• RoHS lead-free solder and lead-solder-exempted
products are available
• Delivers up to 20 A (100 W)
• Extended input range 9.6 V – 14 V
• High efficiency (0.94 at 5 V output)
• Surface-mount package
• Industry-standard footprint and pinout
• Small size and low profile: 1.30” x 0.53” x 0.314”
(33.02 x 13.46 x 7.98 mm)
• Weight: 0.22 oz [6.12 g]
• Coplanarity less than 0.003”, maximum
• Synchronous Buck Converter topology
• Source and sink capable
• Start-up into pre-biased output
• No minimum load required
• Programmable output voltage via external resistor
• Operating ambient temperature: -40 °C to 85 °C
• Remote output sense
• Remote ON/OFF (Positive or Negative)
• Fixed-frequency operation
• Auto-reset output overcurrent protection
• Auto-reset overtemperature protection
• High reliability, MTBF = TBD Million Hours
• All materials meet UL94, V-0 flammability rating
• Approved to the latest edition and amendment of ITE
Safety standards, UL/CSA 60950-1 and IEC60950-1
Bel Power Solutions point-of-load converters are
recommended for use with regulated bus converters in an
Intermediate Bus Architecture (IBA). The YNC12S20 nonisolated DC-DC converter delivers up to 20 A of output
current in an industry-standard surface-mount package.
Operating from a 9.6 to 14 VDC input, the YNC12S20
converter is an ideal choice for Intermediate Bus
Architectures where point-of-load power delivery is generally
a requirement. It provides a resistor-programmable
regulated output voltage of 0.7525V to 5.5V.
The Y-Series converters provide exceptional thermal
performance, even in high temperature environments with
minimal airflow. This is accomplished through the use of
circuit, packaging and processing techniques to achieve
ultra-high efficiency, excellent thermal management and a
very low body profile.
The low body profile and the preclusion of heat sinks
minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use
of 100% automation for assembly, coupled with advanced
power electronics and thermal design, results in a product
with extremely high reliability.
▪
▪
▪
▪
▪
Intermediate Bus Architectures
Telecommunications
Data Communications
Distributed Power Architectures
Servers, Workstations
▪
▪
▪
▪
▪
High Efficiency – no heat sink required
Reduces Total Solution Board Area
Tape and Reel Packing
Compatible with Pick & Place Equipment
Minimizes Part Numbers in Inventory
North America
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Asia-Pacific
+86 755 29885888
Europe, Middle East
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BCD.00700_AA
1. ELECTRICAL SPECIFICATIONS
Conditions: TA = 25ºC, Airflow = 200 LFM (1 m/s), Vin = 12 VDC, Vout = 0.7525 - 5.5 V, unless otherwise specified.
PARAMETER
NOTES
MIN
Continuous
TYP
MAX
UNITS
Absolute Maximum Ratings
Input Voltage
-0.3
15
VDC
Operating Ambient Temperature
-40
85
°C
Storage Temperature
-55
125
°C
5.5
VDC
0.5
VDC
Feature Characteristics
Switching Frequency
Output Voltage Programming Range 1
300
By external resistor, See Trim Table 1
0.7525
Remote Sense Compensation1
kHz
Turn-On Delay Time
Full resistive load
With Vin = (Module Enabled, then Vin applied)
From Vin = Vin(min) to Vo=0.1* Vo(nom)
3
ms
With Enable (Vin = Vin(nom) applied, then enabled)
From enable to Vo= 0.1*Vo(nom)
3
ms
Rise time
From 10% to 90%, full resistive load
4
ON/OFF Control (Positive Logic) 2
ON/OFF Control (Negative Logic) 2
ms
Module Off
-5
0.8
VDC
Module On
2.4
VIN
VDC
Module Off
2.4
VIN
VDC
Module On
-5
0.8
VDC
14
VDC
Input Characteristics
Operating Input Voltage Range
Input Under Voltage Lockout
Maximum Input Current
9.6
9
VDC
Turn-off Threshold
8.5
VDC
20 ADC Out @ 9.6 VDC In
VOUT = 5.0 VDC
11.1
ADC
VOUT = 3.3 VDC
7.6
ADC
VOUT = 2.5 VDC
5.9
ADC
VOUT = 2.0 VDC
4.8
ADC
VOUT = 1.8 VDC
4.4
ADC
VOUT = 1.5 VDC
3.8
ADC
VOUT = 1.2 VDC
3.1
ADC
VOUT = 1.0 VDC
2.7
ADC
VOUT = 0.7525 VDC
2.2
ADC
Input Stand-by Current (Module disabled)
Input No Load Current (Module enabled)
12
Turn-on Threshold
5
mA
VOUT = 5.0 VDC
80
mA
VOUT = 3.3 VDC
62
mA
VOUT = 2.5 VDC
52
mA
VOUT = 2.0 VDC
47
mA
VOUT = 1.8 VDC
45
mA
VOUT = 1.5 VDC
43
mA
VOUT = 1.2 VDC
41
mA
VOUT = 1.0 VDC
39
mA
VOUT = 0.7525 VDC
Input Reflected-Ripple Current - is
See Fig. F for setup. (BW=20 MHz)
Input Voltage Ripple Rejection
120 Hz
35
mA
TBD
mAP-P
72
dB
Notes:
1
2
3
The output voltage should not exceed 5.5V (taking into account both the programming and remote sense compensation).
