PAP7501V

PAP7501V PAP7501V USB2.0 PC Camera Controller General Description The PAP7501V High-Speed USB2.0 Camera Controller is a highly integrated and cost-effective solution for USB2.0 PC-Camera based applications. It is fully compliant with USB Video Class 1.1 and USB audio class 1.0 standard.Internal controller can be power-up loaded from external EEPROM. This allows customization of VID, PID, product string, sensor parameters…etc. Features .USB Features USB 2.0 and 1.1 compliance(high speed and full speed transceiver). USB video class 1.1 compliance. USB audio class 1.0 compliance. Key Specification Supply Voltage Resolution Frame Rate System Clock 5.0V ± 10% Up to 640 (H) x 480 (V) Up to 30fps 12MHz 220oC 30~50sec with peak temperature 230~245oC All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 9 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 4.8 Handling precaution for the prevention of ESD Explained below are procedures that must be taken in fabrication to prevent the electrostatic destruction of semiconductor devices. The following basic rules must be obeyed. 1. Equalize potentials of terminals when transporting or storing. 2. Equalize the potentials of the electric device, work table, and operator's body that may come in contact with the IC's. 3. Prepare an environment that does not generate static electricity. One method is keeping relative humidity in the work room to about 50%. Operator 1. The operator should wear wrist straps. (Must maintain electric contact with bare skin) 2. Wear cotton or antistatic-treated materials clothes and gloves. 3. When a conductive mat will be used, must be ware conductive shoes. 4. Do not touch the IC's leads. Touch the body of IC's when holding. Equipment and tools 1. Any electrical equipments and tools located on the work table surface must be isolated from The work table surface, and ground the equipments and tools that are to be used. 2. Work table surface must be use conductive material or conductive mat. (Should be ground through a 1MΩ resistor) Transporting, storing and packing 1. Use conductive IC's tray, and conductive or shielding bag to store IC's. Soldering operation 1. Use a soldering iron with a grounding wire. 2. When perform manual soldering operation, the operator should wear wrist straps. 3. Do not use the desoldering pump when removing the IC's from the PCB board. Use a solder-wick or equivalent. All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 10 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 5. Reference Application Circuit 5.1 PAP7501 with PAS6311 I_HSYNC I_VSYNC I_PXCLK VDDAY VDDQ VDD33A_PLL_I VDDA VDDAY RESET U1 C3 0.1u D5 B5 C4 E5 E4 A2 CON1 R2 C9 4.7nF/250V VDD18K 8 9 USB_SHADING C12 I_PXCLK 5 4 3 2 1 GND33A_HSRT_O HC3 HC4 HC2 HC1 7 6 USB_SHADING C31 1u C10 10pF C11 10pF MINI USB 5P 10M SEN_SDA VDDAY S SEN_SCL C8 0.1u C7 4.7u + VDD5MV SEN_CSB VDDA VDD33A_HSRT_I C4 0.1u C30 0.1u C1 1u VDD33A_HSRT_I C2 1u VDDQ D3 D4 D2 C5 A5 E3 VDDQ PXCLK HSYNC VDDAY VSYNC VDDD R1 100k VDD33A_HSRT_O C5 1u VDD33A_PLL_I VDD33A_HSRT_O SEN_CLKE2 RESET E1 D1 I_PXD7 I_PXD6 A4 B4 A1 SY SCLK RESET VSSD PX9 PX8 PX0 PX7 PX6 CSB VDDA PAS6311LT VSSA SDA SCL PX1 PX5 PX4 PX3 C1 I_PXD1 VDDQ VDD33Q I_PXD5 I_PXD4 I_PXD3 I_PXD2 I_PXD0 C2 A3 B3 B2 B1 PX2 GND2 NC + +5V VDDA VDDAY S R3 1M Y 1 12MHz Note: xx_N_M=> No Mount R4 12k D+ DVDD33A_HSRT_O VDD33A_HSRT_I VDD33A_PLL_I OSC_OUT OSC_IN VDD5MV 37 VDD18K 20pF_N.M. C14 D+ DC13 C15 C16 22u 22u 0.1u VDD28A_MIC C17 C18 10u VCOM R5 0.01u + C19 C20 1u VDD33A_PGA R6 R8 2.2k 10k C21 1u VDD33A_ADC X1 + C22 C23 2.2u 2.2u C32 MICROPHONE R9 VDD33A_ADC 2.2k VSSQ WP R10 100k 100k VDD33Q VDD33Q C24 R12 1uF 300k RSTN SEN_CSB 10 11 12 9 C33 0.47uF_N.M. 0.47uF_N.M. VDD33A_PGA VSSA 7 8 10k VCOM MIC_P MIC_N 4 5 6 R7 VDD28A_MIC 3 5.1k 22u 1 VCOM VDD5MA 2 GND33A_PLL_I VDD5MA VDD28A_MIC VCOM MIC_P MIC_N VDD33A_PGA VSSA VDD33A_ADC VSSQ RSTN SEN_CSB + VDD28A_MIC SEN_CLK + + 20pF_N.M. VSSV USB_5V 48 47 46 45 44 43 42 41 40 39 VDD33A_HSRT_O XSCO VDD33A_PLL_I GND33A_HSRT_I VDD33A_HSRT_I VDD18K RREF VSSQ DP DM XSCI 38 U2 VSSQ VDDAY S VDD5MD I_PXCLK I_PXD0 I_PXD1 PAP7501_48P I_PXD2 I_PXD3 I_PXD4 I_PXD5 I_PXD6 I_PXD7 EPR_SCK 36 35 34 33 32 31 30 29 28 27 26 25 VDDAY S VDD5MD I_PXCLK I_PXD0 I_PXD1 I_PXD2 I_PXD3 I_PXD4 I_PXD5 I_PXD6 I_PXD7 EPR_SCK EPR_HOLD R11 EPR_CSB SEN_SDA SEN_CLK SEN_SCL I_HSYNC I_VSYNC EPR_SO 23 EPR_SO VDD33Q VDD18K VDD33Q R13 GPIO_4 C25 20pF_N.M. R17 1K 1 25F512A 13 14 15 16 17 18 19 20 21 22 SEN_SDA VDD33Q GPIO_4 VDD18K LED-0603 USB_5V VDD5MV VDD5MD VDD5MA VDD5MV C28 L1 1 L2 1 L4 1 1uF_N.M. VDD5MD C34 3.3u 2 3.3u 2 1uF_N.M. 2 SEN_CSB U4 KEY C6 1u R14 R15 10k 10k L3 VDD33Q VDD33Q 3.3uH VSSA 3.3u 2 1uF_N.M. C26 C27 10u 0.1u VDD5MA C35 + GPIO_4 VDD33Q R16 100k C29 1u All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. EPR_SI D1_Green KEY I_HSYNC EPR_CSB SEN_CLK SEN_SCL I_VSYNC 24 EPR_SI KEY EPR_CSB 100k EPR_SO WP GND 1 2 3 4 CS VCC SO HOLD WP SCK GND SI 8 7 6 5 VDD33Q EPR_HOLD EPR_SCK EPR_SI VDD33Q U3 11 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008 PixArt Imaging Inc. PAP7501V USB2.0 Camera 6. Update History Version V1.0 V1.1 Update Creation, Preliminary 1st version Update circuit and Package information, Add C30~C35, R17, D1, Change R5 to 5.1k ohm, R6 and R9 Change to 2.2k ohm Date 01/17/2008 05/06/2008 All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission. 12 PixArt Imaging Inc. E-mail: fae_service@PixArt.com.tw V1.1 May. 2008