The YNL05S100xy non-isolated DC-DC converters deliver up
to 10 A of output current in an industry-standard surfacemount package. Operating from a 3.0 to 5.5 VDC input, the
YNL05S100xy converters are ideal choices for Intermediate
Bus Architectures where Point-of-Load (POL) power delivery
is generally a requirement. The converters are available in
individual output voltage versions, allowing coverage of the
output voltage range from 0.9 to 3.3 VDC. Each version is
capable of providing an extremely tight, highly regulated and
trimmable output.
RoHS lead-free solder and lead-solder-exempted
products are available
Delivers up to 10 A (33 W)
No derating up to 85 ° C
Surface-mount package
Industry-standard footprint and pinout
Small size and low profile: 1.30” x 0.53” x 0.314”
(33.02 x 13.46 x 7.98 mm)
Weight: 0.22 oz [6.12 g]
Co-planarity less than 0.003”, maximum
Synchronous Buck Converter topology
Start-up into pre-biased output
No minimum load required
Programmable output voltage via external resistor
Operating ambient temperature: -40 ° C to 85 ° C
Remote output sense
Remote ON/OFF (positive or negative)
Fixed-frequency operation
Auto-reset output overcurrent protection
Auto-reset overtemperature protection
High reliability, MTBF = 32.54 million hours calculated
per Telcordia TR-332, Method I Case 1
All materials meet UL94, V-0 flammability rating
UL60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN60950
The YNL05S100xy converters provide exceptional thermal
performance, even in high temperature environments with no
airflow. No derating is required up to 85 ° C , without airflow
at natural convection. This performance is accomplished
through the use of advanced circuitry, packaging, and
processing techniques to achieve a design possessing ultrahigh efficiency, excellent thermal management, and a very lowbody profile.
The low-body profile and the preclusion of heat sinks minimize
impedance to system airflow, thus enhancing cooling for both
upstream and downstream devices. The use of 100%
automation for assembly, coupled with advanced power
electronics and thermal design, results in a product with
extremely high reliability.
Intermediate Bus Architectures
Telecommunications
Telecommunications
Distributed Power Architectures
Servers, workstations
High efficiency – no heat sink required
Reduces total solution board area
Tape and reel packing
Compatible with pick & place equipment
North America
+1-866.513.2839
Asia-Pacific
+86.755.29885888
Europe, Middle East
+353 61 225 977
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Conditions: TA = 25 º C, Airflow = 300 LFM (1.5 m/s), Vin = 5 VDC, Vout = 0.9 – 3.3 VDC, unless otherwise specified.
Parameter
Notes
Min
Typ
Max
Unit
Absolute Maximum Ratings
Input Voltage
Continuous
-0.3
6
VDC
Operating Ambient Temperature
-40
85
°C
Storage Temperature
-55
125
°C
350
kHz
%
Feature Characteristics
Switching Frequency
Output Voltage Trim
Range1
Full Temperature Range
250
300
See Trim equation
-10
+10
Vout = 0.9 VDC
-5
+10
%
0.5
VDC
Remote Sense Compensation1
Percent of VOUT(NOM)
Turn-On Delay Time2
Full resistive load
With Vin (Converter Enabled, then Vin applied)
From Vin = Vin(min) to Vo = 0.1*
Vo(nom)
3
3.5
4.5
mS
With Enable (Vin = Vin(nom) applied, then enabled)
From enable to Vo = 0.1*Vo(nom)
3
3.5
4.5
mS
Rise time2
From 0.1*Vo(nom) to 0.9*Vo(nom)
3
3.5
5
mS
ON/OFF Control (Positive
Logic)3
Converter Off
-5
0.8
VDC
Converter On
2.4
5.5
VDC
Converter Off
2.4
5.5
VDC
Converter On
-5
0.8
VDC
ON/OFF Control (Negative Logic) 3
Input Characteristics
