1953334

1953334

  • 厂商:

    PHOENIX(菲尼克斯)

  • 封装:

    -

  • 描述:

    TERM BLOCK HDR 30POS R/A 3.5MM

  • 详情介绍
  • 数据手册
  • 价格&库存
1953334 数据手册
https://www.phoenixcontact.com/us/products/1953334 Feed-through header - MCDN 1,5/15-G1-3,5 RNP14THR - 1953334 Please be informed that the data shown in this PDF Document is generated from our Online Catalog. Please find the complete data in the user's documentation. Our General Terms of Use for Downloads are valid (http://phoenixcontact.com/download) The figure shows a 10-pos. version with 20 contacts Your advantages  Designed for integration into the SMT soldering process  Intuitive locking mechanism prevents accidental disconnection  Conductor connection on several levels enables higher contact density Key Commercial Data Packing unit 1 pc Minimum order quantity 40 pc GTIN GTIN 4017918919016 Weight per Piece (excluding packing) 10.440 g Custom tariff number 85366930 Country of origin Germany Technical data Item properties Brief article description Feed-through header Connector system MINI COMBICON Type of contact Male connector Range of articles MCDN 1,5/..-G1-RN-THR 04/15/2021   Page 1 / 8 https://www.phoenixcontact.com/us/products/1953334 Feed-through header - MCDN 1,5/15-G1-3,5 RNP14THR - 1953334 Technical data Item properties Pitch 3.5 mm Number of positions 15 Mounting type THR soldering Pin layout Linear pinning Locking Engagement nose Number of levels 2 Number of connections 30 Number of potentials 30 Pin connector pattern alignment Standard Electrical parameters Nominal current 8A Nom. voltage 160 V Rated voltage (III/3) 160 V Rated voltage (III/2) 160 V Rated voltage (II/2) 250 V Rated surge voltage (III/3) 2.5 kV Rated surge voltage (III/2) 2.5 kV Rated surge voltage (II/2) 2.5 kV Material data - contact Note WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/ JEDEC JESD 201 Contact material Cu alloy Surface characteristics Tin-plated Metal surface contact area (top layer) Tin (3 - 5 µm Sn) Metal surface contact area (middle layer) Nickel (1 - 3 µm Ni) Metal surface soldering area (top layer) Tin (3 - 5 µm Sn) Metal surface soldering area (middle layer) Nickel (1 - 3 µm Ni) Material data - housing Housing color black (9005) Insulating material LCP Insulating material group IIIa CTI according to IEC 60112 175 Flammability rating according to UL 94 V0 Flange specifications Type of locking Snap-in locking Mounting flange Engagement nose 04/15/2021   Page 2 / 8 https://www.phoenixcontact.com/us/products/1953334 Feed-through header - MCDN 1,5/15-G1-3,5 RNP14THR - 1953334 Technical data Dimensions for the product Caption Schematische Abbildung - weitere Details siehe Produktfamilienzeichnung im Download Center Length [ l ] 13.3 mm Width [ w ] 56.2 mm Height [ h ] 16.6 mm Pitch 3.5 mm Height (without solder pin) 15.2 mm Solder pin [P] 1.4 mm Pin spacing 3.50 mm Pin dimensions 0.8 x 0.8 mm Dimensions for PCB design Hole diameter 1.4 mm Pin spacing 3.50 mm Packaging information Type of packaging packed in cardboard Pieces per package 40 Denomination packing units Pcs. General product information Type of note Details for soldering processes Note Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C Type of note Details for soldering processes Note Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C Processing notes Process Reflow/wave soldering Specification Following IPC/JEDEC J-STD-020E:2014-12 Following IEC 61760-1:2006-04 Follwing IEC 60068-2-58:2015-03 Moisture Sensitive Level MSL 1 Classification temperature Tc 260 °C Solder cycles in the reflow 3 Ambient conditions Ambient temperature (storage/transport) -40 °C ... 70 °C Ambient temperature (assembly) -5 °C ... 100 °C 04/15/2021   Page 3 / 8 https://www.phoenixcontact.com/us/products/1953334 Feed-through header - MCDN 1,5/15-G1-3,5 RNP14THR - 1953334 Technical data Ambient conditions Ambient temperature (operation) -40 °C ... 100 °C (dependent on the derating curve) Air clearances and creepage distances Clearances and creepage distances IEC 60664-1:2007-04 Specification IEC 60664-1:2007-04 Minimum clearance - inhomogeneous field (III/3) 1.5 mm Minimum clearance - inhomogeneous field (III/2) 1.5 mm Minimum clearance - inhomogeneous field (II/2) 1.5 mm Minimum creepage distance value (III/3) 2.5 mm Minimum creepage distance value (III/2) 1.6 mm Minimum creepage distance value (II/2) 2.5 mm Mechanical tests (A) Test specification IEC 61984 Insertion strength per pos. approx. 8N Withdraw strength per pos. approx. 6N Polarization when inserted requirement >20 N Test passed Contact holder in insert requirements >20 N Test passed Durability tests (B) Specification IEC 60512-9-1:2010-03 Contact resistance R1 2.1 mΩ Insertion/withdrawal cycles 25 Contact resistance R2 2.4 mΩ Impulse withstand voltage at sea level 2.95 kV Thermal tests (C) Specification IEC 60512-5-1:2002-02 Number of positions 20 Upper limiting temperature requirements 8-pos. = 1.4 04/15/2021   Page 5 / 8 https://www.phoenixcontact.com/us/products/1953334 Feed-through header - MCDN 1,5/15-G1-3,5 RNP14THR - 1953334 Dimensional drawing 29,6 1,4 3,5 a+4,4 15,2 1,4 16 13,3 2,2 3,5 a 9,3 Classifications eCl@ss eCl@ss 10.0.1 27440402 eCl@ss 11.0 27460201 eCl@ss 4.0 27260700 eCl@ss 4.1 27260700 eCl@ss 5.0 27260700 eCl@ss 5.1 27260700 eCl@ss 6.0 27260700 eCl@ss 7.0 27440402 eCl@ss 9.0 27440402 ETIM ETIM 3.0 EC001121 ETIM 4.0 EC002637 ETIM 6.0 EC002637 ETIM 7.0 EC002637 UNSPSC UNSPSC 6.01 30211810 UNSPSC 7.0901 39121409 UNSPSC 11 39121409 UNSPSC 12.01 39121409 UNSPSC 13.2 39121409 UNSPSC 18.0 39121409 UNSPSC 19.0 39121409 UNSPSC 20.0 39121409 UNSPSC 21.0 39121409 04/15/2021   Page 6 / 8 https://www.phoenixcontact.com/us/products/1953334 Feed-through header - MCDN 1,5/15-G1-3,5 RNP14THR - 1953334 Approvals Approvals Approvals VDE Gutachten mit Fertigungsüberwachung / IECEE CB Scheme / EAC / cULus Recognized Ex Approvals Approval details VDE Gutachten mit Fertigungsüberwachung    http://www2.vde.com/de/Institut/Online-Service/ VDE-gepruefteProdukte/Seiten/Online-Suche.aspx     Nominal voltage UN 160 V Nominal current IN 8A IECEE CB Scheme    http://www.iecee.org/     Nominal voltage UN 160 V Nominal current IN 8A  40011723  DE1-60987-B1B2 EAC      B.01687 cULus Recognized    http://database.ul.com/cgi-bin/XYV/template/LISEXT/1FRAME/index.htm  E60425-20110128   B D Nominal voltage UN 150 V 150 V Nominal current IN 8A 8A Accessories Accessories 04/15/2021   Page 7 / 8 https://www.phoenixcontact.com/us/products/1953334 Feed-through header - MCDN 1,5/15-G1-3,5 RNP14THR - 1953334 Accessories Coding element Coding profile - CP-MSTB - 1734634 Coding profile, is inserted into the slot on the plug or inverted header, red insulating material     Labeled terminal marker Marker card - SK 3,81/2,8:FORTL.ZAHLEN - 0804109 Marker card, Card, white, labeled, horizontal: consecutive numbers 1 ... 10, 11 ... 20, etc. up to 91 ... (99)100, mounting type: adhesive, for terminal block width: 3.81 mm, lettering field size: 3.81 x 2.8 mm     Phoenix Contact 2021 © - all rights reserved http://www.phoenixcontact.com 04/15/2021   Page 8 / 8
1953334
物料型号:文档中列出了多种物料型号,例如MCDN 1,5/2-G1-3,5 P14THR、MCDN 1,5/3-G1-3,5 P14THR等,这些型号代表不同配置的COMBICON双级连接器。

