UMA1014T

INTEGRATED CIRCUITS DATA SHEET UMA1014 Low-power frequency synthesizer for mobile radio communications Product specification Supersedes data of October 1991 File under Integrated circuits, IC03 October 1992 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications FEATURES • Single chip synthesizer; compatible with Philips cellular radio chipset • Fully programmable RF divider • I2C interface for two-line serial bus • On-chip crystal oscillator/TCXO buffer from 3 to 16 MHz • 16 reference division ratios allowing 5 to 100 kHz channel spacing • 1/8 crystal frequency output • On-chip out-of-lock indication • Two extra VCO control outputs • Latched synthesizer alarm output • Status register including out-of-lock indication and power failure • Power-down mode. APPLICATIONS • Cellular mobile radio (NMT, AMPS, TACS) • Private mobile radio (PMR) • Cordless telephones. QUICK REFERENCE DATA SYMBOL VCC, VCP ICC + ICP ICCpd fref fRF Tamb supply current ICC in power-down phase comparator reference frequency RF input frequency operating ambient temperature range PARAMETER supply voltage range 4.5 − − 5 50 −40 MIN. 5.0 13 2.5 − − − TYP. 5.5 − − 100 1100 85 GENERAL DESCRIPTION UMA1014 The UMA1014 is a low-power universal synthesizer which has been designed for use in channelized radio communication. The IC is manufactured in bipolar technology and is designed to operate at 5 to 100 kHz channel spacing with an RF input from 50 to 1100 MHz. The channel is programmed via a standard I2C-bus. A low-power sensitive RF divider is incorporated together with a dead-zone eliminated, 3-state phase comparator. The low-noise charge pump delivers 1 mA or 1/2 mA output current to enable a better compromise between fast switching and loop bandwidth. A power-down circuit enables the synthesizer to be set to idle mode. MAX. V UNIT mA mA kHz MHz °C ORDERING INFORMATION PACKAGE TYPE NUMBER NAME UMA1014T SO16 DESCRIPTION plastic small outline package; 16 leads; body width 3.9 mm VERSION SOT109-1 October 1992 2 handbook, full pagewidth October 1992 +5 V supply ground 1/8 crystal frequency internally output connected +5 V charge pump supply 4 1 oscillator input oscillator output 2 BUFFER/ OSCILLATOR 6 16 14 3 BLOCK DIAGRAM Philips Semiconductors Low-power frequency synthesizer for mobile radio communications UMA1014 8 RF input 31/32 MAIN DIVIDER 18-BITS REFERENCE DIVIDER 4-BITS PHASE COMPARATOR 1-BIT CHARGE PUMP 1-BIT 5 charge pump output hardware power-down 11 3 slave address select input A 12 MAIN CONTROL 3-BITS 15 9 10 7 13 VCO buffer switch output B VCO buffer switch output A OUT-OFLOCK MRA396 - 1 synthesizer alarm output serial data input/output serial clock input Product specification UMA1014 Fig.1 Block diagram. Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications PINNING SYMBOL OSCIN OSCOUT VCP VCC PCD GND VCOA RF SCL SDA HPD SAA VCOB i.c. SYA FX8 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION oscillator or TCXO input oscillator output 5 V charge pump supply 5 V supply charge pump output ground VCO buffer switch output A (including out-of-lock) RF input serial clock input serial data input/output hardware power-down (active LOW) slave address select input A VCO buffer switch output B internally connected synthesizer alarm output 1/8 crystal frequency output RF 8 MRA397 - 1 UMA1014 handbook, halfpage OSCIN OSCOUT 1 2 3 4 5 6 7 16 15 14 13 12 11 10 9 FX8 SYA i.c. VCOB SAA HPD SDA SCL VCP VCC PCD GND VCOA UMA1014 Fig.2 Pin configuration. October 1992 4 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications FUNCTIONAL DESCRIPTION The UMA1014 is a low-power frequency synthesizer for radio communication which operates in the 50 to 1100 MHz range. The device includes an oscillator/buffer circuit, a reference divider, an RF divider, a 3-state phase comparator, a charge pump and a main control circuit to transfer the serial data into the four internal 8-bit registers. The VCC supply feeds the logic part, the VCP supply feeds the charge-pump only. Both supplies are +5 V (±10%). The power-down facility puts the synthesizer in the idle mode (all current supplies are switched off except in the control part). This allows any I2C transfer and all information in the registers is retained thus enabling fast power-up. Main divider The main divider is a pulse swallow type counter which is fully programmable. After a sensitive input amplifier (50 mV, −13 dBm), the RF signal is applied to a 31/32 duo-modulus counter. The output is then used as the clock for the 5-bit swallow counter