Converter is on if ON/OFF pin is left open.
Note that start-up time is the sum of turn-on delay time and rise time.
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PARAMETER
NOTES
MIN
TYP
MAX
UNITS
-1.5
Vout
+1.5
%Vout
Output Characteristics
Output Voltage Set Point (no load)
Output Regulation
Over Line
Full resistive load
2
mV
Over Load
10
mV
Output Ripple and Noise - 20MHz bandwidth (Fig. F)
From no load to full load
Overall operating input voltage, resistive
load and temperature conditions until end of
life.
Over line, load and temperature
Peak-to-Peak
VOUT = 0.7525 VDC
Peak-to-Peak
VOUT = 5.0 VDC
External Load Capacitance
Plus full load (resistive)
Output Voltage Range
+2.5
%Vout
10
15
mVP-P
35
50
mVP-P
Min ESR > 1mΩ
1000
μF
Min ESR > 10 mΩ
5000
μF
20
A
Output Current Range
-2.5
0
Output Current Limit Inception (I OUT)
Output Short-Circuit Current , RMS Value
26
A
6
A
Co = 100μF ceramic + 470 μF POS
140
mV
45
µs
Co = 100 μF ceramic + 470 μF POS
140
mV
45
µs
VOUT = 5.0 VDC
94
%
VOUT = 3.3 VDC
91
%
VOUT = 2.5 VDC
89
%
VOUT = 2.0 VDC
87
%
VOUT = 1.8 VDC
86
%
VOUT = 1.5 VDC
84
%
VOUT = 1.2 VDC
81.5
%
78
%
73.5
%
Short=10 mΩ, continuous
Dynamic Response
Load current change from 10A – 20A, di/dt = 5 A/μS
Settling Time (VOUT < 10% peak deviation)
Unloading current change 20A – 10A, di/dt = -5 A/μS
Settling Time (VOUT < 10% peak deviation)
Efficiency
Full Load (20a)
VOUT = 1.0 VDC
VOUT = 0.7525 VDC
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2. OPERATIONS
2.1. INPUT AND OUTPUT IMPEDANCE
The Y-Series converter should be connected via a low impedance to the DC power source. In many applications, the
inductance associated with the distribution from the power source to the input of the converter can affect the stability
of the converter. It is recommended to use decoupling capacitors in order to ensure stability of the converter and reduce
input ripple voltage. The converter has an internal input capacitance of 40 μF with very low ESR (ceramic capacitors).
In a typical application, low - ESR tantalum or POS capacitors will be sufficient to provide adequate ripple voltage
filtering at the input of the converter. However, very low ESR ceramic capacitors 47μF-100 μF are recommended at the
input of the converter in order to minimize the input ripple voltage. They should be placed as close as possible to the
input pins of the converter.
YNC12S20 has been designed for stable operation with or without external capacitance. Low ESR ceramic capacitors
placed as close as possible to the load (Min 47 μF) are recommended for improved transient performance and lower
output voltage ripple.
It is important to keep low resistance and low inductance PCB traces for connecting load to the output pins of the
converter in order to maintain good load regulation.
2.2. ON/OFF (PIN 1)
The ON/OFF pin is used to turn the power converter on or off remotely via a system signal. There are two remote
control options available, positive logic (standard option) and negative logic, and both are referenced to GND. Typical
connections are shown in Fig. A.
The positive logic version turns the converter on when the ON/OFF pin is at a logic high or left open, and turns the
converter off when at a logic low or shorted to GND.
TM
Vin
R*
Nex -c Series
Converter
SENSE
(Top View)
ON/OFF
Vout
Vin
Rload
GND
TRIM
CONTROL
INPUT
R* is for negative logic option only
Fig. A: Circuit configuration for ON/OFF function.
The negative logic version turns the converter on when the ON/OFF pin is at logic low or left open, and turns the
converter off when the ON/OFF pin is at a logic high or connected to Vin.
ON/OFF pin is internally pulled-up to Vin for a positive logic version, and pulled-down for a negative logic version. A
TTL or CMOS logic gate, open collector (open drain) transistor can be used to drive ON/OFF pin. When using open
collector (open drain) transistor with a negative logic option, add a pull-up resistor (R*) of 75 kΩ to Vin as shown in Fig.
A; This device must be capable of:
-
sinking up to 0.2 mA at a low level voltage of 0.8 V
sourcing up to 0.25 mA at a high logic level of 2.3V – 5V
sourcing up to 0.75 mA when connected to Vin.
