset compensations without external capacitor • Interfacing with positive or negative supplied logic • Switching possibility between channels • Positive Emitter Coupled Logic (PECL) or Current-Mode Logic (CML) compatible data outputs adjustable from 200 to 800 mV (p-p) single-ended • Power-down capability for unused outputs and detectors • Rise and fall times 80 ps (typical value) • Possibility to invert the output of each channel separately • Input level-detection circuits for Received Signal Strength Indicator (RSSI) or Loss Of Signal (LOS) detection, programmable from 0.4 to 400 mV (p-p) single-ended, with open-drain comparator output for direct interfacing with positive or negative logic • Reference voltage for output level and LOS adjustment • Automatic strongest input signal switch possibility (TZA3019 version B) • HTQFP32 or HBCC32 plastic package with exposed pad. APPLICATIONS
TZA3019
• Postamplifier for Synchronous Digital Hierarchy and Synchronous Optical Network (SDH/SONET) transponder • SDH/SONET wavelength converter • Crosspoint or channel switch • PECL driver • Fibre channel arbitrated loop • Protection ring • Monitoring • Signal level detectors • Swing converter CML 200 mV (p-p) to PECL 800 mV (p-p) • Port bypass circuit • 2.5 GHz clock amplification. GENERAL DESCRIPTION The TZA3019 is a low gain postamplifier multiplexer with a dual RSSI and/or LOS detector that is designed for use in critical signal path control applications, such as loop-through, redundant channel switching or Wavelength Division Multiplexing (WDM). The signal path is unregistered, so no clock is required for the data inputs. The signal path is fully differential and delay matched. It is capable of operating from 50 kHz to 2.5 GHz. The TZA3019 HTQFP32 and HBCC32 packages can be delivered in three versions: • TZA3019AHT and TZA3019AV with two RSSI signals • TZA3019BHT and TZA3019BV with one RSSI and one LOS signal • TZA3019CHT and TZA3019CV with two LOS signals.
ORDERING INFORMATION TYPE NUMBER TZA3019AHT TZA3019BHT TZA3019CHT TZA3019AV TZA3019BV TZA3019CV TZA3019U PACKAGE NAME HTQFP32 HTQFP32 HTQFP32 HBCC32 HBCC32 HBCC32 − DESCRIPTION plastic, heatsink thin quad flat package; 32 leads; body 5 × 5 × 1 mm plastic, heatsink thin quad flat package; 32 leads; body 5 × 5 × 1 mm plastic, heatsink thin quad flat package; 32 leads; body 5 × 5 × 1 mm plastic, heatsink bottom chip carrier; 32 terminals; body 5 × 5 × 0.65 mm plastic, heatsink bottom chip carrier; 32 terminals; body 5 × 5 × 0.65 mm plastic, heatsink bottom chip carrier; 32 terminals; body 5 × 5 × 0.65 mm bare die; 2.22 × 2.22 × 0.28 mm VERSION SOT547-2 SOT547-2 SOT547-2 SOT560-1 SOT560-1 SOT560-1 −
2000 Apr 10
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Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
BLOCK DIAGRAM
TZA3019
handbook, full pagewidth
VEE1A LOSTH1
32 10
25
VEE1B
LOS DETECTOR
1× offset
27
RSSI1
LEVEL1 INV1 S1 GND1A IN1 IN1Q GND1A
12 29 31 1 2 3 4
TZA3019AHT TZA3019AV
level
24 SWITCH 23 22 A1A A1B 21
GND1B OUT1 OUT1Q GND1B
TEST
15
DFT
BAND GAP REFERENCE
14
Vref
GND2A IN2Q IN2 GND2A S2 INV2 LEVEL2
8 7 6 5 30 28 13 level SWITCH A2A A2B
17 18 19 20
GND2B OUT2Q OUT2 GND2B
offset LOS DETECTOR 11 9 1×
26
RSSI2
LOSTH2 VEE2A
16
VEE2B
MGT028
Fig.1 Block diagram (TZA3019AHT and TZA3019AV).
2000 Apr 10
3
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
TZA3019
handbook, full pagewidth
VEE1A LOSTH1
32 10
25
VEE1B
LOS DETECTOR offset 12 29 31 1 2 3 4 A1A A1B
5 kΩ
27
LOS1
TZA3019BHT TZA3019BV
level
LEVEL1 INV1 S1 GND1A IN1 IN1Q GND1A
24 SWITCH 23 22 21
GND1B OUT1 OUT1Q GND1B
TEST
15
DFT
BAND GAP REFERENCE
14
Vref
GND2A IN2Q IN2 GND2A S2 INV2 LEVEL2
8 7 6 5 30 28 13 level SWITCH A2A A2B
17 18 19 20
GND2B OUT2Q OUT2 GND2B
offset LOS DETECTOR 11 9 1×
26
RSSI2
LOSTH2 VEE2A
16
VEE2B
MGT027
Fig.2 Block diagram (TZA3019BHT and TZA3019AV).
