P650-02XC

P LL650-02 L ow EMI Network LAN Clock F EATURES • • • • • • • • • • • P IN CONFIGURATION VDD XIN XOUT/50MHz_OE*^ GND VDD 50MHz/FS0*^ GND 50MHz/FS1*^ 50MHz/FS2* T FS3 T 50MHz/SS0* T VDD 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 VDD VDD 25MHz/100MHz GND SDRAMx2 GND SDRAMx2 VDD VDD 25MHz/125MHz GND 25MHz/125MHz Full CMOS output swing with 40-mA output drive capability. 25-mA output drive at TTL level. Advanced, low power, sub-micron CMOS processes. 25MHz fundamental crystal or clock input. 4 outputs at 50MHz, 2 outputs selectable at 25MHz or 125MHz, 1 output selectable at 25MHz or 100MHz. 2 SDRAM selectable frequencies of 66.6, 75, 83.3, 100MHz (Double Drive Strength). All non SDRAM outputs can be disabled (tri-state) Spread spectrum technology selectable for EMI reduction from ±0.5%, ±0.75% for SDRAM and 100MHz output. Zero PPM synthesis error in all clocks. Ideal for Network switches. 3.3V operation. Available in 24-Pin 150mil SSOP. Note: SDRAMx2: Double Drive strength. T: Tri-Level input ^: Internal pull-up resistor. *: Bi-directional pin (input value is latched upon power-up). PLL650-02 D ESCRIPTIONS The PLL 650-02 is a low cost, low jitter, and high performance clock synthesizer. With PhaseLink’s proprietary analog Phase Locked Loop techniques, the chip accepts 25 MHz crystal, and produces multiple output clocks for networking chips, PCI devices, SDRAM, and ASICs, with double drive strength for its SDRAM outputs. FREQUENCY TABLE F S1 0 0 1 1 FS0 0 1 0 1 SDRAM 100MHzSST 7 5MHz S ST 83.3MHzSST 66.6MHzSST FS3 0 M 1 Pin 13, 15 Disable 1 25MHz 25MHz FS2 0 M 1 Pin 22 25MHz Disable 100MHzSST FS(2:3): Tri-level inputs. SST: SST modulation applied (see selection table) B LOCK DIAGRAM 4 XIN XOUT XTAL OSC 50MHz (can be disabled) 25MHz/125MHz (can be disabled) SDRAM (66.6, 75, 83.3, 100MHz) 2 Control Logic FS (0:3) 2 1 25MHz/100MHz (can be disabled) 4 7745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 w ww.phaselink.com R ev 09/03/04 Page 1 P LL650-02 L ow EMI Network LAN Clock P IN DESCRIPTIONS Name X IN X OUT/50MHz_OE 5 0MHz/FS(0:2) 50MHz/SS0 F S3 2 5MHz/125MHz S DRAMx2 2 5MHz/100MHz V DD G ND Number 2 3 6,8,9,11 10 13,15 18,20 22 1,5,12, 16,17,23,24 4,7,14,19,21 Type I B B I O O O P P Description 25MHz fundamental crystal input (20pF C L p arallel resonant). C L h ave been integrated into the chip. No external C L c apacitor is required. Crystal connection pin. At power-up, this pin latches 50MHz_OE (output enable selector for all 50MHz outputs. Disabled when 50MHz_OE is logical zero. Has 120k Ω i nternal pull up resistor. Bi-directional pins. 50MHz outputs. These pins latch FS(0:2) and SS0 at power-up. 60k Ω i nternal pull up resistors on pins 6 and 8. Tri-level input pin. FS3 input put. 25MHz (reference) or 125MHz outputs. Can be disabled with FS3 = 1. SDRAM outputs with double drive strength determined by FS(0:1) value. 25MHz (reference) or 100MHz output. Can be disabled with FS2 = M. 3.3V power supply. Ground. S PREAD SPECTRUM SELECTION TABLE S S0 0 M 1 SST modulation ± 0.75% center O FF ± 0.5% center F UNCTIONAL DESCRIPTION S electable spread spectrum and output frequencies The PLL650-02 provides selectable spread spectrum modulation and selectable output frequencies. Selection is made by connecting specific pins to a logical “zero” or “one”, or by leaving them not connected (tri-level inputs or internal pull-up) according to the frequency and spread spectrum selection tables shown on pages 1 and 2 respectively. In order to reduce pin usage, the PLL650-02 uses tri-level input pins. These pins allow 3 levels for input selection: namely, 0 (Connect to GND), 1 (Connect to VDD), M (Do not connect). Thus, unlike the two-level selection pins, the