VOUT = 0.9 – 2.5 VDC
3.0
5.0
5.5
VDC
VOUT > 2.5 VDC
4.5
5.0
5.5
VDC
Turn-on Threshold
Guaranteed by controller
1.95
2.05
2.15
VDC
Turn-off Threshold
Guaranteed by controller
1.73
1.9
2.07
VDC
Operating Input Voltage Range
Input Undervoltage Lockout
Maximum Input Current
VIN = 4.5 VDC, IOUT = 10 A
VOUT = 3.3 VDC
7.9
ADC
VIN = 3.0 VDC, IOUT = 10 A
VOUT = 2.5 VDC
9.1
ADC
VIN = 3.0 VDC, IOUT = 10 A
VOUT = 2.0 VDC
7.3
ADC
VIN = 3.0 VDC, IOUT = 10 A
VOUT = 1.8 VDC
6.7
ADC
VIN = 3.0 VDC, IOUT = 10 A
VOUT = 1.5 VDC
5.7
ADC
VIN = 3.0 VDC, IOUT = 10 A
VOUT = 1.2 VDC
4.7
ADC
VIN = 3.0 VDC, IOUT = 10 A
VOUT = 1.0 VDC
4.0
ADC
VIN = 3.0 VDC, IOUT = 10 A
VOUT = 0.9 VDC
3.6
ADC
Input Standby Current (Converter disabled)
Vin = 5.0 VDC
Input No Load Current (Converter enabled)
Vin = 5.5 VDC
10
mA
VOUT = 3.3 VDC
90
mA
VOUT = 2.5 VDC
90
mA
VOUT = 2.0 VDC
80
mA
VOUT = 1.8 VDC
75
mA
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Input Reflected-Ripple Current - is
VOUT = 1.5 VDC
70
mA
VOUT = 1.2 VDC
65
mA
VOUT = 1.0 VDC
60
mA
VOUT = 0.9 VDC
50
mA
See Fig. H for setup (BW = 20 MHz)
15
mAP-P
Output Characteristics
Output Voltage Set Point (no load)
Output
-1.5
Vout
+1.5
%Vout
0.1
0.5
%Vout
0.1
0.5
%Vout
+3
%Vout
Regulation4
Over Line
Full resistive load
Over Load
From no load to full load
Output Voltage Accuracy (Over all operating input
voltage, resistive load and temperature conditions until
end of life )
Output Ripple and Noise – 20 MHz bandwidth
Over line, load and temperature (Fig. H)
-3
Peak-to-Peak
VOUT = 3.3 VDC
30
50
mVP-P
Peak-to-Peak
VOUT = 0.9 VDC
15
30
mVP-P
External Load Capacitance
Plus full load (resistive)
Min ESR > 1 mΩ
1,000
μF
Min ESR > 10 mΩ
5,000
μF
10
A
Output Current Range
0
Output Current Limit Inception (IOUT)
18
A
3
Arms
110
mV
25
µs
120
mV
25
µs
VOUT = 3.3 VDC
94.5
%
VOUT = 2.5 VDC
93.0
%
VOUT = 2.0 VDC
92.0
%
VOUT = 1.8 VDC
91.5
%
VOUT = 1.5 VDC
89.5
%
VOUT = 1.2 VDC
87.5
%
VOUT = 1.0 VDC
86.0
%
VOUT = 0.9 VDC
84.5
%
Short = 10 mΩ, continuous
Output Short-Circuit Current (Hiccup mode)
Dynamic Response
50% Load current change from 5 A -10 A with
di/dt = 5 A/μs4
Settling Time (VOUT < 10% peak deviation)4
Co = 47 μF tant. + 1 μF ceramic
4
50% Load current change from 5 A -10 A with di
Co = 47 μF tant. + 1 μF ceramic
Settling Time (VOUT < 10% peak deviation)4
Efficiency
Full load (10 A)
Additional Notes:
1The output voltage should not exceed 3.63 V (taking into account both the trimming and remote sense compensation).
2Note that startup time is the sum of turn-on delay time and rise time.
3The converter is on if ON/OFF pin is left open.
4See waveforms for dynamic response and settling time for different output voltages
The Y-Series converter should be connected via a low impedance to the DC power source. In many applications,
the inductance associated with the distribution from the power source to the input of the converter can affect the
stability of the converter. The use of decoupling capacitors is recommended in order to ensure stability of the converter
and reduce input ripple voltage. Internally, the converter has 52 μF (low ESR ceramics) of input capacitance.
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In a typical application, low-ESR tantalum or POS capacitors will be sufficient to provide adequate ripple voltage
filtering at the input of the converter. However, very low ESR ceramic capacitors 100-200 μF are recommended at the
input of the converter in order to minimize the input ripple voltage. They should be placed as close as possible to the
input pins of the converter.
