UBA2024AP

UBA2024 Half-bridge power IC for CFL lamps Rev. 6.2 — 1 November 2010 Product data sheet 1. General description The UBA2024 is a family of high-voltage monolithic Integrated Compact Fluorescent Lamp (CFL) drivers for a large range of lamp powers. Specific versions are optimized for 230 V and 110 V mains supplies. The product family integrates full CFL controller functionality with high voltage half-bridge transistors. All products in the UBA2024 family are pin-to-pin compatible enabling a single application design covering a wide range of power ratings. The IC features a soft start function, an adjustable internal oscillator and an internal drive function with a high-voltage level shifter for driving the half-bridge. To guarantee an accurate 50 % duty cycle, the oscillator signal is passed through a divider before being fed to the output drivers. 2. Features and benefits The common feature set includes: high power efficiency a high integration level with low component counts enabling small form factor electronic ballast integrated bootstrap diode soft start function minimum glow time control integrated low-voltage supply adjustable operating frequency as a result of the embedded oscillator an accurate 50 % duty cycle provided by an embedded oscillator signal integrated half-bridge power transistors an internal drive function with a high-voltage level shifter up to 550 V (300 V for the UBA2024BP and UBA2024BT) 3. Applications Driver for any kind of half-bridge configured load up to 23 W, provided that the maximum junction temperature is not exceeded Designed for electronically self-ballasted CFL lamps NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 4. Ordering information Table 1. Ordering information Package Name UBA2024P[1] UBA2024T[1] UBA2024AP[2] UBA2024AT[3] UBA2024BP[4] UBA2024BT[4] [1] [2] [3] [4] Type number Description plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 14 leads; body width 3.9 mm plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 14 leads; body width 3.9 mm plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 14 leads; body width 3.9 mm Version SOT97-1 SOT108-1 SOT97-1 SOT108-1 SOT97-1 SOT108-1 DIP8 SO14 DIP8 SO14 DIP8 SO14 For this type number, RDS(on) = 9 Ω and ISAT = 900 mA. For this type number, RDS(on) = 6 Ω and ISAT = 1350 mA. For this type number, RDS(on) = 6.4 Ω and ISAT = 1200 mA. For this type number, RDS(on) = 2 Ω and ISAT = 2500 mA. 5. Block diagram (6) 4 HV VDD CONTROL VDD SW 6* (7)** HS 8 (1) SWEEP AND GLOW TIME CONTROL VDD(stop) HIGH VOLTAGE LEVEL SHIFTER HIGH SIDE DRIVER (3) 11 FS (5) 14 RC 7 (8) OSCILLATOR DIVIDE-BY-2 DEAD TIME LOW SIDE DRIVER SGND 1,2,3,5,9,10,13 (2) (4) 12 mdb029 OUT LS PGND Fig 1. Block diagram UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 2 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 6. Pinning information 6.1 Pinning SGND 1 2 3 4 5 6 7 014aaa804 14 OUT 13 SGND 12 PGND UBA2024P UBA2024AP UBA2024BP SW SGND FS PGND 1 2 3 4 014aaa657 SGND SGND 8 7 6 5 RC VDD HV OUT HV SGND VDD RC UBA2024T UBA2024AT 11 FS UBA2024BT 10 SGND 9 8 SGND SW Fig 2. Pinning diagram SOT97-1 Fig 3. Pinning diagram SOT108-1 6.2 Pin description Table 2. Symbol SW SGND FS PGND OUT HV VDD RC Pin description Pin SOT97-1 Pin SOT108-1 1 2 3 4 5 6 7 8 8 1, 2, 3, 5, 9, 10, 13 11 12 14 4 6 7 Description sweep timing input signal ground high-side floating supply output power ground half-bridge output high-voltage supply internal low-voltage supply output internal oscillator input UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 3 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 7. Functional description 7.1 Supply voltage The UBA2024 does not require an external low-voltage supply as the mains supply voltage applied to pin HV powers it. The IC derives its own low supply voltage from this for its internal circuitry. 