tri-level input pins are in the “M” (mid) state when not connected. In order to connect a tri-level pin to a logical “zero”, the pin must be connected to GND. Likewise, in order to connect to a logical “one” the pin must be connected to VDD. Pin 3 (XOUT/50MHz_OE) is a bi-directional pin used to disable the 50MHz output pins. Pin 6 (FS0) and pin 8 (FS1) are bidirectional pins used to select the SDRAM output frequency upon power-up. Pin 9 (FS2) and pin 11 (FS3) are tri-level bidirectional pins used to select the output frequency of pins 13, 15 and 22, as shown in the frequency table on page 1. After the input signals have been latched, pins 6, 8, 9, and 11 serve as 50 MHz frequency outputs. 4 7745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 w ww.phaselink.com R ev 09/03/04 Page 2 P LL650-02 L ow EMI Network LAN Clock C onnecting a bi-directional pin A bi-directional pin serves as input upon power-up, and as output as soon as the inputs have been latched. The value of the input is latched-in upon power-up. Depending on the pin (see pin description), the input can be tri-level or a standard two-level. Unlike unidirectional pins, bi-directional pins cannot be connected directly to GND or VDD in order to set the input to "0" or "1", since the pin also needs to serve as output. In the case of two level input pins, an internal pull-up resistor is present. This allows a default value to be set when no external pull down resistor is connected between the pin and GND (by definition, a tri-level input has a the default value of "M" (mid) if it is not connected). In order to connect a bi-directional pin to a non-default value, the input must be connected to GND or VDD through an external pull-down/pull-up resistor. Note: when the output load presents a low impedance in comparison to the internal pull-up resistor, the internal pull-up resistor may not be sufficient to pull the input up to a logical “one”, and an external pull-up resistor may be required. For bi-directional inputs, the external loading resistor between the pin and GND has to be sufficiently small (compared to the internal pull-up resistor) so that the pin voltage be pulled below 0.8V (logical “zero”). In order to avoid loading effects when the pin serves as output, the value of the external pull-down resistor should however be kept as large as possible. In general, it is recommended to use an external resistor of around one sixth to one quarter of the internal pull-up resistor (see Application Diagram). Note: when the output is used to drive a load presenting an small resistance between the output pin and VDD, this resistance is in essence connected in parallel to the internal pull-up resistor. In such a case, the external pull-down resistor may have to be dimensioned smaller to guarantee that the pin voltage will be low enough achieve the desired logical “zero”. This is particularly true when driving 74FXX TTL components. A PPLICATION DIAGRAM Internal to chip VDD External Circuitry Rup Power Up Reset R RB Output EN Bi-directional pin Clock Load Latched Input Latch RUP/4 Jumper options NOTE: Rup=120k Ω for 50MHz/OE (Pin3); Rup=60k Ω for FS(0:1). R starts from 1 to 0 while RB starts from 0 to 1. 