2.3. REMOTE SENSE (PIN 2)
The remote sense feature of the converter compensates for voltage drops occurring only between Vout pin (Pin 4) of
the converter and the load. The SENSE (Pin 2) pin should be connected at the load or at the point where regulation is
required (see Fig. B). There is no sense feature on the output GND return pin, where a solid ground plane is
recommended to provide low voltage drop.
If remote sensing is not required, the SENSE pin must be connected to the Vout pin (Pin 4) to ensure the converter will
regulate at the specified output voltage. If these connections are not made, the converter will deliver an output voltage
that is slightly higher than the specified value.
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TM
Vin
Nex -c Series
Converter
SENSE
(Top View)
Rw
ON/OFF
Vout
GND
TRIM
Vin
Rload
Rw
Fig. B: Remote sense circuit configuration.
Because the sense lead carries minimal current, large traces on the end-user board are not required. However, sense
traces should be located close to a ground plane to minimize system noise and ensure optimum performance.
When utilizing the remote sense feature, care must be taken not to exceed the maximum allowable output power
capability of the converter, equal to the product of the nominal output voltage and the allowable output current for the
given conditions.
When using remote sense, the output voltage at the converter can be increased up to 0.5V above the nominal rating in
order to maintain the required voltage across the load. Therefore, the designer must, if necessary, decrease the
maximum current (originally obtained from the derating curves) by the same percentage to ensure the converter’s actual
output power remains at or below the maximum allowable output power.
2.4. OUTPUT VOLTAGE PROGRAMMING (PIN 3)
The output voltage can be programmed from 0.7525V to 5.5V by connecting an external resistor between TRIM pin (Pin
3) and GND pin (Pin 5); see Fig. C.
A trim resistor, RTRIM, for a desired output voltage can be calculated using the following equation:
RTRIM =
10.5
−1
(VO -REQ - 0.7525)
[k]
where,
RTRIM = Required value of trim resistor [k]
VO−REQ = Desired (trimmed) output voltage [V]
TM
Vin
Nex -c Series
Converter
SENSE
(Top View)
ON/OFF
Vout
Vin
Rload
GND
TRIM
RTRIM
Fig. C: Configuration for programming output voltage.
Note that the tolerance of a trim resistor directly affects the output voltage tolerance. It is recommended to use standard
1% or 0.5% resistors; for tighter tolerance, two resistors in parallel are recommended rather than one standard value
from Table 1.
The ground pin of the trim resistor should be connected directly to the converter GND pin (Pin 5) with no voltage drop
in between. Table 1 provides the trim resistor values for popular output voltages.
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V0-REG [V]
RTRIM [kΩ]
0.7525
1.0
1.2
1.5
1.8
2.0
2.5
3.3
5.0
5.5
open
41.2
22.46
13.0
9.0
7.4
5.0
3.12
1.47
1.21
The Closest Standard
Value [kΩ]
41.2
22.6
13.0
9.09
7.32
4.99
3.09
1.47
1.21
Table 1: Trim Resistor Value
The output voltage can be also programmed by external voltage source. To make trimming less sensitive, a series
external resistor Rext is recommended between the TRIM pin and the programming voltage source. Control Voltage
can be calculated by the formula:
VCTRL = 0.7 −
(1 + REXT )(VO-REQ - 0.7525)
15
[V]
where,
VCTRL = Control voltage [V]
REXT = External resistor between TRIM pin and voltage source; the value can be chosen depending on the required
output voltage range [k].
Control voltages with REXT = 0 and REXT = 15k are shown in Table 2.
V0-REG [V]
VCTRL (REXT = 0)
VCTRL(REXT = 15k)
0.7525
0.700
0.700
1.0
0.684
0.436
1.2
0.670
0.223
1.5
0.650
-0.097
1.8
0.630
-0.417
2.0
0.617
-0.631
2.5
0.584
-1.164
3.3
0.530
-2.017
5.0
0.417
-3.831
5.5
0.384
-4.364
Table 2: Control Voltage [VDC]
3. PROTECTION FEATURES
3.1. INPUT UNDERVOLTAGE LOCKOUT
Input undervoltage lockout is standard with this converter. The converter will shut down when the input voltage drops
below a pre-determined voltage; it will start automatically when Vin returns to a specified range.
The input voltage must be at least 9.6V (typically 9V) for the converter to turn on. Once the converter has been turned
on, it will shut off when the input voltage drops below typically 8.5V.
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3.2. OUTPUT OVERCURRENT PROTECTION (OCP)
The converter is protected against overcurrent and short-circuit conditions. Upon sensing an over-current condition
(see Fig. D), the converter will enter hiccup mode. Once the overload or short circuit condition is removed, Vout will
return to nominal value.
Fig. D: Output short circuit current (10 A/div) (RLOAD= 10 mOhm) for Vout = 5.0 V Time scale:
1 ms/div.; Bottom trace: Zoomed current with time scale 0.1 ms/div.