7.2 Start-up state With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the start-up state the high-side power transistor is not conducting and the low-side power transistor is switched on. The internal circuit is reset and the capacitors on the bootstrap pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to ground. The start-up state is defined until VDD = VDD(startup). 7.3 Sweep mode The IC enters the sweep mode when the voltage on pin VDD > VDD(startup). The capacitor on pin SW is charged by ISW and the half-bridge circuit starts oscillating. The circuit enters the start-up state again when the voltage on pin VDD < VDD(stop). The sweep time (tsweep) is determined by the charge current (Ich(sw)) and the external capacitor (CSW). Typical the total sweep time set by CSW is: t sweep = C SW ( n F ) × 10.3 m s During the sweep time the current flowing through the lamp electrodes performs some preheating of the filaments. See Figure 5. (1) 7.4 Reset A DC reset circuit is incorporated in the high-side driver. The high-side transistor is switched off when the voltage on pin FS is below the high-side lockout voltage Vfloat(UVLO). 7.5 Oscillation The oscillation is based upon the 555-timer function. A self oscillating circuit is made with the external resistor ROSC and the capacitor COSC (see Figure 4). To realize an accurate 50 % duty cycle, an internal divider is used. This reduces the bridge frequency to half the oscillator frequency. The output voltage of the bridge will change at the falling edge of the signal on pin RC. The design equation for the half-bridge frequency is: 1 f osc = ---------------------------------------k × R OSC × C OSC An overview of the oscillator signal, internal LS and HS drive signals and the output is given in Figure 4. (2) UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 4 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps VRC 0 time HS drive 0 time LS drive 0 VOUT half bridge 0 time time 014aaa658 Fig 4. Oscillator, drivers and output signals When entering the sweep mode (VSW = 0 V), the bridge oscillator starts at 2.5 times the nominal bridge frequency and sweeps down to the nominal frequency (bridge), set by ROSC and COSC. During the sweep mode the amplitude of the RC oscillator on pin RC, will swing between Vtrip(osc)low and VSW + 0.4Vtrip(osc)high. The amplitude of the RC oscillator will continue to increase until VSW + 0.4Vtrip(osc)high = Vtrip(osc)high, this determines the end of the sweep time. The voltage on pin SW however will continue to rise until it reaches supply voltage level. During this continuous decrease in frequency, the circuit approaches the resonance frequency of the load, and this causes a high voltage across the load, which ignites the lamp. The sweep to resonance time should be much larger than the settling time of the supply voltage on pin HV, to guarantee that the full high-voltage is present at the moment of ignition. See Figure 5. UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 5 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps VHV 0 VDD VDD(startup) 0 VSW VDD 0.6Vtrip(osc)high time time 0 fosc 2.5nom time nom 0 Vlamp Vign VgloA time Vnom 0 tsweep time 014aaa659 Fig 5. Start-up frequency behavior 7.6 Non-overlap time The non-overlap time is defined as the time when both MOSFETs are not conducting. The non-overlap time is fixed internally. UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 6 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VHV Parameter voltage on pin HV Conditions normal operation UBA2024P UBA2024AP UBA2024T UBA2024AT UBA2024BP UBA2024BT mains transients during 0.5 s UBA2024P UBA2024AP UBA2024T UBA2024AT UBA2024BP UBA2024BT VFS VDD IDD VPGND VRC VSW SR Tj Tamb Tstg [1] Min VHV 0 0 −1 0 0 −4 [1] Max 373 373 373 373 187 187 550 550 550 550 300 300 VHV + 14 14 5 +1 VDD VDD +4 +150 +150 +150 Unit V V V V V V V V V V V V V V mA V V V V/ns °C °C °C voltage on pin FS supply voltage supply current voltage on pin PGND voltage on pin RC voltage on pin SW slew rate junction temperature ambient temperature storage temperature The maximum junction temperature must not be exceeded. low voltage; DC supply low voltage; peak value is internally limited; Tamb = 25 °C referenced to SGND IRC < 1 mA ISW < 1 mA pin OUT; repetitive −40 −40 −55 9. Thermal characteristics Table 4. