UBA2080P

UBA2080/1 Half-bridge driver IC Rev. 1.1 — 6 December 2011 Objective data sheet 1. General description The UBA2080 and UBA2081 are high voltage monolithic integrated circuits made using the latch-up free Silicon-On-Insulator (SOI) process. The circuit is designed for driving MOSFETs in a half-bridge configuration. 2. Features and benefits       Integrated half-bridge driver circuit Integrated bootstrap diode Maximum voltage of 600 V Output driver capability: IO(sink) = 400 mA and IO(source) = 200 mA Maximum frequency 800 kHz UBA2080:  Outputs in phase with inputs  UBA2081:  Adjustable dead-time  Shutdown input 3. Applications  Driver (via external MOSFETs) for any kind of load in a half-bridge configuration 4. Ordering information Table 1. Ordering information Package Name UBA2080P UBA2081P UBA2080T UBA2081T UBA2080AT SO14 plastic small outline package; 14 leads SOT108-1 SO8 plastic small outline package; 8 leads SOT96-1 DIP8 Description plastic dual in-line package; 8 leads Version SOT97-1 Type number NXP Semiconductors UBA2080/1 Half-bridge driver IC 5. Block diagram FS VDD ULVO ULVO R1 R2 S HS DRIVER GH HIN LOGIC LEVEL SHIFTER SH LIN LS DRIVER GL GND aaa-001102 Fig 1. Block diagram (UBA2080X) FS VDD ULVO ULVO R1 R2 S HS DRIVER GH CLK LOGIC LEVEL SHIFTER SH SD NON-OVERLAP LS DRIVER GL GND Vref aaa-001107 Fig 2. Block diagram (UBA2081X) Refer to Figure 7 “Typical UBA2080X application” and Figure 8 “Typical UBA2081X application” for detailed information on the required application components. UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 2 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC 6. Pinning information 6.1 Pinning GND GND SD/LIN VDD GND LIN HIN 1 2 3 4 aaa-001121 1 2 3 4 5 6 7 aaa-001134 14 SEL 13 GND 12 VDD 8 GL SH GH FS GND CLK/HIN FS GH UBA2080AT 11 GL 10 GND 9 8 GND SH VDD GND SD CLK 1 2 3 4 aaa-001126 8 GL SH GH FS UBA2080 7 6 5 UBA2081 7 6 5 Fig 3. UBA2080X: Pin configuration DIP8 and SO8 package Fig 4. UBA2080AT: Pin configuration SO14 package Fig 5. UBA2081X: Pin configuration DIP8 and SO8 package 6.2 Pin description Table 2. Symbol Pin description UBA2080X/1X DIP8 and SO8 Pin UBA2080X (DIP8/SO8) VDD GND LIN SD HIN CLK FS GH SH GL Table 3. Symbol GND SD/LIN CLK/HIN FS SH GH 1 2 3 4 5 6 7 8 3 4 UBA2081X (DIP8/SO8) IC supply IC ground and low-side driver return low-side driver logic input low-side driver logic input high-side driver logic input high-side driver logic input floating supply voltage high-side MOSFET gate high-side MOSFET source low-side MOSFET gate Description Pin description UBA2080AT (SO14) Pin 1, 2, 4, 9, 10, 13 3 5 6 8 7 Description IC ground and low side driver return low-side driver logic input high-side driver logic input floating supply voltage high-side MOSFET source high-side MOSFET gate UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 3 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC Pin description UBA2080AT (SO14) …continued Pin 11 12 14 Description low-side MOSFET gate IC supply select UBA2080 or UBA2081 functionality Table 3. Symbol GL VDD SEL 7. Functional description 7.1 Start-up state The IC enters the start-up state when the supply voltage on pin VDD increases. In the start-up state, the high-side power transistor is non-conducting and the low-side power transistor is switched on. The internal circuit is reset and the capacitor on the bootstrap pin FS is charged. The start-up state is defined until the value of VDD = the VDD(start) value. After which the IC switches to the oscillation state. The circuit enters the start-up state again when the voltage on pin VDD VDD(stop). 7.2 UBA2080 oscillation state In the oscillation state, the output voltage of the GL and GH drivers depend on the logical signals HIN and LIN, see Table 4 To prevent cross conduction in the half-bridge MOSFETs, the combination HIN = LIN = 1 is not allowed. Both GL and GH are LOW under this condition. Table 4. State Start-up Oscillation Oscillation Oscillation Oscillation logic table HIN 0 0 1 1 LIN 0 1 0 1 GL HIGH LOW HIGH LOW LOW GH LOW LOW LOW HIGH LOW 7.3 UBA2081 oscillation state In the oscillation state, the output voltage of the GL and GH drivers depend on the logical signals CLK and SD, see Table 5 Table 5. State Start-up Oscillation Oscillation Oscillation Oscillation logic table CLK 0 1 0 1 SD 0 0 1 1 GL HIGH HIGH LOW LOW LOW GH LOW LOW HIGH LOW LOW UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 4 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC 7.4 UBA2081 non-overlap time The external resistor (RSD) on pin SD sets the non-overlap time of the UBA2081. The relationship between this resistor value and actual dead-time is listed in Figure 6. 3000 tno (ns) 2000 aaa-001135 1000 0 0 1 2 RSD (MΩ) 3 Fig 6. Non-overlap time versus SD resistor (RSD) UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 5 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD VFS VSH Vi(HIN) Vi(LIN) VCLK Vi(SD) SR Tj Tamb Tstg VESD Parameter supply voltage voltage on pin FS voltage on pin SH input voltage on pin HIN input voltage on pin LIN voltage on pin CLK input voltage on pin SD slew rate junction temperature ambient temperature storage temperature electrostatic discharge voltage human body model: pins FS, GH and SH pins VDD, HIN, LIN, SD, CLK machine model: all pins [1] [2] [2] [1] Conditions nominal source high-side MOSFET t < 1 s logic input for high-side driver logic input for low-side driver logic input for output drivers logic input for output drivers and analog input for non-overlap setting on pin SH; repetitive Min 0 VSH -3 -14  0  0 6 40 40 55 - Max 14 VSH + 14 600 600 14 14 14 14 +6 +150 +150 +150 1 2 250 Unit V V V V V V V V V/ns C C C kV kV V In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 k series resistor and a 0.75 H inductor. 