3.3. OVERTEMPERATURE PROTECTION (OTP)
The converter will shut down under an overtemperature condition to protect itself from overheating caused by operation
outside the thermal derating curves, or operation in abnormal conditions such as system fan failure. After the converter
has cooled to a safe operating temperature, it will automatically restart.
3.4. SAFETY REQUIREMENTS
The converter meets North American and International safety regulatory requirements per UL60950 and EN60950. The
maximum DC voltage between any two pins is Vin under all operating conditions. Therefore, the unit has ELV (extra low
voltage) output; it meets SELV requirements under the condition that all input voltages are ELV.
The converter is not internally fused. To comply with safety agencies requirements, a recognized fuse with a maximum
rating of 20 Amps must be used in series with the input line.
4. CHARACTERIZATION
4.1. GENERAL INFORMATION
The converter has been characterized for many operational aspects, to include thermal derating (maximum load current
as a function of ambient temperature and airflow) for vertical and horizontal mounting, efficiency, start-up and shutdown
parameters, output ripple and noise, transient response to load step-change, overload, and short circuit.
The figures are numbered as Fig. x.y, where x indicates the different output voltages, and y associates with specific
plots (y = 1 for the vertical thermal derating, …). For example, Fig. x.1 will refer to the vertical thermal derating for all
the output voltages in general.
The following pages contain specific plots or waveforms associated with the converter. Additional comments for
specific data are provided below.
4.2. TEST CONDITIONS
All thermal and efficiency data presented were taken with the converter soldered to a test board, specifically a 0.060”
thick printed wiring board (PWB) with four layers. The top and bottom layers were not metalized. The two inner layers,
comprising two-ounce copper, were used to provide traces for connectivity to the converter.
The lack of metalization on the outer layers as well as the limited thermal connection ensured that heat transfer from
the converter to the PWB was minimized. This provides a worst-case but consistent scenario for thermal derating
purposes.
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All measurements requiring airflow were made in vertical and horizontal wind tunnel facilities using Infrared (IR)
thermography and thermocouples for thermometry.
Ensuring components on the converter do not exceed their ratings is important to maintaining high reliability. If one
anticipates operating the converter at or close to the maximum loads specified in the derating curves, it is prudent to
check actual operating temperatures in the application. Thermographic imaging is preferable; if this capability is not
available, then thermocouples may be used. It is recommended to use AWG #40 gauge thermocouples to ensure
measurement accuracy. Careful routing of the thermocouple leads will further minimize measurement error. Refer to
Fig. E for optimum measuring thermocouple location.
4.3. THERMAL DERATING
Load current vs. ambient temperature and airflow rates are given in Figs. x.1 for maximum temperature of 120 °C.
Ambient temperature was varied between 25 °C and 85 °C, with airflow rates from 30 to 500 LFM (0.15m/s to 2.5 m/s),
and vertical converter mounting. The airflow during the testing is parallel to the short axis of the converter, going from
pin 1 and pin 6 to pins 2 – 5.
For each set of conditions, the maximum load current was defined as the lowest of:
(i) The output current at which either any MOSFET temperature did not exceed a maximum specified temperature
(120°C) as indicated by the thermographic image, or
(ii) The maximum current rating of the converter (20 A)
During normal operation, derating curves with maximum FET temperature less than or equal to 120 °C should not be
exceeded. Temperature on the PCB at the thermocouple location shown in Fig. E should not exceed 120 °C in order to
operate inside the derating curves.
Fig. E: Location of the thermocouple for thermal testing.
4.4. EFFICIENCY
Figure x.2 shows the efficiency vs. load current plot for ambient temperature of 25 ºC, airflow rate of 200 LFM (1 m/s)
and input voltages of 9.6 V, 12 V, and 14 V.
4.5. POWER DISSIPATION
Fig. x.3 shows the power dissipation vs. load current plot for Ta = 25 ºC, airflow rate of 200 LFM (1 m/s) with vertical
mounting and input voltages of 9.6 V, 12 V, and 14 V.
4.6. RIPPLE AND NOISE
The output voltage ripple waveform is measured at full rated load current. Note that all output voltage waveforms are
measured across a 1 F ceramic capacitor.
The output voltage ripple and input reflected ripple current waveforms are obtained using the test setup. See Figure F.
iS
1 H
source
inductance
Vsource
TM
Nex -c Series
CIN
4x47F
ceramic
capacitor
DC/DC
Converter
1F
ceramic
capacitor
CO
100F
ceramic
capacitor
Vout
Fig. F: Test setup for measuring input reflected ripple currents, is and output voltage ripple.
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25
Load Current [Adc]
20
15
500 LFM (2.5 m/s)
400 LFM (2.0 m/s)
300 LFM (1.5 m/s)
200 LFM (1.0 m/s)
100 LFM (0.5 m/s)
30 LFM (0.15 m/s)
10
5
0
20
30
40
50
60
70
80
90
Ambient Temperature [°C]
1.00
10
0.95
8
Power Dissipation [W]
Efficiency
Fig. 5.0V.1: Available load current vs. ambient temperature and airflow rates for Vout = 5.0 V converter mounted vertically
with Vin = 12 V, and maximum MOSFET temperature 120 C.
