MITSUBISHI Nch POWER MOSFET
e. tion. cifica t to chang c al spe t a fins are subje o is is nic limit e: Th tr Notice parame Som
P
MIN RELI
ARY
FS12KMA-4A
HIGH-SPEED SWITCHING USE
FS12KMA-4A
OUTLINE DRAWING
10 ± 0.3
6.5 ± 0.3 3 ± 0.3
Dimensions in mm 2.8 ± 0.2
15 ± 0.3
φ 3.2 ± 0.2
14 ± 0.5
3.6 ± 0.3
1.1 ± 0.2 1.1 ± 0.2 0.75 ± 0.15
0.75 ± 0.15
2.54 ± 0.25
2.54 ± 0.25
4.5 ± 0.2
2.6 ± 0.2
q 10V DRIVE q VDSS ............................................................................... 200V q rDS (ON) (MAX) ............................................................. 0.40Ω q ID ......................................................................................... 12A
GATE DRAIN SOURCE
TO-220FN
APPLICATION CS Switch for CRT Display monitor, Switch mode power supply, etc.
MAXIMUM RATINGS
Symbol VDSS VGSS ID IDM IDA PD Tch Tstg Viso —
(Tc = 25°C)
Parameter Drain-source voltage Gate-source voltage Drain current Drain current (Pulsed) Avalanche drain current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Isolation voltage Weight VGS = 0V VDS = 0V
Conditions
Ratings 200 ±20 12 36 12 32 –55 ~ +150 –55 ~ +150 2000 2.0
Unit V V A A A W °C °C V g Sep.1998
L = 200µH
AC for 1minute, Terminal to case Typical value
MITSUBISHI Nch POWER MOSFET
e. tion. cifica t to chang c al spe t a fins are subje o is is nic limit e: Th tr Notice parame Som
P
MIN RELI
ARY
FS12KMA-4A
HIGH-SPEED SWITCHING USE
ELECTRICAL CHARACTERISTICS
Symbol V (BR) DSS V (BR) GSS IGSS IDSS VGS (th) rDS (ON) VDS (ON) yfs Ciss Coss Crss td (on) tr td (off) tf VSD Rth (ch-c) Parameter Drain-source breakdown voltage Gate-source breakdown voltage Gate-source leakage current Drain-source leakage current
(Tch = 25°C)
Test conditions ID = 1mA, VGS = 0V IGS = ±10µA, VDS = 0V VGS = ±20V, VDS = 0V VDS = 200V, VGS = 0V ID = 1mA, VDS = 10V ID = 6A, VGS = 10V ID = 6A, VGS = 10V ID = 6A, VDS = 10V VDS = 25V, VGS = 0V, f = 1MHz
Limits Min. 200 ±20 — — 2.0 — — — — — — — — — — — — Typ. — — — 3.0 0.30 1.80 8.0 700 95 30 15 20 110 35 0.95 — Max. — ±10 1 4.0 0.40 2.40 — — — — — — — — — 3.91
Unit V V µA mA V Ω V S pF pF pF ns ns ns ns V °C/W
Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance
VDD = 100V, ID = 6A, VGS = 10V, RGEN = RGS = 50Ω
IS = 6A, VGS = 0V Channel to case
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE 40 POWER DISSIPATION PD (W) DRAIN CURRENT ID (A) MAXIMUM SAFE OPERATING AREA
5 3 2
32
101
7 5 3 2
tw = 10µs 100µs 1ms 10ms DC Single Pulse
24
16
100
7 5 3 2
8
10–1 TC = 25°C 0 0 50 100 150 200
7 5
2 3 5 7 101 2 3 5 7 102 2 3 5 7 103 2
CASE TEMPERATURE TC (°C)
DRAIN-SOURCE VOLTAGE VDS (V)
OUTPUT CHARACTERISTICS (TYPICAL) 20
VGS = 20V 10V 8V 6V
OUTPUT CHARACTERISTICS (TYPICAL) 10
VGS = 20V 10V 8V
DRAIN CURRENT ID (A)
16
DRAIN CURRENT ID (A)
8
4.5V
5V
12
TC = 25°C Pulse Test 4V
6
PD = 32W
8
PD = 32W
4
4.0V
4
2
TC = 25°C Pulse Test
0
0
4
8
12
16
20
0
0
2
4
6
8
10
DRAIN-SOURCE VOLTAGE VDS (V)
DRAIN-SOURCE VOLTAGE VDS (V) Sep.1998
MITSUBISHI Nch POWER MOSFET