The YNL05S100xy has been designed for stable operation with or without external capacitance. Low ESR ceramic
capacitors placed as close as possible to the load (minimum 47 μF) are recommended for improved transient
performance and lower output voltage ripple.
It is important to keep low resistance and low inductance PCB traces for connecting load to the output pins of the
converter in order to maintain good load regulation.
Fig. A shows the input voltage ripple for various output voltages using four 47 μF input ceramic capacitors. The same plot
is shown in Fig. B with one 470 μF polymer capacitor (6TPB470M from Sanyo) in parallel with two 47 μF ceramic
capacitors at full load.
Vin Ripple [mV]
Fig. A: Input Voltage Ripple, CIN = 4 x 47 μF ceramic, full load.
Vin Ripple [mV]
Fig. B: Input Voltage Ripple, CIN = 470 μF polymer + 2 x 47 μF Ceramic
The ON/OFF pin is used to turn the power converter on or off remotely via a system signal. There are two remote control
options available, positive logic (standard option) and negative logic, with ON/OFF signal referenced to GND. The
typical connections are shown in Fig. C.
Fig. C: Circuit Configuration for ON/OFF Function
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To turn the converter on the ON/OFF pin should be at a logic low or left open, and to turn the converter off the ON/OFF
pin should be at a logic high or connected to Vin. See the Electrical Specifications for logic high/low definitions.
The positive logic version turns the converter on when the ON/OFF pin is at a logic high or left open, and turns the
converter off when at a logic low or shorted to GND.
The negative logic version turns the converter on when the ON/OFF pin is at logic low or left open, and turns the
converter off when the ON/OFF pin is at a logic high or connected to Vin.
The ON/OFF pin is internally pulled up to Vin for positive logic version, and pulled down for a negative logic version.
A TTL or CMOS logic gate, open-collector (open-drain) transistor can be used to drive ON/OFF pin. This device must be
capable of:
–
sinking up to 1.2 mA at a low level voltage of 0.8 V
–
sourcing up to 0.25 mA at a high logic level of 2.3 - 5.5 V.
When using open-collector (open-drain) transistor with a negative logic option, add a pull-up resistor (R*) to Vin as
shown in Fig. C:
–
20 K, if the minimum Vin is 4.5 V
–
10 K, if the minimum Vin is 3.0 V
5 K, if the undervoltage shutdown at 2.05 - 2.15 V is required.
The remote sense feature of the converter compensates for voltage drops occurring only between Vout pin (Pin 4) of
the converter and the load. The SENSE (Pin 2) pin should be connected at the load or at the point where regulation is
required (see Fig. D). There is no sense feature on the output GND return pin, where the solid ground plane should provide
a low voltage drop.
Fig. D: Remote Sense Circuit Configuration
The option without SENSE pin is available; see the Part Numbering Scheme section for the ordering information.
However, if remote sensing is not required, the SENSE pin must be connected to the Vout pin (Pin 4) to ensure the
converter will regulate at the specified output voltage. If these connections are not made, the converter will deliver an
output voltage that is slightly higher than the specified value.
Because the sense lead carries minimal current, large traces on the end-user board are not required. However, the sense
trace should be located close to a ground plane to minimize system noise and ensure optimum performance.
When utilizing the remote sense feature, care must be taken not to exceed the maximum allowable output power
capability of the converter, which is equal to the product of the nominal output voltage and the allowable output
current for the given conditions.
When using remote sense, the output voltage at the converter can be increased up to 0.5 V above the nominal rating
in order to maintain the required voltage across the load. Therefore, the designer must, if necessary, decrease the
maximum current (originally obtained from the derating curves) by the same percentage to ensure the converter’s
actual output power remains at or below the maximum allowable output power.
The output voltage can be adjusted up 10% or down 10% of its nominal output rating using an external resistor. The
converter without Trim feature is also available; see the Part Numbering Scheme section for the ordering information.