R = (MD4 to MD0) and the 13-bit main counter N = (MD17 to MD5). The ratio is transferred via the I2C-bus to the registers B, C and D, and then buffered in an 18-bit latch. The ratio in the divider chain is updated with the new information when the least significant bit is received (i.e. D0). This update is synchronized to the output of the divider in order to limit the phase error during small jumps of the synthesized frequency. The main divider can be programmed to any value between 2048 and 262143 (i.e. 218 −1). If ratio X, below 2048, is sent to the divider, the ratio (X + 2048) will be programmed. When it is required to switch between adjacent channels it is possible to program register D only, thus allowing shorter I2C programming time. Oscillator The oscillator is a common collector Colpitts type with external capacitive feedback. The oscillator has very small temperature drift and high voltage supply rejection. A TCXO or other type of clock can be used to drive the oscillator by connecting the source (preferably AC-coupled) to pin 1 and leaving pin 2 open-circuit. The oscillator acts as a buffer in this mode and requires no additional external components. The signal from the clock source should have a minimum space width of 31 ns. Reference divider UMA1014 The reference divider is semi-programmable with 16 division ratios which can be selected via the I2C-bus. The programming uses four bits of the register A (A3 to A0) as listed in Table 2. These ratios allow the use of a large number of crystal frequencies from 3 MHz up to 16 MHz. All main channel spacings can be obtained with a single crystal/TXCO frequency of 9.6 MHz. Phase comparator A diagram of the phase comparator and charge pump is illustrated in Fig.3. The phase comparator is both a phase and frequency detector. The detector comprises dual flip-flops together with logic circuitry to eliminate the dead-zone. When a phase error is detected the UP or DOWN signal goes HIGH. This switches on the corresponding current generator which produces a source or sink current for the loop filter. When no phase error is detected PCD goes high impedance. The final tuning voltage for the VCO is provided by the loop filter. The charge pump current is programmable via the I2C-bus. When IPCD (bit 5) is set to logic 1 the charge pump delivers 1 mA; when IPCD is set to logic 0 the charge pump delivers 0.5 mA. The phase comparator has a phase inverter logic input (PHI). This allows the use of inverted or non-inverted loop filter configurations. It is thus possible to use a passive loop filter which offers higher performances without an operational amplifier. The function of the phase comparator is given in Table 3 and a typical transfer curve is illustrated in Fig.4. Out-of-lock detector An out-of-lock detector using the UP and DOWN signals from the phase comparator is included on-chip. The pin VCOA is an open collector output which is forced LOW during an out-of-lock condition. The same information is also available via the I2C-bus in the status register (bit OOL). When the phase error (measured at the phase comparator) is greater than approximately 200 ns, an out-of-lock condition is immediately flagged. The flag is only released after 6 reference cycles when the phase error is less than 200 ns. October 1992 5 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications Table 1 Division ratio in the main divider MAIN COUNTER: N MD17 B1 MSB Table 2 Reference divider programming REFERENCE DIVISION RATIO 128 160 192 240 256 320 384 480 512 640 768 960 1024 1280 1536 1920 MD16 B0 MD15 C7 ... ... MD8 C0 MD7 D7 ... ... MD5 D5 UMA1014 SWALLOW COUNTER: R MD4 D4 ... ... MD0 D0 LSB A3(RD3) A2(RD2) A1(RD1) A0(RD0) 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Table 3 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 CHANNEL SPACING FOR 9.6 MHz AT OSCIN 75 kHz 60 kHz 50 kHz 40 kHz 37.5 kHz 30 kHz 25 kHz 20 kHz 18.75 kHz 15 kHz 12.5 kHz 10 kHz 9.375 kHz 7.5 kHz 6.25 kHz 5 kHz Operation of the phase comparator PHI = 0 (PASSIVE LOOP FILTER) fref < fvar fref > fvar 1 0 1 mA fref = fvar 0 0 < ±5 nA PHI = 1 (ACTIVE LOOP FILTER) fref < fvar 1 0 1 mA fref > fvar 0 1 −1 mA fref = fvar 0 0 < ±5 nA UP DOWN Ipcd 0 1 −1 mA October 1992 6 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications MAIN CONTROL The control part consists mainly of the control interface and a set of four registers A, B, C and D. The serial input data (SDA) is converted into 8-bit parallel words and stored in the appropriate registers. The data transmission