0.90
0.85
14 V
12 V
9.6 V
0.80
6
4
14 V
12 V
9.6 V
2
0.75
0
0
4
8
12
16
20
Load Current [Adc]
24
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 5.0V.2: Efficiency vs. load current and input voltage for
Vout = 5.0 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 5.0V.3: Power loss vs. load current and input voltage for
Vout = 5.0 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 5.0V.4: Turn-on transient for Vout = 5.0 V with
application of Vin at full rated load current (resistive) and 100
μF external capacitance at Vin = 12 V. Top trace: Vin (10
V/div.); Bottom trace: output voltage (1 V/div.);
Time scale: 2 ms/div.
Fig. 5.0V.5: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
100 μF ceramic + 1 μF ceramic and Vin = 12 V for
Vout = 5.0 V. Time scale: 2 μs/div.
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Fig. 5.0V.6: Output voltage response for Vout = 5.0 V to
positive load current step change from 10 A to 20 A with
slew rate of 5 A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
Fig. 5.0V.7: Output voltage response for Vout = 5.0 V to
negative load current step change from 20 A to
10 A with slew rate of -5 A/μs at Vin = 12 V. Top trace:
output voltage (200 mV/div.); Bottom trace: load current
(5 A/div.). Co = 100 μF ceramic. Time scale: 20 μs/div.
25
Load Current [Adc]
20
15
500 LFM (2.5 m/s)
400 LFM (2.0 m/s)
300 LFM (1.5 m/s)
200 LFM (1.0 m/s)
100 LFM (0.5 m/s)
30 LFM (0.15 m/s)
10
5
0
20
30
40
50
60
70
80
90
Ambient Temperature [°C]
1.00
10
0.95
8
Power Dissipation [W]
Efficiency
Fig. 3.3V.1: Available load current vs. ambient temperature and airflow rates for Vout = 3.3 V converter mounted vertically with Vin =
12 V, and maximum MOSFET temperature 120 C.
0.90
0.85
14 V
12 V
9.6 V
0.80
6
4
14 V
12 V
9.6 V
2
0.75
0
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 3.3V.2: Efficiency vs. load current and input voltage for
Vout = 3.3 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 3.3V.3: Power loss vs. load current and input voltage for
Vout = 3.3 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
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Fig. 3.3V.4: Turn-on transient for Vout = 3.3 V with
application of Vin at full rated load current (resistive) and 100
μF external capacitance at Vin = 12 V. Top trace: Vin (10
V/div.); Bottom trace: output voltage (1 V/div.);
Time scale: 2 ms/div.
Fig. 3.3V.5: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
100 μF ceramic + 1 μF ceramic and Vin = 12 V for
Vout = 3.3 V. Time scale: 2 μs/div.
Fig. 3.3V.6: Output voltage response for Vout = 3.3 V to
positive load current step change from 10 A to 20 A with
slew rate of 5 A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
Fig. 3.3V.7: Output voltage response for Vout = 3.3 V to
negative load current step change from 20 A to
10 A with slew rate of -5A/μs at Vin = 12 V. Top trace: output
voltage (200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
25
Load Current [Adc]
20
15
500 LFM (2.5 m/s)
400 LFM (2.0 m/s)
300 LFM (1.5 m/s)
200 LFM (1.0 m/s)
100 LFM (0.5 m/s)
30 LFM (0.15 m/s)
10
5
0
20
30
40
50
60
70
80
90
Ambient Temperature [°C]
Fig. 2.5V.1: Available load current vs. ambient temperature and airflow rates for Vout = 2.5 V converter mounted vertically with Vin =
12 V, and maximum MOSFET temperature 120 C.
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10
0.95
8
Power Dissipation [W]
Efficiency
1.00
0.90
0.85
14 V
12 V
9.6 V
0.80
6
4
14 V
12 V
9.6 V
2
0.75
0
0
5
10
15
20
Load Current [Adc]
25
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 2.5V.2: Efficiency vs. load current and input voltage for
Vout = 2.5 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 2.5V.3: Power loss vs. load current and input voltage for
Vout = 2.5 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 2.5V.4: Turn-on transient for Vout = 2.5 V with
application of Vin at full rated load current (resistive) and 100
μF external capacitance at Vin = 12V. Top trace: Vin (10
V/div.); Bottom trace: output voltage (1 V/div.);
Time scale: 2 ms/div.
Fig. 2.5V.5: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
100 μF ceramic + 1 μF ceramic and Vin = 12 V for
Vout = 2.5 V. Time scale: 2 μs/div.
Fig. 2.5V.6: Output voltage response for Vout = 2.5 V to
positive load current step change from 10 A to 20 A with
slew rate of 5A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.). Co = 100
μF ceramic. Time scale: 20 μs/div.