2000 Apr 10
4
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
TZA3019
handbook, full pagewidth
VEE1A LOSTH1
32 10
25
VEE1B
LOS DETECTOR offset 12 29 31 1 2 3 4 A1A A1B
5 kΩ
27
LOS1
TZA3019CHT TZA3019CV
level
LEVEL1 INV1 S1 GND1A IN1 IN1Q GND1A
24 SWITCH 23 22 21
GND1B OUT1 OUT1Q GND1B
TEST
15
DFT
BAND GAP REFERENCE
14
Vref
GND2A IN2Q IN2 GND2A S2 INV2 LEVEL2
8 7 6 5 30 28 13 level SWITCH A2A A2B
17 18 19 20
GND2B OUT2Q OUT2 GND2B
LOS DETECTOR
offset
5 kΩ
26
LOS2
LOSTH2 VEE2A
11 9 16
VEE2B
MGS553
Fig.3 Block diagram (TZA3019CHT and TZA3019CV).
2000 Apr 10
5
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
PINNING PIN SYMBOL TZA3019xHT/xV(1) A GND1A IN1 IN1Q GND1A n.c n.c GND2A IN2 IN2Q GND2A VEE2A LOSTH1 1 2 3 4 − − 5 6 7 8 9 10 B 1 2 3 4 − − 5 6 7 8 9 10 C 1 2 3 4 − − 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 11 12 S I I S − − S I I S S I ground for input 1 and LOS1 circuits PAD TYPE(2) DESCRIPTION
TZA3019
differential circuit 1 input; complimentary to pin IN1Q; DC bias level is set internally at approximately −0.33 V differential circuit 1 input; complimentary to pin IN1; DC bias level is set internally at approximately −0.33 V ground for input 1 and LOS1 circuits not connected not connected ground for input 2 and LOS2 circuits differential circuit 2 input; complimentary to pin IN2Q; DC bias level is set internally at approximately −0.33 V differential circuit 2 input; complimentary to pin IN2; DC bias level is set internally at approximately −0.33 V ground for input 2 and LOS2 circuits negative supply voltage for input 2 and LOS2 circuits Input for level detector programming of input 1 circuit; threshold level is set by connecting external resistors between pins GND1A and Vref. When forced to VEE2A or not connected, the LOS1 circuit will be switched off. Input for level detector programming of input 2 circuit; threshold level is set by connecting external resistors between pins GND2A and Vref. When forced to VEE2A or not connected, the LOS2 circuit will be switched off. not connected Input for programming output level of output 1 circuit; output level is set by connecting external resistors between pins GND1A and Vref. When forced to GND1A or not connected, pins OUT1 and OUT1Q will be switched off. Input for programming output level of output 2 circuit; output level is set by connecting external resistors between pins GND2A and Vref. When forced to GND2A or not connected, pins OUT2 and OUT2Q will be switched off. reference voltage for level circuit and LOS threshold programming; typical value is −1.6 V; no external capacitor allowed for test purposes only; to be left open-circuit in the application negative supply voltage for output 2 circuit ground for output 2 circuit PECL or CML compatible differential circuit 2 output; complimentary to pin OUT2
LOSTH2
11
11
11
13
I
n.c LEVEL1
− 12
− 12
− 12
14 15
− I
LEVEL2
13
13
13
16
I
Vref n.c TEST VEE2B GND2B OUT2Q
14 − 15 16 17 18
14 − 15 16 17 18
14 − 15 16 17 18
17 18 19 20 21 22
O − I S S O
2000 Apr 10
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Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
PIN SYMBOL TZA3019xHT/xV(1) A OUT2 GND2B n.c n.c GND1B OUT1Q OUT1 GND1B VEE1B RSSI2 LOS2 RSSI1 LOS1 INV2 INV1 S2 S1 VEE1A VEEP Notes 1. The ‘x’ in TZA3019xHT/xV represents versions A, B and C. 19 20 − − 21 22 23 24 25 26 − 27 − 28 29 30 31 32 pad B 19 20 − − 21 22 23 24 25 26 − − 27 28 29 30 31 32 pad C 19 20 − − 21 22 23 24 25 − 26 − 27 28 29 30 31 32 pad 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 − O S − − S O O S S O PAD TYPE(2) DESCRIPTION
TZA3019
PECL or CML compatible differential circuit 2 output; complimentary to pin OUT2Q ground for output 2 circuit not connected not connected ground for output 1 circuit PECL or CML compatible differential circuit 1 output; complimentary to pin OUT1 PECL or CML compatible differential circuit 1 output; complimentary to pin OUT1Q ground for output 1 circuit negative supply voltage for output 1 circuit output of received signal strength indicator of detector