9. Thermal characteristics Table 7. Symbol SO8 Rth(j-a) SO14 and DIP8 Rth(j-a) [1] Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to ambient Conditions in free air in free air [1] Typ Unit 160 K/W 100 K/W [1] In accordance with IEC 60747-1. UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 6 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC 10. Characteristics Table 8. Characteristics Tj = 25 C; all voltages are measured with respect to SGND; VDD = 12.8 V; positive currents flow into the IC. Symbol Ileak Start-up state IVDD VDD(start) VDD(stop) VDD(hys) Pin LIN input VIH Vhys(LIN) II(LIN) Pin HIN input VIH Vhys(HIN) II(HIN) Pin CLK input VIH VIL II(CLK) Pin SD input VIH Vhys(SD) tno gate drivers IO(source) IO(sink) Vd(bs) VUVLO IFS Timing td ton toff fmax delay time turn-on time turn-off time maximum frequency UBA2080 UBA2080 UBA2080 800 50 240 180 ns ns ns kHz output source current output sink current bootstrap diode voltage undervoltage lockout voltage current on pin FS VFS = VVDD = 12 V; VSH = 0 V; VGH = VGL = 8 V VFS = VVDD = 12 V; VSH = 0 V; VGH = VGL = 4 V Id(bs) = 20 mA reset VFS = VVDD = 12 V; VSH = 0 V 3.6 27 200 400 2.3 4.2 32 4.8 37 mA mA V V A HIGH-level input voltage hysteresis voltage on pin SD non-overlap time RSD = 100 k; typical minimum RSD = 3 M; typical maximum to activate shutdown 1.6 2.2 400 140 2.4 2.8 V mV ns s HIGH-level input voltage LOW-level input voltage input current on pin CLK 2.7 0 0.8 1 V V A HIGH-level input voltage hysteresis voltage on pin HIN input current on pin HIN 1.6 2.2 400 0 2.8 1 V mV A HIGH-level input voltage hysteresis voltage on pin LIN input current on pin LIN 1.6 2.2 400 0 2.8 1 V mV A current on pin VDD start supply voltage stop supply voltage hysteresis of supply voltage start to stop 420 11 8 3 520 12 8.5 3.5 620 13 9 4 A V V V Parameter leakage current Conditions FS = GH = SH = 600 V Min Typ Max 10 Unit A High-voltage supply UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 7 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC 11. Application information HVIN FS HIN from µC LIN GH SH CFS UBA2080X VDD supply VDD CVDD to load GL GND aaa-001424 Fig 7. Typical UBA2080X application HVIN FS SD input clock RSD GH SH CFS CLK to load UBA2081X tno GL VDD supply VDD CVDD GND aaa-001425 Remark: The capacitor connected to the SD pin ensures a noise immune dead-time. Fig 8. Typical UBA2081X application UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 8 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC 12. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE vMA Z 8 5 Q A2 A1 pin 1 index θ Lp 1 4 (A 3) A L wM detail X e bp 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 θ 8o o 0 0.010 0.057 0.004 0.049 0.019 0.0100 0.014 0.0075 0.244 0.039 0.028 0.041 0.228 0.016 0.024 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 9. Package outline SOT96-1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. UBA2080_UBA2081 Objective data sheet Rev. 1.1 — 6 December 2011 9 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 D seating plane ME A2 A L A1 c Z e b1 wM (e 1) b2 5 MH b 8 pin 1 index E 1 4 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig 10. Package outline SOT97-1 UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 10 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE vMA Z 14 8 Q A2 A1 pin 1 index θ Lp 1 7 (A 3) A L wM detail X e bp 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 θ 8o o 0 0.010 0.057 inches 0.069 0.004 0.049 0.019 0.0100 0.35 0.014 0.0075 0.34 0.244 0.039 0.041 0.228 0.016 0.028 0.004 0.012 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT108-1 UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 11 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC 13. Revision history Table 9. Revision history Release date Data sheet status Objective data sheet Objective data sheet Change notice Supersedes UBA2080_UBA2081 v.1 Document ID Modifications: UBA2080_UBA2081 v.1 UBA2080_UBA2081 v.1.1 20111206 • Figure 6 “Non-overlap time versus SD resistor (RSD)” on page 5: Axes units changed. 20111116 UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 12 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC 14. Legal information 14.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. © NXP B.V. 2011. All rights reserved. 14.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. Objective data sheet Rev. 1.1 — 6 December 2011 13 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com UBA2080_UBA2081 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1.1 — 6 December 2011 14 of 15 NXP Semiconductors UBA2080/1 Half-bridge driver IC 16. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 4 UBA2080 oscillation state. . . . . . . . . . . . . . . . . 4 UBA2081 oscillation state . . . . . . . . . . . . . . . . 4 UBA2081 non-overlap time . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 December 2011 Document identifier: UBA2080_UBA2081