Fig. 2.5V.7: Output voltage response for Vout = 2.5 V to
negative load current step change from 20 A to
10 A with slew rate of -5A/μs at Vin = 12 V. Top trace: output
voltage (200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
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BCD.00700_AA
25
Load Current [Adc]
20
15
500 LFM (2.5 m/s)
400 LFM (2.0 m/s)
300 LFM (1.5 m/s)
200 LFM (1.0 m/s)
100 LFM (0.5 m/s)
30 LFM (0.15 m/s)
10
5
0
20
30
40
50
60
70
80
90
Ambient Temperature [°C]
Fig. 2.0V.1: Available load current vs. ambient temperature and airflow rates for Vout = 2.0 V converter mounted vertically with Vin =
12 V, and maximum MOSFET temperature 120 C.
1.00
8
Power Dissipation [W]
Efficiency
0.95
0.90
0.85
14 V
12 V
9.6 V
0.80
0.75
6
4
14 V
12 V
9.6 V
2
0
0
4
8
12
16
20
Load Current [Adc]
24
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 2.0V.2: Efficiency vs. load current and input voltage for
Vout = 2.0 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 2.0V.3: Power loss vs. load current and input voltage for
Vout = 2.0 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 2.0V.4: Turn-on transient for Vout = 2.0 V with
application of Vin at full rated load current (resistive) and 100
μF external capacitance at Vin = 12 V. Top trace: Vin (10
V/div.); Bottom trace: output voltage (1 V/div.); Time scale: 2
ms/div.
Fig. 2.0V.5: Output voltage ripple (20mV/div.) at full rated
load current into a resistive load with external capacitance
100 μF ceramic + 1 μF ceramic and Vin = 12 V for Vout = 2.0
V. Time scale: 2 μs/div.
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BCD.00700_AA
Fig. 2.0V.6: Output voltage response for Vout = 2.0 V to
positive load current step change from 10 A to 20 A with
slew rate of 5 A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.). Co = 100
μF ceramic. Time scale: 20 μs/div.
Fig. 2.0V.7: Output voltage response for Vout = 2.0 V to
negative load current step change from 20 A to
10 A with slew rate of -5A/μs at Vin = 12 V. Top trace: output
voltage (200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
25
Load Current [Adc]
20
15
500 LFM (2.5 m/s)
400 LFM (2.0 m/s)
300 LFM (1.5 m/s)
200 LFM (1.0 m/s)
100 LFM (0.5 m/s)
30 LFM (0.15 m/s)
10
5
0
20
30
40
50
60
70
80
90
Ambient Temperature [°C]
Fig. 1.8V.1: Available load current vs. ambient temperature and airflow rates for Vout = 1.8 V converter mounted vertically
with Vin = 12 V, and maximum MOSFET temperature 120 C.
0.95
8
Power Dissipation [W]
Efficiency
0.90
0.85
0.80
14 V
12 V
9.6 V
0.75
0.70
6
4
14 V
12 V
9.6 V
2
0
0
4
8
12
16
20
Load Current [Adc]
Fig. 1.8V.2: Efficiency vs. load current and input voltage for
Vout = 1.8 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
24
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 1.8V.3: Power loss vs. load current and input voltage for
Vout = 1.8 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
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BCD.00700_AA
Fig. 1.8V.4: Turn-on transient for Vout = 1.8 V with
application of Vin at full rated load current (resistive) and 100
μF external capacitance at Vin = 12 V. Top trace: Vin (10
V/div.); Bottom trace: output voltage (1 V/div.); Time scale: 2
ms/div.
Fig. 1.8V.5: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
100 μF ceramic + 1 μF ceramic and Vin = 12 V for Vout = 1.8
V. Time scale: 2 μs/div.
Fig. 1.8V.6: Output voltage response for Vout = 1.8 V to
positive load current step change from 10 A to 20 A with
slew rate of 5 A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
Fig. 1.8V.7: Output voltage response for Vout = 1.8 V to
negative load current step change from 20 A to 10 A with
slew rate of -5 A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
25
Load Current [Adc]
20
15
500 LFM (2.5 m/s)
400 LFM (2.0 m/s)
300 LFM (1.5 m/s)
200 LFM (1.0 m/s)
100 LFM (0.5 m/s)
30 LFM (0.15 m/s)
10
5
0
20
30
40
50
60
70
80
90
Ambient Temperature [°C]
Fig. 1.5V.1: Available load current vs. ambient temperature and airflow rates for Vout = 1.5 V converter mounted vertically
with Vin = 12 V, air flowing and maximum MOSFET temperature 120 C.
+1 866 513 2839
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© 2015 Bel Power Solutions, Inc.