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Fig. E: Configuration for Increasing Output Voltage
To trim up the output voltage, refer to Fig. E.A trim resistor, RT-INCR, should be connected between TRIM pin (Pin 3) and
GND pin (Pin 5) with value of:
For VO-NOM ≥ 1.2 V,
RTDECR =(𝐕𝐎−𝐑𝐄𝐐24.08
– RINT
− 𝐕𝐎−𝐍𝐎𝐌)
[kΩ]
For VO-NOM = 1.0 V and 0.9 V,
RTDECR =（𝐕𝐎−𝐑𝐄𝐐21.07
- RINT
− 𝐕𝐎−𝐍𝐎𝐌）
[kΩ]
Where,
RTDECR = Required value of trim-up resistor [kΩ]
VOREQ = Desired (trimmed) output voltage [V]
VONOM = Nominal output voltage [V]
RINT = Internal series resistor according to Table 1 [kΩ]
Table 1: Internal series Resistors RINT
V0-NOM [V]
3.3
2.5
2.0
1.8
1.5
1.2
1.0
0.9
RINT [kΩ]
59
78.7
100
100
100
59
30.1
5.11
To trim down the output voltage (Fig. F), a trim resistor, RT-DECR, should be connected between the TRIM pin (Pin 3) and
SENSE pin (Pin 2), with a value of:
For VO-NOM ≥ 1.2 V,
− 𝟎.𝟖) ∗ 𝟑𝟎.𝟏
RTDECR =((𝐕𝐕𝐎−𝐑𝐄𝐐
– RINT
𝐎−𝐍𝐎𝐌 − 𝐕𝐎−𝐑𝐄𝐐)
[kΩ]
For VO-NOM = 1.0 V, 0.9 V,
− 𝟎.𝟕) ∗ 𝟑𝟎.𝟏
RTDECR =((𝐕𝐕𝐎−𝐑𝐄𝐐
– RINT
𝐎−𝐍𝐎𝐌 − 𝐕𝐎−𝐑𝐄𝐐)
where,
[kΩ]
RTDECR = Required value of trim-down resistor [kΩ]
Fig. F: Configuration for Decreasing Output Voltage.
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Standard 1% and 5% resistors can be used for trimming. Ground pin of the trim resistor should be connected directly
to the module GND pin (Pin5) with no voltage drop in between.
The output voltage can be trimmed up or down using an external voltage source:
For VO-NOM ≥ 1.2 V,
VTRIM = 0.8 -
(𝐕𝐎−𝐑𝐄𝐐 − 𝐕𝐎−𝐍𝐎𝐌)∗ 𝐑𝐈𝐍𝐓
30.1
[V]
For VO-NOM = 1.0 V, 0.9 V,
VTRIM = 0.7 -
(𝐕𝐎−𝐑𝐄𝐐 − 𝐕𝐎−𝐍𝐎𝐌)∗ 𝐑𝐈𝐍𝐓
30.1
[V]
where, VTRIM = Output voltage applied to TRIM pin (referenced to GND) [V]
The trim equations for the converters with VO-NOM ≥1.2 V are industry standard; thus allowing easy second sourcing.
Input undervoltage lockout is standard with this converter. The converter will shut down when the input voltage
drops below a pre-determined voltage; it will start automatically when Vin returns to a specified range.
The input voltage must be typically 2.05 V for the converter to turn on. Once the converter has been turned on, it
will shut off when the input voltage drops below typically 1.9 V.
The converter is protected against overcurrent and short circuit conditions. Upon sensing an overcurrent condition, the
converter will enter hiccup mode. Once an over-load or short circuit condition is removed, Vout will return to nominal
value.
The converter will shut down under an overtemperature condition to protect itself from overheating caused by operation
outside the thermal derating curves, or operation in abnormal conditions such as system fan failure. After the converter
has cooled to a safe operating temperature, it will automatically restart.
The converter meets North American and International safety regulatory requirements per UL60950 and EN60950. The
maximum DC voltage between any two pins is Vin under all operating conditions. Therefore, the unit has ELV (extra
low voltage) output; it meets SELV requirements under the condition that all input voltages are ELV.
The converter is not internally fused. To comply with safety agencies’ requirements, a recognized fuse with a maximum
rating of 20 Amps must be used in series with the input line.
The converter has been characterized for many operational aspects, to include thermal derating (maximum load current as
a function of ambient temperature and airflow) for vertical and horizontal mountings, efficiency, startup and shutdown
parameters, output ripple and noise, transient response to load step-change, overload, and short circuit.
