1845085

https://www.phoenixcontact.com/us/products/1845085 Printed-circuit board connector - DMC 0,5/ 8-G1-2,54 SMD R44 - 1845085 Please be informed that the data shown in this PDF Document is generated from our Online Catalog. Please find the complete data in the user's documentation. Our General Terms of Use for Downloads are valid (http://phoenixcontact.com/download) PCB header, nominal cross section: 0.5 mm², color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, type of contact: Male connector, number of potentials: 16, Number of rows: 2, Number of positions per row: 8, number of connections: 16, product range: DMC 0,5/..-G1-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin layout: Linear pad geometry, solder pin [P]: 2 mm, plug-in system: MICRO COMBICON DFMC 0,5, Pin connector pattern alignment: Standard, Locking: without, mounting: without, type of packaging: 44 mm wide tape, Sample values available under SAMPLE DMC... The figure shows a 10-pos. version with 20 contacts Your advantages  Gold-plated contacts ensure transfer quality remains stable over the long term  Designed for integration into the SMT soldering process  Conductor connection on several levels enables higher contact density  Integrated solder anchors reduce the mechanical strain on the soldering spots  Small component size for applications where space is at a premium  Supplied in tape-on-reel packing according to IEC 60286-3 for automated mounting Key Commercial Data Packing unit 1 pc Minimum order quantity 300 pc GTIN GTIN 4046356964623 Weight per Piece (excluding packing) 3.600 g Custom tariff number 85366930 Country of origin Poland Technical data Item properties Brief article description Feed-through header 05/23/2021   Page 1 / 8 https://www.phoenixcontact.com/us/products/1845085 Printed-circuit board connector - DMC 0,5/ 8-G1-2,54 SMD R44 - 1845085 Technical data Item properties Connector system MICRO COMBICON - DFMC 0,5 Type of contact Male connector Range of articles DMC 0,5/..-G1-SMD Pitch 2.54 mm Number of positions 8 Mounting type SMD soldering Pin layout Linear pad geometry Locking without Number of levels 2 Number of connections 16 Number of potentials 16 Pin connector pattern alignment Standard Electrical parameters Nominal current 6A Nom. voltage 160 V Rated voltage (III/3) 32 V Rated voltage (III/2) 160 V Rated voltage (II/2) 160 V Rated surge voltage (III/3) 2.5 kV Rated surge voltage (III/2) 2.5 kV Rated surge voltage (II/2) 2.5 kV Material data - contact Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/ JEDEC JESD 201 Contact material Cu alloy Surface characteristics Completely gold-plated Metal surface contact area (top layer) Gold (0.25 Au) Metal surface contact area (middle layer) Nickel (2 - 4 µm Ni) Metal surface soldering area (top layer) Gold (0.25 Au) Metal surface soldering area (middle layer) Nickel (2 - 4 µm Ni) Material data - housing Housing color black (9005) Insulating material LCP Insulating material group IIIa CTI according to IEC 60112 175 Flammability rating according to UL 94 V0 05/23/2021   Page 2 / 8 https://www.phoenixcontact.com/us/products/1845085 Printed-circuit board connector - DMC 0,5/ 8-G1-2,54 SMD R44 - 1845085 Technical data Dimensions for the product Caption Schematische Abbildung - weitere Details siehe Produktfamilienzeichnung im Download Center Length [ l ] 12.26 mm Width [ w ] 20.82 mm Height [ h ] 11.39 mm Pitch 2.54 mm Height (without solder pin) 9.39 mm Solder pin [P] 2 mm Pin spacing 2.54 mm Pin dimensions 0.64 x 0.64 mm Dimensions for PCB design Hole diameter 1.2 mm Pin spacing 2.54 mm Packaging information Type of packaging 44 mm wide tape Pieces per package 300 Denomination packing units Pcs. [W] tape width 44 mm [A] coil diameter 330 mm [W2] coil overall dimension 50.4 mm Outer packaging type Transparent-Bag ESD level (D) electrostatically conductive Specification DIN EN 61340-5-1 (VDE 0300-5-1): 2008-07 Processing notes Process Reflow soldering Specification Following IPC/JEDEC J-STD-020D.1:2008-03 Following IEC 60068-2-58:2005-02 Moisture Sensitive Level MSL 1 Classification temperature Tc 260 °C Solder cycles in the reflow 3 Ambient conditions Ambient temperature (storage/transport) -40 °C ... 70 °C Ambient temperature (assembly) -5 °C ... 100 °C Ambient temperature (operation) -40 °C ... 105 °C (dependent on the derating curve) Air clearances and creepage distances 05/23/2021   Page 3 / 8 https://www.phoenixcontact.com/us/products/1845085 Printed-circuit board connector - DMC 0,5/ 8-G1-2,54 SMD R44 - 1845085 Technical data Air clearances and creepage distances Clearances and creepage distances IEC 60664-1:2007-04 Specification IEC 60664-1:2007-04 Minimum clearance - inhomogeneous field (III/3) 1.5 mm Minimum clearance - inhomogeneous field (III/2) 1.5 mm Minimum clearance - inhomogeneous field (II/2) 1.5 mm Minimum creepage distance value (III/3) 1.3 mm Minimum creepage distance value (III/2) 1.6 mm Minimum creepage distance value (II/2) 1.6 mm Mechanical tests (A) Test specification IEC 61984 Insertion strength per pos. approx. 2N Withdraw strength per pos. approx. 1N Polarization when inserted requirement >20 N Test passed Contact holder in insert requirements >20 N Test passed Durability tests (B) Specification IEC 60512-9-1:2010-03 Contact resistance R1 2.8 mΩ Insertion/withdrawal cycles 100 Contact resistance R2 2.9 mΩ Impulse withstand voltage at sea level 2.95 kV Thermal tests (C) Specification IEC 60512-5-1:2002-02 Number of positions 16 Upper limiting temperature requirements