e. tion. cifica t to chang c al spe t a fins are subje o is is nic limit e: Th tr Notice parame Som
P
MIN RELI
ARY
FS12KMA-4A
HIGH-SPEED SWITCHING USE
ON-STATE RESISTANCE VS. DRAIN CURRENT (TYPICAL) 0.5
DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (Ω)
TC = 25°C Pulse Test
ON-STATE VOLTAGE VS. GATE-SOURCE VOLTAGE (TYPICAL) 20
DRAIN-SOURCE ON-STATE VOLTAGE VDS (ON) (V)
TC = 25°C Pulse Test
16
0.4
12
ID = 18A
0.3
VGS = 10V 20V
8
0.2
4
12A 6A
0.1 0 10–1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102 DRAIN CURRENT ID (A)
0
0
4
8
12
16
20
GATE-SOURCE VOLTAGE VGS (V)
TRANSFER CHARACTERISTICS (TYPICAL) 20
5 4 3
FORWARD TRANSFER ADMITTANCE VS. DRAIN CURRENT (TYPICAL)
VDS = 10V Pulse Test TC = 25°C 75°C 125°C
DRAIN CURRENT ID (A)
FORWARD TRANSFER ADMITTANCE yfs (S)
TC = 25°C VDS = 10V Pulse Test
16
2
12
101
7 5 4 3 2
8
4
100
7 5
0
0
4
8
12
16
20
100
2
3 4 5 7 101
2
3 4 5 7 102
GATE-SOURCE VOLTAGE VGS (V)
DRAIN CURRENT ID (A)
CAPACITANCE VS. DRAIN-SOURCE VOLTAGE (TYPICAL) 104
7 5 3 2 2
SWITCHING CHARACTERISTICS (TYPICAL)
td(off)
102
SWITCHING TIME (ns)
7 5 4 3 2 tf
CAPACITANCE Ciss, Coss, Crss (pF)
103
7 5 3 2
Ciss
tr
102
7 5 3 TCh = 25°C 2 f = 1MHZ VGS = 0V 2 3 4 5 7 101 2
Coss Crss
101 td(on)
7 5 4 3 2 TCh = 25°C VDD = 100V VGS = 10V RGEN = RGS = 50Ω 2 3 4 5 7 101 2 3 4 5 7 102
101 0 10
3 4 5 7 102
100
DRAIN-SOURCE VOLTAGE VDS (V)
DRAIN CURRENT ID (A) Sep.1998
MITSUBISHI Nch POWER MOSFET
e. tion. cifica t to chang c al spe t a fins are subje o is is nic limit e: Th tr Notice parame Som
P
MIN RELI
ARY
FS12KMA-4A
HIGH-SPEED SWITCHING USE
SOURCE-DRAIN DIODE FORWARD CHARACTERISTICS (TYPICAL) 20
SOURCE CURRENT IS (A)
VGS = 0V Pulse Test
GATE-SOURCE VOLTAGE VS. GATE CHARGE (TYPICAL)
GATE-SOURCE VOLTAGE VGS (V)
20
TCh = 25°C ID = 12A
16
16
12
VDS = 50V 100V 150V
12
8
8
TC = 125°C 75°C 25°C
4
4
0
0
20
40
60
80
100
0
0
0.8
1.6
2.4
3.2
4.0
GATE CHARGE Qg (nC)
SOURCE-DRAIN VOLTAGE VSD (V)
DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (25°C)
DRAIN-SOURCE ON-STATE RESISTANCE rDS (ON) (t°C)
ON-STATE RESISTANCE VS. CHANNEL TEMPERATURE (TYPICAL) 101
VGS = 10V 7 ID = 6A 5 Pulse Test 3 2
THRESHOLD VOLTAGE VS. CHANNEL TEMPERATURE (TYPICAL) 5.0
GATE-SOURCE THRESHOLD VOLTAGE VGS (th) (V)
VDS = 10V ID = 1mA
4.0
3.0
100
7 5 3 2
2.0
1.0
10–1
–50
0
50
100
150
0
–50
0
50
100
150
CHANNEL TEMPERATURE Tch (°C)
CHANNEL TEMPERATURE Tch (°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V (BR) DSS (25°C)
TRANSIENT THERMAL IMPEDANCE Zth (ch – c) (°C/ W)
DRAIN-SOURCE BREAKDOWN VOLTAGE V (BR) DSS (t°C)
BREAKDOWN VOLTAGE VS. CHANNEL TEMPERATURE (TYPICAL) 1.4
VGS = 0V ID = 1mA
TRANSIENT THERMAL IMPEDANCE CHARACTERISTICS 101
7 5 D = 1.0 3 0.5 2 0.2 7 0.1 5 3 2 0.05 0.02 0.01 Single Pulse PDM
tw T D= tw T
1.2
100
1.0
0.8
10–1
7 5 3 2
0.6
0.4
–50
0
50
100
150
10–2 –4 10 2 3 5 710–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102 PULSE WIDTH tw (s) Sep.1998
CHANNEL TEMPERATURE Tch (°C)
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