The figures are numbered as Fig. x.y, where x indicates the different output voltages, and y associates with specific
plots (y = 1 for the vertical thermal derating, …). For example, Fig. x.1 will refer to the vertical thermal derating for all the
output voltages in general.
The following pages contain specific plots or waveforms associated with the converter. Additional comments for specific
data are provided below.
All data presented were taken with the converter soldered to a test board, specifically a 0.060” thick printed wiring
board (PWB) with four layers. The top and bottom layers were not metalized. The two inner layers, comprised of twoounce copper, were used to provide traces for connectivity to the converter.
The lack of metalization on the outer layers as well as the limited thermal connection ensured that heat transfer from
the converter to the PWB was minimized. This provides a worst-case but consistent scenario for thermal derating
purposes.
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All measurements requiring airflow were made in the vertical and horizontal wind tunnels using Infrared (IR)
thermography and thermocouples for thermometry.
Ensuring components on the converter do not exceed their ratings is important to maintaining high reliability. If one
anticipates operating the converter at or close to the maximum loads specified in the derating curves, it is prudent to
check actual operating temperatures in the application. Thermographic imaging is preferable; if this capability is not
available, then thermocouples may be used. The use of AWG #40 gauge thermocouple is recommended to ensure
measurement accuracy. Careful routing of the thermocouple leads will further minimize measurement error. Refer to Fig.
G for the optimum measuring thermocouple location.
Fig. G: Location of the Thermocouple for Thermal Testing.
Load current vs. ambient temperature and airflow rates are given in Figs. x.1 and Figs. x.2 for maximum temperature
of 110° C. Ambient temperature was varied between 25 ° C and 85 ° C, with airflow rates from 30 to 500 LFM (0.15
m/s to 2.5 m/s), and vertical and horizontal mountings. The airflow during the testing is parallel to the short axis of the
converter, going from pin 1 and pin 6 to pins 2–5.
For each set of conditions, the maximum load current is defined as the lowest of:
(i)
The output current at which any MOSFET temperature does not exceed a maximum specified temperature
(110° C) as indicated by the thermographic image, or
(ii)
The maximum current rating of the converter (10 A).
During normal operation, derating curves with maximum FET temperature less than or equal to 110 ° C should not be
exceeded. Temperature on the PCB at the thermocouple location shown in Fig. G should not exceed 110 ° C in order
to operate inside the derating curves.
Fig. x.3 shows the efficiency vs. load current plot for ambient temperature of 25 º C, airflow rate of 200 LFM (1 m/s),
and input voltages of 4.5 V, 5.0 V, and 5.5 V.
Fig. x.4 shows the power dissipation vs. load current plot for Ta = 25 º C, airflow rate of 200 LFM (1 m/s) with vertical
mounting and input voltages of 4.5 V, 5.0 V, and 5.5 V.
The output voltage ripple waveform is measured at full rated load current. Note that all output voltage waveforms are
measured across a 1 μF ceramic capacitor.
The output voltage ripple and input reflected-ripple current waveforms are obtained using the test setup shown in Fig.
H.
Fig. H: Test Setup for Measuring Input Reflected-ripple Currents, is and Output Voltage Ripple
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Fig. 3.3V.1: Available load current vs. ambient temperature
and airflow rates for YNL05S10033 converter mounted
vertically with Vin = 5 V, and maximum MOSFET temperature
≤ 110 ° C.
Fig. 3.3V.2: Available load current vs. ambient temperature
and airflow rates for YNL05S10033 converter mounted
horizontally with Vin = 5 V, and maximum MOSFET
temperature ≤ 110 ° C.
Fig. 3.3V.3: Efficiency vs. load current and input voltage for
YNL05S10033 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
Fig. 3.3V.4: Power Loss vs. load current and input voltage for
YNL05S10033 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
Fig. 3.3V.5: Turn-on transient (YNL05S10033) with the
application of Enable signal at full rated load current
(resistive) and 47 μF external capacitance at Vin = 5 V. Top
trace: Enable signal (2 V/div.); Bottom trace: output voltage
(1 V/div.); Time scale: 2 ms/div.
Fig. 3.3V.6: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
47 μF ceramic + 1 μF ceramic and Vin = 5 V (YNL05S10033)
Time scale: 2 μs/div.