O-DRN output loss of signal detector 2; detection of input 2 signal; direct drive of positive or negative supplied logic via internal 5 kΩ resistor O output of received signal strength indicator of detector O-DRN output loss of signal detector 2; detection of input 2 signal; direct drive of positive or negative supplied logic via internal 5 kΩ resistor TTL TTL TTL TTL S S input to invert the signal of pins OUT2 and OUT2Q; directly positive (inverted) or negative supplied logic driven input to invert the signal of pins OUT1 and OUT1Q; directly of positive (inverted) or negative supplied logic driven input selector output 2 circuit; directly positive (inverted) or negative supplied logic driven input selector output 1 circuit; directly positive (inverted) or negative supplied logic driven negative supply voltage for input 1 and LOS1 circuits negative supply voltage pad (exposed die pad)
2. Pin type abbreviations: O = output, I = input, S = power supply, TTL = logic input and O-DRN = open-drain output.
2000 Apr 10
7
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
TZA3019
handbook, full pagewidth
26 RSSI2/LOS2
27 RSSI1/LOS1
32 VEE1A
GND1A IN1 IN1Q GND1A GND2A IN2 IN2Q GND2A
1 2 3 4 exposed pad
25 VEE1B
29 INV1
28 INV2
31 S1
30 S2
24 GND1B 23 OUT1 22 OUT1Q 21 GND1B
TZA3019xHT
5 6 7 8 VEEP 20 GND2B 19 OUT2 18 OUT2Q 17 GND2B
LOSTH2 11
LOSTH1 10
LEVEL1 12
LEVEL2 13
Vref 14
TEST 15
VEE2B 16
VEE2A 9
MGS554
Fig.4 Pin configuration HTQFP32.
RSSI1/LOS1
handbook, full pagewidth
RSSI2/LOS2 26
VEE1A
INV1
GND1A IN1 IN1Q GND1A GND2A IN2 IN2Q GND2A
1 2 3 4 5 6 7 8 9 VEE2A
32
31
30
29
28
INV2
27
25 24 23 22 GND1B OUT1 OUT1Q GND1B GND2B OUT2 OUT2Q GND2B
exposed pad
TZA3019xV
21 20 19 VEEP 18 17
10 LOSTH1
11 LOSTH2
12 LEVEL1
13 LEVEL2
14 Vref
15 TEST
16 VEE2B
VEE1B
MGT029
S1
Fig.5 Pin configuration HBCC32.
2000 Apr 10
S2
8
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
FUNCTIONAL DESCRIPTION The TZA3019 is a dual postamplifier with multiplexer and loss of signal detection see Figs 1, 2 and 3. The RF path starts with the multiplexer, which connects an amplifier to one of the two inputs. It is possible to invert the output for easy layout of the Printed-Circuit Board (PCB). The signal is amplified to a certain level. To guarantee this level with minimum distortion over the temperature range and level range, an active control part is added. The offset compensation circuit following the inverter minimizes the offset. The Received Signal Strength Indicator (RSSI) or the Loss Of Signal (LOS) detection uses a 7-stage ‘successive detection’ circuit. It provides a logarithmic output. The LOS is followed by a comparator with a programmable threshold. The input signal level-detection is implemented to check if the input signal voltage is above the user programmed level. This can insure that data will only be transmitted when the input signal-to-noise ratio is sufficient for low bit error rate system operation. A second offset compensation circuit minimizes the offset of the logarithmic amplifier. RF input circuit The input circuit contains internal 50 Ω resistors decoupled to ground via an internal common mode 12 pF capacitor (see Fig.6). The input pins are DC-biased at approximately −0.33 V by an internal reference generator. The TZA3019 can be DC-coupled, but AC-coupling is preferred. In case of DC-coupling, the driving source must operate within the allowable input range (−1.0 to +0.3 V). A DC-offset voltage of more than a few millivolts should be avoided, since the internal DC-offset compensation circuit has a limited correction range. When AC-coupling is used, if no DC-compatibility is required, the values of the coupling capacitors must be large enough to pass the lowest input frequency of interest. Capacitor tolerance and resistor variation must be included for an accurate calculation. Do not use signal frequencies around the low cut-off circuit frequencies (f−3dB(l) = 50 kHz for the postamplifiers and f−3dB(l) = 1 MHz for the LOS circuits). RF output circuit Matching the main amplifier outputs (see Fig.7) is not mandatory. In most applications, the transmission line receiving end will be properly matched, while very little reflections occur. Matching the transmitting end to absorb reflections is only recommended for very sensitive applications. 2000 Apr 10 9 Postamplifier level adjustment
TZA3019
In such cases, pull-up resistors of 100 Ω should be connected as close as possible to the IC from pins OUT1 and OUT1Q, and pins OUT2 and OUT2Q to VEE1B and VEE2B respectively. These matching resistors are not needed in most applications.