BCD.00700_AA
0.95
8
Power Dissipation [W]
Efficiency
0.90
0.85
0.80
14 V
12 V
9.6 V
0.75
0.70
6
4
14 V
12 V
9.6 V
2
0
0
4
8
12
16
20
Load Current [Adc]
24
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 1.5V.2: Efficiency vs. load current and input voltage for
Vout = 1.5 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 1.5V.3: Power loss vs. load current and input voltage for
Vout = 1.5V converter mounted vertically with air flowing at a
rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 1.5V.4: Turn-on transient for Vout = 1.5 V with
application of Vin at full rated load current (resistive) and 100
μF external capacitance at Vin = 12 V. Top trace: Vin (10
V/div.); Bottom trace: output voltage (1 V/div.);
Time scale: 2 ms/div.
Fig. 1.5V.5: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
100 μF ceramic + 1 μF ceramic and Vin = 12 V for
Vout = 1.5 V. Time scale: 2 μs/div.
Fig. 1.5V.6: Output voltage response for Vout = 1.5 V to
positive load current step change from 10 A to 20 A with
slew rate of 5 A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.). Co = 100
μF ceramic. Time scale: 20 μs/div.
Fig. 1.5V.7: Output voltage response for Vout = 1.5 V to
negative load current step change from 20 A to
10 A with slew rate of -5 A/μs at Vin = 12 V. Top trace:
output voltage (200 mV/div.); Bottom trace: load current (5
A/div.). Co = 100 μF ceramic. Time scale: 20 μs/div.
+1 866 513 2839
tech.support@psbel.com
© 2015 Bel Power Solutions, Inc.
BCD.00700_AA
25
Load Current [Adc]
20
15
500 LFM (2.5 m/s)
400 LFM (2.0 m/s)
300 LFM (1.5 m/s)
200 LFM (1.0 m/s)
100 LFM (0.5 m/s)
30 LFM (0.15 m/s)
10
5
0
20
30
40
50
60
70
80
90
Ambient Temperature [°C]
Fig. 1.2V.1: Available load current vs. ambient temperature and airflow rates for Vout = 1.2 V converter mounted vertically with Vin =
12 V, and maximum MOSFET temperature 120 C.
0.95
8
Power Dissipation [W]
Efficiency
0.90
0.85
0.80
14 V
12 V
9.6 V
0.75
6
4
14 V
12 V
9.6 V
2
0
0.70
0
4
8
12
16
20
Load Current [Adc]
24
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 1.2V.2: Efficiency vs. load current and input voltage for
Vout = 1.2 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 1.2V.3: Power loss vs. load current and input voltage for
Vout = 1.2 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 1.2V.4: Turn-on transient for Vout = 1.2 V with
application of Vin at full rated load current (resistive) and 100
μF external capacitance at Vin = 12 V. Top trace: Vin (10
V/div.); Bottom trace: output voltage (1 V/div.);
Time scale: 2 ms/div.
Fig. 1.2V.5: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
100 μF ceramic + 1 μF ceramic and Vin = 12 V for
Vout = 1.2 V. Time scale: 2 μs/div.
+1 866 513 2839
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© 2015 Bel Power Solutions, Inc.
BCD.00700_AA
Fig. 1.2V.6: Output voltage response for Vout = 1.2 V to
positive load current step change from 10 A to 20 A with
slew rate of 5 A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.). Co = 100
μF ceramic. Time scale: 20 μs/div.
Fig. 1.2V.7: Output voltage response for Vout = 1.2 V to
negative load current step change from 20 A to 108 A with
slew rate of -5 A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.). Co = 100
μF ceramic. Time scale: 20 μs/div.
25
Load Current [Adc]
20
15
500 LFM (2.5 m/s)
400 LFM (2.0 m/s)
300 LFM (1.5 m/s)
200 LFM (1.0 m/s)
100 LFM (0.5 m/s)
30 LFM (0.15 m/s)
10
5
0
20
30
40
50
60
70
80
90
Ambient Temperature [°C]
Fig. 1.0V.1: Available load current vs. ambient temperature and airflow rates for Vout = 1.0 V converter mounted vertically
with Vin = 12 V, and maximum MOSFET temperature 120 C.
0.90
8
Power Dissipation [W]
0.85
Efficiency
0.80
0.75
0.70
14 V
12 V
9.6 V
6
4
14 V
12 V
9.6 V
2
0.65
0.60
0
0
4
8
12
16
20
Load Current [Adc]
Fig. 1.0V.2: Efficiency vs. load current and input voltage for
Vout = 1.0 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
24
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 1.0V.3: Power loss vs. load current and input voltage for
Vout = 1.0 V converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 C.
+1 866 513 2839
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© 2015 Bel Power Solutions, Inc.
BCD.00700_AA
Fig. 1.0V.4: Turn-on transient for Vout = 1.0 V with
application of Vin at full rated load current (resistive) and 100
μF external capacitance at Vin = 12 V. Top trace: Vin (10
V/div.); Bottom trace: output voltage (1 V/div.);
Time scale: 2 ms/div.
Fig. 1.0V.5: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
100 μF ceramic + 1 μF ceramic and Vin = 12 V for
Vout = 1.0 V. Time scale: 2 μs/div.