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Fig. 3.3V.7: Output voltage (YNL05S10033) to positive load
current step change from 5 A to 10 A with slew rate of 5 A/μs
at Vin = 5 V. Top trace: output voltage (100 mV/div.); Bottom
trace: load current (5 A/div.). Co = 47 μF ceramic + 1 μF
ceramic. Time scale: 20 μs/div.
Fig. 3.3V.8: Output voltage response (YNL05S10033) to
negative load current step change from 10 A to 5 A with slew
rate of -5 A/μs at Vin = 5 V. Top trace: output voltage
(100 mV/div.); Bottom trace: load current (5 A/div.). Co =
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
Fig. 2.5V.1: Available load current vs. ambient temperature
and airflow rates for YNL05S10025 converter mounted
vertically with Vin = 5 V, and maximum MOSFET temperature
≤ 110 ° C.
Fig. 2.5V.2: Available load current vs. ambient temperature
and airflow rates for YNL05S10025 converter mounted
horizontally with Vin = 5 V, and maximum MOSFET
temperature ≤ 110 ° C.
Fig. 2.5V.3: Efficiency vs. load current and input voltage for
YNL05S10025 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
Fig. 2.5V.4: Efficiency vs. load current and input voltage for
YNL05S10025 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
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Fig. 2.5V.5: Turn-on transient (YNL05S10025) with the
application of Enable signal at full rated load current
(resistive) and 47 μF external capacitance at Vin = 5 V. Top
trace: Enable signal (2 V/div.); Bottom trace: output voltage
(1 V/div.); Time scale: 2 ms/div
Fig. 2.5V.6: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
47 μF ceramic + 1 μF ceramic and Vin = 5 V (YNL05S10025)
Time scale: 2 μs/div.
Fig. 2.5V.7: Output voltage response (YNL05S10025) to
positive load current step change from 5 A to 10 A with slew
rate of 5 A/μs at Vin = 5 V. Top trace: output voltage
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
Fig. 2.5V.8: Output voltage response (YNL05S10025) to
negative load current step change from 10 A to 5 A with slew
rate of - 5 A/μs at Vin = 5 V. Top trace: output voltage
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
Fig. 2.0V.1: Available load current vs. ambient temperature
and airflow rates for YNL05S10020 converter mounted
vertically with Vin = 5 V, and maximum MOSFET temperature
≤110 ° C.
Fig. 2.0V.2: Available load current vs. ambient temperature
and airflow rates for YNL05S10020 converter mounted
horizontally with Vin = 5 V, and maximum MOSFET
temperature ≤110 ° C.
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Fig. 2.0V.3: Efficiency vs. load current and input voltage for
YNL05S10020 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
Fig. 2.0V.4: Efficiency vs. load current and input voltage for
YNL05S10020 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
Fig. 2.0V.5: Turn-on transient (YNL05S10020) with the
application of Enable signal at full rated load current
(resistive) and 47 μF external capacitance at Vin = 5 V. Top
(500 mV/div.); Time scale: 2 ms/div.
Fig. 2.0V.6: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
47 μF ceramic + 1 μF ceramic and Vin = 5 V (YNL05S10020).
Time scale: 2 μs/div.
Fig. 2.0V.7: Output voltage response (YNL05S10020) to
positive load current step change from 5 A to 10 A with slew
rate of 5 A/μs at Vin = 5 V. Top trace: output voltage
(100 mV/div.); Bottom trace: load current (5 A/div.). Co =
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
Fig. 2.0V.8: Output voltage response (YNL05S10020) to
negative load current step change from 10 A to 5 A with slew
(100 mV/div.); Bottom trace: load current (5 A/div.). Co =
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
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Fig. 1.8V.1: Available load current vs. ambient temperature
and airflow rates for YNL05S10018 converter mounted
vertically with Vin = 5 V, and maximum MOSFET temperature
≤110 ° C.
Fig. 1.8V.2: Available load current vs. ambient temperature
and airflow rates for YNL05S10018 converter mounted
horizontally with Vin = 5 V, and maximum MOSFET
temperature ≤110 ° C.
Fig. 1.8V.3: Efficiency vs. load current and input voltage for
YNL05S10018 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
Fig. 1.8V.4: Efficiency vs. load current and input voltage for
YNL05S10018 converter mounted vertically with air flowing a
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
Fig. 1.8V.5: Turn-on transient (YNL05S10018) with the
application of Enable signal at full rated load current
(resistive) and 47 μF external capacitance at Vin = 5 V. Top
trace: Enable signal (2 V/div.); Bottom trace: output voltage
(500 mV/div.); Time scale: 2 ms/div.