4 7745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 w ww.phaselink.com R ev 09/03/04 Page 3 P LL650-02 L ow EMI Network LAN Clock E lectrical Specifications 1 . Absolute Maximum Ratings P ARAMETERS S upply Voltage I nput Voltage, dc O utput Voltage, dc S torage Temperature A mbient Operating Temperature* J unction Temperature L ead Temperature (soldering, 10s) E SD Protection, Human Body Model SYMBOL V DD VI VO TS TA TJ MIN. - 0.5 - 0.5 - 65 - 40 MAX. 4 .6 V DD +0.5 V DD +0.5 150 85 1 25 260 2 UNITS V V V °C °C °C °C kV Exposure of the device under conditions beyond the limits specified by Maximum Ratings for extended periods may cause permanent damage to the device and affect product reliability. These conditions represent a stress rating only, and functional operations of the device at these or any other conditions above the operational limits noted in this specification is not implied. * Note: Operating Temperature is guaranteed by design for all parts (COMMERCIAL and INDUSTRIAL), but tested for COMMERCIAL grade only. 2 . AC Specifications P ARAMETERS I nput Frequency O utput Rise Time O utput Fall Time D uty Cycle* M ax. Absolute Jitter M ax. Jitter, cycle to cycle 0.8V to 2.0V with no load 2.0V to 0.8V with no load At V DD / 2 Short term 45 50 ± 150 80 CONDITIONS MIN. 10 TYP. 25 MAX. 27 1.5 1.5 55 UNITS MHz ns ns % ps ps * : in case SDRAM output is selected to be 83.3MHz, the duty cycle of output pin 22 will be 40%-60% if its output frequency is selected to be 100MHz (FS2=1). In all other situations, pin 22 will also have a 50%-50% typical duty cycle. 4 7745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 w ww.phaselink.com R ev 09/03/04 Page 4 P LL650-02 L ow EMI Network LAN Clock 3 . DC Specifications P ARAMETERS O perating Voltage I nput High Voltage I nput Low Voltage I nput High Voltage I nput Low Voltage I nput High Voltage I nput Low Voltage O utput High Voltage O utput Low Voltage O utput High Voltage At CMOS Level O perating Supply Current S hort-circuit Current N ominal output current* N ominal output current* I nternal pull-up resistor I nternal pull-up resistor SYMBOL V DD V IH V IL V IH V IL V IH V IL V OH V OL V OH I DD IS I out I out R up R up CONDITIONS MIN. 2 .97 TYP. V DD / 2 V DD / 2 MAX. 3.63 V DD / 2 - 1 0.5 UNITS V V V V V V V V V V F or all Tri-level input F or all Tri-level input F or all normal input F or all normal input I OH = - 25mA I OL = 2 5mA I OH = - 8mA N o Load V DD - 0.5 2 0.8 2.4 0.4 V DD - 0.4 35 ± 100 mA mA mA mA kΩ kΩ C MOS output level T TL output level P ins 6,8 P in 3 35 20 40 25 60 120 *: SDRAM output strengths are doubled (i.e. min. CMOS level is 70mA, typ. CMOS level is 80mA) 4 7745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 w ww.phaselink.com R ev 09/03/04 Page 5 P LL650-02 L ow EMI Network LAN Clock P ACKAGE INFORMATION 0.230 - 0.244 5.842 - 6.1976 0.150 - 0.157 3.810 - 3.988 0.008 - 0.012 0.203 - 0.305 0.015 (0.381) 0.0075 - 0.0098 (0.19 - 0.25) 45 0 0.025 0.635 0.055 - 0.061 (1.397 - 1.549) 0.337 - 0.344 (8.560 - 8.738) 0.061 - 0.068 (1.549 - 1.727) 30-60 0.050 (1.27) 0.004 - 0.0098 (0.10 - 0.25) MIN 24PIN SSOP O RDERING INFORMATION For part ordering, please contact our Sales Department: 47745 Fremont Blvd., Fremont, CA 94538, USA Tel: (510) 492-0990 Fax: (510) 492-0991 P ART NUMBER The order number for this device is a combination of the following: Device number, Package type and Operating temperature range P LL650-02 X C P ART NUMBER T EMPERATURE C=COMMERCIAL I=INDUSTRAL P ACKAGE TYPE X=SSOP O rder Number PLL650-02XC-R PLL650-02XC Marking P650-02XC P650-02XC Package Option SSOP - Tape and Reel SSOP - Tube P haseLink Corporation, reserves the right to make changes in its products or specifications, or both at any time without notice. The information furnished by Phaselink is believed to be accurate and reliable. However, PhaseLink makes no guarantee or warranty concerning the accuracy of said information and shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon this product. L IFE SUPPORT POLICY : PhaseLink’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of PhaseLink Corporation. 4 7745 Fremont Blvd., Fremont, California 94538 Tel (510) 492-0990 Fax (510) 492-0991 w ww.phaselink.com R ev 09/03/04 Page 6