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air SO14 package DIP8 package Rth(j-c) thermal resistance from junction to case in free air SO14 package DIP8 package [1] In accordance with IEC 60747-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Typ [1] Unit K/W K/W K/W K/W 95 95 [1] 8 16 UBA2024 Product data sheet Rev. 6.2 — 1 November 2010 7 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 10. Characteristics Table 5. Characteristics Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol VHV Parameter voltage on pin HV Conditions mains transients during 0.5 s; IHV < 30 μA UBA2024P UBA2024AP UBA2024T UBA2024AT UBA2024BP UBA2024BT VFS voltage on pin FS mains transients during 0.5 s; IHV < 30 μA UBA2024P UBA2024AP UBA2024T UBA2024AT UBA2024BP UBA2024BT Low-voltage supply VDD supply voltage VHV = 100 V; Rosc = ∞; VSW = VDD; VRC = 0 V VHV = 100 V; Rosc = ∞; VSW = VDD; VRC = 0 V 11.4 12.5 13.3 V 0 0 0 0 0 0 564 564 564 564 264 264 V V V V V V 0 0 0 0 0 0 550 550 550 550 250 250 V V V V V V Min Typ Max Unit High-voltage supply Start-up state IHV VDD(startup) VDD(stop) VDD(hys) current on pin HV start-up supply voltage stop supply voltage hysteresis of supply voltage 10 8 2 11 8.5 2.5 0.39 12 9 3 mA V V V UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 8 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps Table 5. Characteristics …continued Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol Ron Parameter on-state resistance Conditions HS transistor; VHV = 310 V; ID = 100 mA UBA2024P UBA2024T UBA2024AP UBA2024AT HS transistor; VHV = 160 V; ID = 100 mA UBA2024BP UBA2024BT LS transistor; ID = 100 mA UBA2024P UBA2024T UBA2024AP UBA2024AT UBA2024BP UBA2024BT VF forward voltage HS; IF = 200 mA LS; IF = 200 mA bootstrap diode; IF = 1 mA IDsat drain saturation current HS; VDS = 30 V; Tj ≤ 125 °C; VHV = 310 V UBA2024P UBA2024AP UBA2024T UBA2024AT HS; VDS = 30 V; Tj ≤ 125 °C; VHV = 160 V UBA2024BP UBA2024BT LS; VDS = 30 V; Tj ≤ 125 °C UBA2024P UBA2024AP UBA2024T UBA2024AT UBA2024BP UBA2024BT tno Vfloat(UVLO) non-overlap time undervoltage lockout floating voltage 900 1350 900 1200 2500 2500 1 3.6 1.35 4.2 1.7 4.8 mA mA mA mA mA mA μs V 2500 2500 mA mA 900 1350 900 1200 mA mA mA mA 0.7 8.5 8.5 5.7 6.2 2.3 2.3 1.0 9.4 9.4 6.3 6.9 2.55 2.55 2.0 2.0 1.3 Ω Ω Ω Ω Ω Ω V V V 2.0 2.0 2.35 2.35 Ω Ω 9.7 9.7 6.5 7.0 11 11 7.4 8.0 Ω Ω Ω Ω Min Typ Max Unit Output stage UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 9 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps Table 5. Characteristics …continued Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol IFS Parameter current on pin FS Conditions VHV = 310 V; VFS = 12.2 V UBA2024P, UBA2024T UBA2024AP, UBA2024AT VHV = 160 V; VFS = 12.2 V UBA2024BP, UBA2024BT Internal oscillator fosc oscillator frequency VSW = 0 V VSW = VDD operating; nominal; ROSC = 100 kΩ; COSC = 220 pF; VSW = VDD Δfosc/fosc kH kL Vtrip(osc)low Kosc Ich(sweep) tsweep relative oscillator frequency variation high-level trip point factor Vtrip(osc)high = kH × VDD Vtrip(osc)low = kL × VDD ROSC = 100 kΩ; COSC = 220 pF VSW = 0 V CSW = 33 nF; VDD = 12.2 V low-level trip point factor low oscillator trip voltage oscillator constant sweep charge current sweep time ROSC = 100 kΩ; COSC = 220 pF; −20 °C ≤ Tj ≤ +150 °C 40.05 0.382 4.58 0.030 0.367 1.065 215 0.28 150 41.32 2 0.395 4.94 0.033 0.413 1.1 280 0.35 60 42.68 0.408 5.29 0.038 0.483 1.35 345 0.45 V V nA s V kHz kHz kHz % 10 14 18 μA 10 10 14 14 18 18 μA μA Min Typ Max Unit Vtrip(osc)high high oscillator trip voltage Sweep function 11. Electrostatic discharge Table 6. Model ESDH (human body model) ESDC (charged device model) ESDM (machine model) ElectroStatic Discharge (ESD) overview Class 