to the synthesizer is executed in the burst mode with the following format: //slave addr./subaddr./data1/data2/.../datan//; n up to 4 Data byte 1 is written in the register indicated by the subaddress. An auto-increment circuit, if enabled Table 4 1 Slave address 1 0 0 0 1 SAA I2C-bus UMA1014 (AVI = 1), then provides the correct addressing for the ensuing data bytes. Since the length of the data burst is not fixed, it is possible to program only one register or the whole set. The registers are structured in such a way so that the burst, for normal operation, is kept as short as possible. The bits that are only programmed during the set-up (reference division ratio, power-down, phase inversion and current on PCD) are stored in registers A and B. In the slave address six bits are fixed, the remaining two bits depend on the application. R/W SAA is the slave address. When SAA goes HIGH then SAA = 0, when SAA goes LOW then SAA = 1. This allows the use of two UMA1014s on the same bus but using a different address. R/W should be set to logic 0 when writing to the synthesizer or set to logic 1 when reading the status register. Table 5 X Where: X = not used DI (Disable Interrupt): DI = 1 disables the alarm on SYA DI = 0 enables the alarm. AVI (Auto Value Increment): AVI = 1 enables the automatic increment AVI = 0 disables the auto-increment. Table 6 Pointer of the registers SB1 0 0 1 1 SB0 0 1 0 1 Subaddress X X DI The subaddress includes the register pointer, and sets the two flags related to the auto-increment (AVI) and the alarm disable (DI). AVI X SB1 SB0 SB1/SB0 are the pointers of the register where DATA1 will be written (see Table 6). When the auto-increment is disabled (AVI = 0), the subaddress pointer will maintain the same value during the I2C-bus transfer. All the data bytes will then be written consecutively in the register pointed by the subaddress. REGISTER POINTED A B C D October 1992 7 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications Status register and synthesizer alarm When an out-of-lock condition or a power dip occurs, SYA, which is an open collector output, is forced LOW and latched. The pin SYA will be released after the status register is read via the I2C-bus. The status register contains the following information: Table 7 0 Where: OOL = momentary out-of-lock LOOL = latched out-of-lock LPD = latched power dip DI = disable interrupt (of the last write cycle). The I2C-bus protocol to read this internal register is a single byte without subaddressing: //slave address (R/W = 1)/status register (read)// Table 8 Bit allocation POINTER 7 A B C D 00 01 10 11 PD 1 MD15 MD7 6 X 0 MD14 MD6 5 IPCD 1 MD13 MD5 BIT ALLOCATION 4 X PHI MD12 MD4 3 RD3 VCOB MD11 MD3 2 RD2 VCOA MD10 MD2 1 RD1 MD17 MD9 MD1 0 Status register 0 0 OOL 0 LOOL LPD UMA1014 DI REGISTER PRESET RD0 MD16 MD8 MD0 00001110 10100101 00111000 10000000 Where X = not used Table 9 Register allocation BIT NAME PD IPCD RD3...RD0 B PHI VCOA VCOB MD17, MD16 C D MD15 to MD8 MD7 to MD0 power down programmable charge pump current reference ratio phase inverter VCO switch A VCO switch B bits 17 and 16 bits 15 to 8 bits 7 to 0 FUNCTION PD = 0 normal operation IPCD = 1 = 1 mA; IPCD = 0 = 0.5 mA see Table 2 PHI = 0 passive loop filter set pin 7 set pin 13 MSB of main divider ratio main divider ratio main divider ratio 0 0 1110; r = 1536 0 1 0 01 00111000 10000000; r = 80000 PRESET VALUE REGISTER NAME A October 1992 8 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications UMA1014 V CP handbook, full pagewidth f var UP on/off 1 mA (source) PHASE COMPARATOR f ref DOWN on/off 1 mA (sink) PCD PHI MRA399 Fig.3 Phase comparator block diagram. LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL VCC Vi Tstg Tamb HANDLING Every pin referenced to ground withstands ESD (HMB) tests in accordance with MIL-STD-883C method 3015 class 2. Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling Integrated Circuits. PARAMETER supply voltage range voltage range to ground (all pins) IC storage temperature range operating ambient temperature range 0 −55 −40 MIN. −0.3 MAX. 7.0 VCC +125 +85 V V °C °C UNIT October 1992 9 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications CHARACTERISTICS Tamb = 25 °C; VCC = 4.5 to 5.5 V; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. UMA1014 MAX. UNIT Supply (pins VCC and VCP) VCC ICC ICCpd VCP ICP ICPpd fRF VRF(rms) RI CI RRF fOSC VOSC(RMS) VOSC(p-p) tOSC_mk tOSC_sp ZOSC Rref IOL fPCD IPCD supply voltage range supply current supply current charge pump supply voltage