Fig. 1.0V.6: Output voltage response for Vout = 1.0 V to
positive load current step change from 10 A to 20 A with
slew rate of 5A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
Fig. 1.0V.7: Output voltage response for Vout = 1.0 V to
negative load current step change from 20 A to
10 A with slew rate of -5A/μs at Vin = 12 V. Top trace: output
voltage (200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
25
Load Current [Adc]
20
15
500 LFM (2.5 m/s)
400 LFM (2.0 m/s)
300 LFM (1.5 m/s)
200 LFM (1.0 m/s)
100 LFM (0.5 m/s)
30 LFM (0.15 m/s)
10
5
0
20
30
40
50
60
70
80
90
Ambient Temperature [°C]
Fig. 0.7525V.1: Available load current vs. ambient temperature and airflow rates for Vout = 1.0 V converter mounted vertically with
Vin = 12 V, and maximum MOSFET temperature 120 C.
+1 866 513 2839
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© 2015 Bel Power Solutions, Inc.
BCD.00700_AA
0.85
8
Power Dissipation [W]
Efficiency
0.80
0.75
0.70
14 V
12 V
9.6 V
0.65
0.60
6
4
14 V
12 V
9.6 V
2
0
0
4
8
12
16
20
Load Current [Adc]
24
0
4
8
12
16
20
24
Load Current [Adc]
Fig. 0.7525V.2: Efficiency vs. load current and input voltage
for Vout = 0.7525V converter mounted vertically with air
flowing at a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 0.7525V.3: Power loss vs. load current and input voltage
for Vout = 0.7525V converter mounted vertically with air
flowing at a rate of 200 LFM (1 m/s) and Ta = 25 C.
Fig. 0.7525V.4: Turn-on transient for Vout = 0.7525 V with
application of Vin at full rated load current (resistive) and 100
μF external capacitance at Vin = 12 V. Top trace: Vin (10
V/div.); Bottom trace: output voltage (1 V/div.);
Time scale: 2 ms/div.
Fig. 0.7525V.5: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
100 μF ceramic + 1 μF ceramic and Vin = 12 V for
Vout = 0.7525V. Time scale: 2 μs/div.
Fig. 0.7525V.6: Output voltage response for Vout = 0.7525 V
to positive load current step change from
10 A to 20 A with slew rate of 5A/μs at Vin = 12 V. Top trace:
output voltage (200 mV/div.); Bottom trace: load current
(5 A/div.). Co = 100 μF ceramic. Time scale: 20 μs/div.
Fig. 0.7525V.7: Output voltage response for Vout = 0.7525 V
to negative load current step change from 20 A to 10 A with
slew rate of -5 A/μs at Vin = 12 V. Top trace: output voltage
(200 mV/div.); Bottom trace: load current (5 A/div.).
Co = 100 μF ceramic. Time scale: 20 μs/div.
+1 866 513 2839
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© 2015 Bel Power Solutions, Inc.
BCD.00700_AA
5. PHYSICAL INFORMATION
PAD/PIN CONNECTIONS
3
2
4
Pad/Pin #
Function
1
2
3
4
5
6
ON/OFF
SENSE
TRIM
Vout
GND
Vin
5
1(*)
6
TOP VIEW
(*) PIN # 1 ROTATED 90°
SIDE VIEW
YNC12S20 Platform Notes
•
•
•
•
•
•
YNC12S20 Pinout (Surface Mount)
All dimensions are in inches [mm]
Connector Material: Copper
Connector Finish: Gold over Nickel
Module Weight: 0.22 oz [6.12 g]
Module Height: 0.327” Max., 0.301” Min.
Recommended Surface-Mount Pads:
Min. 0.080” X 0.112” [2.03 x 2.84]
6. ORDERING INFORMATION
PRODUC
T SERIES
INPUT
VOLTAGE
MOUNTING
SCHEME
RATED LOAD
CURRENT
YNC
12
S
20
ENABLE LOGIC
–
0
0 Standard
(Positive Logic)
Y-Series
9.6 – 14 VDC
S Surface-Mount
20 A
(0.7525 V to 5.5 V)
ROHS COMPATIBLE
D Opposite of
Standard
(Negative Logic)
No Suffix RoHS
lead-solder-exempt
compliant
G RoHS compliant
for all six substances
The example above describes P/N YNC12S20-0S1G: 9.6V – 14V input, surface mount, 20A at 0.7525V to 5.5V output, standard
enable logic, 25A for 300µs during start up capability, and RoHS lead solder exemption compliant. Please consult factory regarding
availability of a specific version.
NUCLEAR AND MEDICAL APPLICATIONS - Products are not designed or intended for use as critical components in life support
systems, equipment used in hazardous environments, or nuclear control systems.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may chan ge
depending on the date manufactured. Specifications are subject to change without notice.
+1 866 513 2839
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© 2015 Bel Power Solutions, Inc.
BCD.00700_AA
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