器件简介:COMBICON双级连接器适用于通孔回流工艺,具有最小化的PCB空间需求和高接触密度。设计用于SMT工艺的回流兼容组件,提供两种不同的引脚长度、水平或垂直插入方向,以及2至20个位置的版本。

引脚分配:文档中提供了不同型号的引脚分配信息,例如2个位置的引脚分配为3.5mm间距,7mm长度。

参数特性:使用了液晶聚合物(LCP)作为绝缘材料,具有在回流焊接过程中的高热稳定性,峰值温度可达260°C以上。还提供了额定电压、额定冲击电压、额定电流/截面积、最大负载电流/截面积等参数。

功能详解:COMBICON Select软件支持从PCB和外壳布局到订购流程的工作流程,包括系统化和快速选择产品、全面的互联网辅助工程以及易于使用的电子购物功能。

应用信息:COMBICON插头连接器只能在无负载条件下操作。如果由于操作原因需要切换较小的负载,可以提供实验值。

封装信息:提供了不同型号的封装尺寸信息,例如2位置的封装长度为7mm,20位置的封装长度为66.5mm。
1953334 价格&库存

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1953334
  •  国内价格 香港价格
  • 1+152.000611+19.67954
  • 10+123.5090410+15.99073

库存:11

1953334
  •  国内价格 香港价格
  • 40+83.5258640+10.81410

库存:0