Fig. 1.8V.6: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
47 μF ceramic + 1 μF ceramic and Vin = 5 V (YNL05S10018).
Time scale: 2 μs/div.
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BCD.00623_AA
Fig. 1.8V.7: Output voltage response (YNL05S10018) to
positive load current step change from 5 A to 10 A with slew
rate of 5 A/μs at Vin = 5 V. Top trace: output voltage
(100 mV/div.); Bottom trace: load current (5 A/div.). Co =
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
Fig. 1.8V.8: Output voltage response (YNL05S10018) to
negative load current step change from 10 A to 5 A with slew
rate of -5 A/μs at Vin = 5 V. Top trace: output voltage
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
Fig. 1.5V.1: Available load current vs. ambient temperature
and airflow rates for YNL05S10015 converter mounted
vertically with Vin = 5 V, and maximum MOSFET temperature
≤110 ° C.
Fig. 1.5V.2: Available load current vs. ambient temperature
and airflow rates for YNL05S10015 converter mounted
horizontally with Vin = 5 V, and maximum MOSFET
temperature ≤110 ° C.
Fig. 1.5V.3: Efficiency vs. load current and input voltage for
YNL05S10015 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C..
Fig. 1.5V.4: Efficiency vs. load current and input voltage for
YNL05S10015 converter mounted vertically with air flowing
at a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
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BCD.00623_AA
Fig. 1.5V.5: Turn-on transient (YNL05S10015) with the
application of Enable signal at full rated load current
(resistive) and 47 μF external capacitance at Vin = 5 V. Top
trace: Enable signal (2 V/div.); Bottom trace: output voltage
(500 mV/div.); Time scale: 2 ms/div.
Fig. 1.5V.6: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
47 μF ceramic + 1 μF ceramic and Vin = 5 V (YNL05S10015).
Time scale: 2 μs/div.
Fig. 1.5V.7: Output voltage response (YNL05S10015) to
positive load current step change from 5 A to 10 A with slew
rate of 5 A/μs at Vin = 5 V. Top trace: output voltage
(100 mV/div.); Bottom trace: load current (5 A/div.). Co =
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
Fig. 1.5V.8: Output voltage response (YNL05S10015) to
negative load current step change from 10 A to 5 A with slew
rate of -5 A/μs at Vin = 5 V. Top trace: output voltage
(100 mV/div.); Bottom trace: load current (5 A/div.). Co =
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div
Fig. 1.2V.1: Available load current vs. ambient temperature
and airflow rates YNL05S10012 converter mounted vertically
with Vin = 5 V, and maximum MOSFET temperature≤110 ° C.
Fig. 1.2V.2: Available load current vs. ambient temperature
and airflow rates for YNL05S10012 converter mounted
horizontally with Vin = 5 V, and maximum MOSFET
temperature≤110 ° C.
866.513.2839
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© 2015 Bel Power Solutions, inc.
BCD.00623_AA
Fig. 1.2V.3: Efficiency vs. load current and input voltage for
YNL05S10012 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25° C.
Fig. 1.2V.4: Efficiency vs. load current and input voltage for
YNL05S10012 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25° C.
Fig. 1.2V.5: Turn-on transient (YNL05S10012) with the
application of Enable signal at full rated load current
(resistive) and 47 μF external capacitance at Vin = 5 V. Top
trace: Enable signal (2 V/div.); Bottom trace: output voltage
(500 mV/div.); Time scale: 2 ms/div.
Fig. 1.2V.6: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
47 μF ceramic + 1 μF ceramic and Vin = 5 V (YNL05S10012).
Time scale: 2 μs/div.
Fig. 1.2V.6: Output voltage response (YNL05S10012) to
positive load current step change from 5 A to 10 A with slew
rate of 5 A/μs at Vin = 5 V. Top trace: output voltage
(100 mV/div.); Bottom trace: load current (5 A/div.). Co =
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
Fig. 1.2V.8: Output voltage response (YNL05S10012) to
negative load current step change from 10 A to 5 A with slew
rate of -5 A/μs at Vin = 5 V. Top trace: output voltage
(100 mV/div.); Bottom trace: load current (5 A/div.). Co =
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
866.513.2839
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BCD.00623_AA
Fig. 1.0V.1: Available load current vs. ambient temperature
and airflow rates YNL05S10010 converter mounted vertically
with Vin = 5 V, and maximum MOSFET temperature ≤110 ° C.