1C C2 B JEDEC classification criteria pass at ESD pulse 1000 V fail at ESD pulse 2000 V pass at ESD pulse 200 V fail at ESD pulse 500 V pass at 200 V ≥ ESD pulse < 400 V UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 10 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 12. Application information 1.8 mH LFILT RFUS D1 D2 CBUF 4.7 μF D3 D4 CHB1 47 nF CHB2 47 nF LLA max. 550 V 11 W/150 mA CFS 10 nF HV FS SW VDD ROSC 110 kΩ AC mains supply (230 V) 33 Ω OUT CDV 100 pF UBA2024 CFL CLA 1.5 nF RC COSC 180 pF 3.1 mH CVDD 10 nF CSW 33 nF PGND SGND 001aan022 Fig 6. Schematic of 230 V standard compact fluorescent lamp application using UBA2024 LFILT maximum 300 V 1.5 mH D1 RFUS D2 CHB1 150 nF 24 W/300 mA LR 0.66 mH CDVDT 820 pF HV FS CFS 10 nF VDD ROSC 26.1 kΩ RC OUT UBA2024B SW CSW 470 nF RSW 4.7 MΩ COSC 1.2 nF CVDD 10 nF AC mains supply (120 V) 4.7 Ω CBUS 33 μF CHB2 150 nF CFL CRS 10 nF D4 D3 PGND SGND 001aam620 Fig 7. Schematic of 120 V standard compact fluorescent lamp application using UBA2024B UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 11 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 13. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 D seating plane ME A2 A L A1 c Z e b1 wM (e 1) b2 5 MH b 8 pin 1 index E 1 4 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 8. UBA2024 Package outline SOT97-1 (DIP8) All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 12 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE vMA Z 14 8 Q A2 A1 pin 1 index (A 3) θ Lp L A 1 7 e bp wM detail X 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 θ o 0.010 0.057 inches 0.069 0.004 0.049 0.019 0.0100 0.35 0.014 0.0075 0.34 0.244 0.039 0.041 0.228 0.016 0.028 0.004 0.012 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 9. UBA2024 Package outline SOT108-1 (SO14) All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 13 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 14. Revision history Table 7. Revision history Release date 20101101 Data sheet status Product data sheet Change notice Supersedes UBA2024 v.5 Document ID UBA2024 v.6.2 Modifications: • • • • • Figure 5 on page 6 has been changed. The glow time section has been removed. ESD values have been removed from Table 3 “Limiting values” on page 7, added in to Table 6 “ElectroStatic Discharge (ESD) overview” on page 10 and one error corrected. Table 3 “Limiting values” on page 7: table notes 2 and 3 have been removed. Table 5 “Characteristics” on page 8: – VDD supply voltage minimum value has been changed. – VF forward voltage HS maximum value has been changed. – KL low-level trip point factor maximum value has been changed. – Vtrip(osc)low low oscillator trip voltage maximum value has been changed. • UBA2024 v.5 UBA2024 v.4 UBA2024 v.3 UBA2024 v.2 UBA2024 v.1 Figure 6 on page 11 have been changed. Product data sheet Product data sheet Product data sheet Product data sheet Product data sheet UBA2024 v.4 UBA2024 v.3 UBA2024 v.2 UBA2024 v.1 - 20100916 20090917 081016 040203 030813 UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 14 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 15. Legal information 15.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 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Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or UBA2024 All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6.2 — 1 November 2010 15 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com UBA2024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6.2 — 1 November 2010 16 of 17 NXP Semiconductors UBA2024 Half-bridge power IC for CFL lamps 17. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 4 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Sweep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal characteristics . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrostatic discharge . . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 1 November 2010 Document identifier: UBA2024