charge pump supply current charge pump supply current IPCD = 0.5 mA power-down power-down 4.5 − − 4.5 − − − 11.5 2.5 − 1.4 0.01 − − − 200 600 2.0 − − − − − − − − − − 1.2 0.6 ±1 − 5.5 13.5 3.3 5.5 1.8 − V mA mA V mA mA RF dividers (pin RF) frequency range input voltage level (RMS value) input resistance input capacitance division ratios 50 to 100 MHz 100 to 1100 MHz at 1 GHz at 100 MHz note 1 50 150 50 − − − 2048 1100 200 150 − − − 262143 MHz mV mV Ω Ω pF − Oscillator and reference divider (pins OSCIN and OSCOUT) oscillator frequency range input level sine wave (RMS value) input level square wave (peak-to-peak value) input mark width input space width output impedance at pin OSCOUT reference division ratio see Table 1 VOL ≥ 0.6 V see Fig.8 3 0.15 0.45 10 31 − 128 16 VCC/2.8 VCC − − 2 1920 − MHz V V ns ns kΩ 1/8 crystal frequency (open collector output) (pin FX8) LOW level output current 1.0 mA Phase comparator (pin PCD) frequency range output current VPCD = 2.5 V bit IPCD = 1 bit IPCD = 0 IPCDL VPCD output leakage current output voltage 0.9 0.45 −5 0.4 1.4 0.75 +5 VCP−0.5 mA mA nA V 5 100 kHz October 1992 10 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications SYMBOL PARAMETER CONDITIONS MIN. − − − 3 −5 − − − − − − − TYP. UMA1014 MAX. UNIT Serial clock and serial data input (pins SCL and SDA) fCLK VIH VIL IIH IIL CI Isink VIH VIL IIH IIL IOL Notes 1. CI is in parallel with RI. 2. Pin VCOA is forced to logic 0 during out-of-lock condition. clock frequency HIGH level input voltage LOW level input voltage HIGH level input current LOW level input current input capacitance SDA sink current VOL = 0.4 V 0 3 − − −10 − 3 100 − 1.5 10 − 10 − − 0.4 0.1 − − kHz V V µA µA pF mA Slave address select input (pin SAA) and Hardware power-down input (pin HPDN) HIGH level input voltage LOW level input voltage HIGH level input current LOW level input current VOL ≥ 0.4 V 3 − − −10 V V µA µA µA VCO output switches (pins VCOA and VCOB) and synthesizer alarm (pin SYA); note2 LOW level sink current 400 MRA400 2.0 I (µA) 1.0 I PCD = 1 mA I PCD = 0.5 mA 0 -1.0 -2.0 -20 0 20 phase difference (t = ns) The current IPCD is averaged over a reference period of 24 µs. Fig.4 Gain of phase detector and charge pump. October 1992 11 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications UMA1014 UP or DOWN REF OOL VCOA MRA401 Fig.5 Out-of-lock function. 200 RF input (mV RMS) 100 guaranteed area of operation typical RF sensitivity o (Tamb = 25 C) 0 50 100 200 500 1000 1100 1200 MRA402 - 1 f RF (MHz) Fig.6 RF input high frequency sensitivity. October 1992 12 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications UMA1014 200 RF input (mV RMS) 150 guaranteed area 100 of operation 50 typical RF sensitivity (Tamb = 25 oC) 0 50 100 150 f RF (MHz) MRA403 - 1 200 Fig.7 RF input low frequency sensitivity. handbook, halfpage OSCIN t OSC mk t OSC sp MLA436 - 1 Fig.8 Oscillator input timing. October 1992 13 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications APPLICATION INFORMATION UMA1014 VCC G1 9.6 MHz C13 120 pF 1 C8 2-20 pF C12 68 pF 2 C11 39 pF VCP R7 68 Ω VCC R8 12 Ω 15 16 R10 10 k Ω + C9 3 14 47 µ F 4 C10 47 µ F 5 UMA 1014 12 VCC 10 k Ω 13 VCC 10 k Ω + low current LED VCC VCC V3 6 R9 3.9 k Ω 7 11 10 SDA R3 12 Ω 100 nF C5 47 µ F C6 1 nF R6 18 Ω 8 R11 56 Ω 9 SCL modulation input VOLTAGE CONTROLLED OSCILLATOR 870 to 910 MHz ETACS application for: VCO sensitivity = 11 MHz/V. Channel spacing = 12.5 kHz. October 1992 + R5 18 Ω C17 1 nF RF output R1 18 k Ω C3 180 nF R2 10 k Ω C2 2.2 nF MRA404 - 1 R4 18 Ω control voltage C1 33 nF Fig.9 Typical cellular mobile radio application. 14 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm UMA1014 SOT109-1 D E A X c y HE vMA Z 16 9 Q A2 A1 pin 1 index θ Lp 1 e bp 8 wM L detail X (A 3) A 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 θ 0.010 0.057 0.069 0.004 0.049 0.019 0.0100 0.39 0.014 0.0075 0.38 0.244 0.050 0.041 0.228 0.028 0.004 0.012 8 0o o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 October 1992 15 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values UMA1014 • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. This data sheet contains target or goal specifications for product development This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not from part of the specification. October 1992 16 Philips Semiconductors Product specification Low-power frequency synthesizer for mobile radio communications LIFE SUPPORT APPLICATIONS UMA1014 These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. October 1992 17