handbook, halfpage
GND1A, GND2A 12 pF 420 Ω
50 Ω IN1, IN2 IN1Q, IN2Q
50 Ω
MGS555
VEE1A, VEE2A
Fig.6 RF input circuit.
The postamplifier boosts the signal up to PECL levels. The output can be either CML- or PECL-level compatible, adjusted by means of the voltage on pins LEVEL1 and LEVEL2. The DC voltages of pins OUT1 and OUT1Q, and pins OUT2 and OUT2Q match with the DC-levels on pins LEVEL1 and LEVEL2, respectively. Due to the receiving end 50 Ω load resistance, it means that at the same level of Vo(p-p), VLEVEL1 and VLEVEL2 with AC-coupling are not equal to VLEVEL1 and VLEVEL2 with DC-coupling (see Figs 7 and 8). The postamplifier is in power-down state when pin LEVEL1 or LEVEL2 is connected to ground or not connected (see Fig.8). Postamplifier DC offset cancellation loop Offset control loops connected between the inputs of the buffers A1A and A2A and the outputs of the amplifiers A1B and A2B (see Figs 1, 2 and 3) will keep the input of both buffers at their toggle point during the absence of an input signal. The active offset compensation circuit is integrated, so no external capacitor is required. The loop time constant determines the lower cut-off frequency of the amplifier chain. The cut-off frequency of the offset compensations is fixed internally at approximately 5 kHz.
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
TZA3019
handbook, full pagewidth
GND1A, GND2A R1 100 Ω 100 Ω
GND1B, GND2B OUT1, OUT2 OUT1Q, OUT2Q 50 Ω 50 Ω
Vo
LEVEL1, LEVEL2
Vlevel
R2 Vref
REG
0 Vlevel Vo (V) Vo(se)(p-p)
MGS556
Vlevel = 0.5 × Vo(se)(p-p). R1 V level = V ref × --------------------- . R1 + R2 Level detector in power-down mode: VLEVEL1 or VLEVEL2 = VGND.
a. DC-coupling.
handbook, full pagewidth
GND1A, GND2A 100 Ω R1 100 Ω
GND1B, GND2B OUT1, OUT2 OUT1Q, OUT2Q 50 Ω 50 Ω
Vo
LEVEL1, LEVEL2
Vlevel 0
R2 Vref
REG
Vlevel Vo (V)
Vlevel = 1.5 × Vo(se)(p-p). R1 V level = V ref × --------------------- . R1 + R2 Level detector in power-down mode: VLEVEL1 or VLEVEL2 = VGND.
Vo(se)(p-p)
MGL811
b. AC-coupling. Fig.7 RF output configurations.
2000 Apr 10
10
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
TZA3019
handbook, full pagewidth
MGS557
1000 Vo(se)(p-p) (mV) 800 DC-coupled 600 AC-coupled
400
200
0
0
20
40
60
100 80 Vlevel (% of Vref)
Fig.8 Output signal as a function of Vlevel.