Fig. 1.0V.2: Available load current vs. ambient temperature
and airflow rates for YNL05S10010 converter mounted
horizontally with Vin = 5 V, and maximum MOSFET
temperature ≤110 ° C.
Fig. 1.0V.3: Efficiency vs. load current and input voltage for
YNL05S10010 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
Fig. 1.0V.4: Efficiency vs. load current and input voltage for
YNL05S10010 converter mounted vertically with air flowing at
a rate of 200 LFM (1 m/s) and Ta = 25 ° C.
Fig. 1.0V.5: Turn-on transient (YNL05S10010) with the
application of Enable signal at full rated load current
(resistive) and 47 μF external capacitance at Vin = 5 V. Top
trace: Enable signal (2 V/div.); Bottom trace: output voltage
(500 mV/div.); Time scale: 2 ms/div.
Fig. 1.0V.6: Output voltage ripple (20 mV/div.) at full rated
load current into a resistive load with external capacitance
47 μF ceramic + 1 μF ceramic and Vin = 5 V (YNL05S10010).
Time scale: 2 μs/div.
866.513.2839
tech.support@psbel.com
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© 2015 Bel Power Solutions, inc.
BCD.00623_AA
Fig. 1.0V.7: Output voltage response (YNL05S10010) to
positive load current step change from 5 A to 10 A with slew
rate of 5 A/μs at Vin = 5 V. Top trace: output voltage
(100 mV/div.); Bottom trace: load current (5 A/div.). Co =
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
Fig. 1.0V.8: Output voltage response (YNL05S10010) to
negative load current step change from 10 A to 5 A with slew
rate of -5 A/μs at Vin = 5 V. Top trace: output voltage
47 μF ceramic + 1 μF ceramic. Time scale: 20 μs/div.
YNL05S Pinout (Surface-mount)
Pad/Pin Connections
Pad/Pin #
Function
1
ON/OFF
2
SENSE
3
TRIM
4
Vout
5
GND
6
Vin
YNL05S Platform Notes
All dimensions are in inches [mm]
Connector Material: Copper
Connector Finish: Gold over Nickel
Converter Weight: 0.22 oz [6.12 g]
Converter Height: 0.327” Max., 0.301” Min.
Recommended surface-mount pads: Min. 0.080”
X 0.112” [2.03 x 2.84]
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© 2015 Bel Power Solutions, inc.
BCD.00623_AA
Product
Series
Input
Voltage
Mounting
Scheme
Rated Load
Current
Output Voltage
YNL
05
S
10
033
Enable Logic
–
Special Feature
Environmental
0
Y-Series
3.0 – 5.5 V
S
Surfacemount
10 A
009 0.9 V
010 1.0 V
0121.2 V
015 1.5 V
018 1.8 V
020 2.0 V
025 2.5 V
033 3.3 V
0
Standard
(Positive Logic)
D
Opposite of
Standard
(Negative Logic)
No Trim Pin
Option
2
No Remote
Sense Pin Option
3
No Trim &
Remote Sense Pin
Option
No Suffix
RoHS
lead-solderexemption
compliant
G RoHS
compliant for all
six substances
The example above describes P/N YNL05S10033-0: 3.0 – 5.5 V input, surface-mount, 10 A @ 3.3 V output, standard enable logic, and
Eutectic Tin/Lead solder1. Please consult factory for the complete list of available options.
Note: The TRIM and/or SENSE pin will not be populated depending on the selected special feature “01”, “02” or “03”.
Model numbers and ROHS highlighted in yellow or shaded are not recommended for new designs.
NUCLEAR AND MEDICAL APPLICATIONS - Products are not designed or intended for use as critical components in life support systems, equipment used in
hazardous environments, or nuclear control systems.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the date
manufactured. Specifications are subject to change without notice.
866.513.2839
tech.support@psbel.com
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© 2015 Bel Power Solutions, inc.
BCD.00623_AA
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