TTL logic input of selector and inverter The logic levels are differently defined for positive or negative logic (see Fig.9). It should be noted that positive logic levels are inverted if a negative supply voltage is used. Outputs as a function of switch input pins S1, S2, INV1 and INV2 See Tables 1, 2, 3 and 4. The default values for the switch input pins S1, S2, INV1 and INV2 if not connected, is zero. Table 1 S1 0 1 OUT1 and OUT1Q as function of input S1
Table 2 S2 0 1 Table 3 INV1 0 1 Table 4 INV2
OUT2 and OUT2Q as function of input S2 OUT2 IN2 IN1 OUT2Q IN2Q IN1Q
OUT1 and OUT1Q as function of INV1 OUT1 IN1 or IN2 IN1Q or IN2Q OUT1Q IN1Q or IN2Q IN1 or IN2
OUT2 and OUT2Q as function of INV2 OUT2 IN1 or IN2 IN1Q or IN2Q OUT2Q IN1Q or IN2Q IN1 or IN2
OUT1 IN1 IN2
OUT1Q IN1Q IN2Q
0 1
2000 Apr 10
11
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
TZA3019
handbook, full pagewidth
logic level 1
MGS558
2.0 V
2.0 V
(1)
T TL
0.8 V 0 1.4 V VEE −4 −3 −2 −1 GND 0 +1 +2 VI (V) +3 1.4 V 0.8 V
a. Negative circuit supply voltage VEE and negative logic supply voltage VEE.
handbook, full pagewidth
logic level 1
MGS559
2.0 V
2.0 V
(1)
T TL
0.8 V 0 1.4 V VEE −4 −3 −2 −1 GND 0 +1 +2 VI (V) +3 1.4 V VCC 0.8 V
b. Negative circuit supply voltage VEE and positive logic supply voltage VCC.
handbook, full pagewidth
logic level 1
MGS560
2.0 V
2.0 V
(1)
T TL
0.8 V 0 1.4 V GND −1 0 +1 +2 VCC +3 +4 +5 VI (V) +6 1.4 V 0.8 V
c. Positive circuit supply voltage VCC and positive logic supply voltage VCC.
(1) Level not defined.
Fig.9 Logic levels on pins S1, S2, INV1 and INV2 as a function of the input voltages.
2000 Apr 10
12
Philips Semiconductors
Preliminary specification
2.5 Gbits/s dual postamplifier with level detectors and 2 × 2 switch
RSSI and LOS detection The TZA3019 allows AC-signal level detection. This can prevent the outputs from reacting to noise during the absence of a valid input signal, and can insure that data only will be transmitted when the signal-to-noise ratio of the input signal is sufficient to insure low bit error rate system operation. The RSSI detection circuit uses seven limiting amplifiers in a ‘successive detection’ topology to closely approximate logarithmic response over a total range of 70 dB. The detectors provide full-wave rectification of the AC signals presented at each previous amplifier stage. Their outputs are current drivers. Each cell incorporates a low-pass filter, being the first step in recovering the average value of the demodulated signal of the input frequency. The summed detector output currents are converted to a voltage by an internal load resistor. This voltage is buffered and available in the A and B versions of the TZA3019. When VRSSI is used VLOSTH must be connected to GND to prevent the LOS comparator from switching to the standby mode. The LOS comparator detects an input signal above a fixed threshold, resulting in a LOW-level at the LOS circuit output.The threshold level is determined by the voltage on pins LOSTH1 or LOSTH2 (see Fig.10). A filter with a time constant of 1 µs nominal is included to prevent noise spikes from triggering the level detector. The comparator (with internal 3 dB hysteresis) drives an open-drain circuit with an internal resistor (5 kΩ) for direct interfacing to positive or negative logic (see Fig.11). Only available in the B and C versions of the TZA3019. The response is independent of the sign of the input signal because of the particular way the circuit has been built. This is part of the demodulating nature of the detector, which results in an alternating input voltage being transformed to a rectified and filtered quasi DC-output signal. For the TZA3019 the logarithmic voltage slope is ϕ = 1/13 dB/mV and is essentially temperature and supply independent through four feedback loops in the reference circuit. The internal LOS detector output voltage is based on Vref. The demodulator characteristic depends on the waveform and the response depends roughly on the input signal RMS value. This influences high frequencies, a square wave input of 2.4 GHz (LOS circuit bandwidth of 2.4 GHz) offsets the intercept voltage by 20%. VLOSTH can be calculated using the following formulae: V LOSTH = V RSSI = S × 20log where S = sensitivity. Example: a 200 mV (p-p) single-ended 1.2 GB/s PRBS signal has an RSSI from 1003 mV. 2000 Apr 10 13
( Vi ⁄ 18 µ V )
TZA3019
handbook, halfpage3 10
MGS564
Vi(se)(p-p) (mV) 102 LOS1, LOS2 LOW-level
(1) (2)
10 LOS1, LOS2 HIGH-level 1
(3)
10−1 10
20
40 50 60 30 70 VLOSTH1, VLOSTH2 (% of Vref)
−0.16
−0.32
−0.48
−0.64 −0.8 −0.96 −1.12 VRSSI1, VRSSI2 (V)
(1) PRBS pattern input signal with a frequency